Setting Up. IC-CAP WaferPro. For On-Wafer Measurements

Setting Up IC-CAP WaferPro For On-Wafer Measurements franz.sischka@agilent.com 22.6.2011 Copyright Agilent Technologies 2011 1

Contents - What Is WaferPro - A Typical Lab Environment For WaferPro - The WaferPro User Interface Concept - WaferPro Measurement Data Structure - Setting Up A Test Plan For A Demo Wafer - WaferPro And S-Parameters Conclusions 2

What is WaferPro? It is an IC-CAP Module, with a specific user interface, on top of the IC-CAP Framework, which > sets the ThermoChuck temperature > controls the prober and provides the Probes/ProbeCard contact > switches the matrix and then lets the user apply all kinds of measurements, applying all the flexibility of a standard IC-CAP session. It outputs the measurement data in a directory/file structure (.mdm), or into a SQL data base (next IC-CAP release). 3

IC-CAP WaferPro Architecture Overview Start WaferPro see also the next slide... IC-CAP Environment (wprolibrary.mdl) WaferPro User Interface (myproject.xml) 4

IC-CAP WaferPro Architecture Overview (cont'd) The WaferPro Module consists of 3 parts: -> ModelFile 'Routine' (DUTs/Setups with DC,CV, Spar Measurement Tasks) -> ModelFile 'Driver' (control of WaferProber, Matrix, ThermoChuck) IC-CAP Product Numbers: -> WaferPro User Interface (GUI) W8510EP WaferPro 85199A IC-CAP Framework 85199D DC Drivers 85199C CV Drivers 85199E NWA Drivers (optional) 85199B Simul.Interface (optional) 1.) User Interface 2.) Wafer Prober Switching Matrix Thermochuck 3.) Measurement Setups Notes: the module W8510EP requires an existing IC-CAP installation, while the Bundle W8511BP includes modules 85199A, 85199C, 85199D, 85199E, W8510EP, i.e. a complete IC-CAP. 5

IC-CAP and therefore also WaferPro distinguish between 'real' measurement instruments (ModelFile 'Routine') e.g. DC analyzer, CV meter etc. and auxiliary instruments (ModelFile 'Driver') like ThermoChuck, WaferProber and SwitchingMatrix if required, add here drivers for you prober, matrix, chuck if required, add here your measurement setups 6

A Typical Lab Environment for WaferPro WaferPro Individual Measurement Benches with different Probers/Matrices/Instruments Production Bench Prober Fully Automated Prober (incl. Wafer Cassette) Matrix CV Meter DC Analyzer DC&CV Parametric Test System incl. Switching Matrix Page 8 8

WaferPro allows to apply your Test Plan to any available Bench, by simply selecting the Bench Name Bench1 Bench 2 Bench 3 Bench1 Bench2 Bench3... in other words... you can apply your Test Plan without any changes, immediately to any of your Benches! 9

... another application of WaferPro is when you have older GPIB-controlled wafer probers, but no state-of-the-art, common user interface available... 10

The WaferPro User Interface Concept which device types (diodes, transistors, resistors etc.) which measurement system to use? what is available on the wafer? which meas.candidates? which bias conditions? define the test plan: group meas. candidates and conditions Go! Meas.Results.mdm or Database 12

Step by step... Bench1 Bench 2 Bench 3 Select which Bench to use 13

Enter the Wafer Geometry and the Die size Specify the Subsites Set up the Device Definition Table 14

Setting Up the Test Plan Setting Up the Test Plan in WaferPro means - define what is available (devices and their meas. types and meas. conditions) - build groups of tasks - perform the wafer test 15

3. 2. 1. In the following slides, we will discuss the definitions of the test possibilities, 1. 2. 3. followed by setting up groups of tasks, to be performed during the 'Test Plan Run' 16

1. lists of dies 1. 17

lists of subsite devices lists of dies 2. 2. 18

list of meas. routines 3. lists of meas. conditions for the meas. routines lists of meas ranges lists of dies lists of subsite devices 3. 19

list of meas. routines lists of meas. conditions for the meas. routines lists of meas ranges lists of dies lists of subsite devices build lists of devices, measurements types meas. conditions 20

list of meas. routines lists of meas. conditions for the meas. routines lists of meas ranges lists of dies lists of subsite devices build lists of devices, measurements types meas. conditions build lists of wafer(s), temperature, target dies and characterization steps 21

GO! 22

Lot Wafers Dies Technology Definition Blocks Subsites Devices Wrap-Up WaferPro Flow Measurement Definition Characterization Step Test Plan Sequence: Temp, Wafer, Die List, Characterization Steps Go! 23

WaferPro Measurement Data Structure 25

Setting up a Test Plan for a Demo Wafer A Simple WaferPro Example This and the following slides can be found in $ICCAP_ROOT/WaferPro/examples/documentation_pdf/1_WaferPro_GettingStarted_2011-03-07.pdf The corresponding WaferPro file is: $ICCAP_ROOT/WaferPro/examples/myDemoProject1 MOS_Diode DC_CV.xml 27

Describing the Wafer(s), Dies and Devices in the WaferPro GUI... 28

Selecting Our Demo Bench Note for IC-CAP users: this selection specifies the IC-CAP 'mydemo_4142_4275.hdw' file plus in the WaferPro wprobenchlist.cfg file the entry 'mydemo_4142_4275' 29

Verifying/Defining the Measurement Setups in the IC-CAP environment... 30

- In the IC-CAP ModelFile 'Routine', we define a group (DUT) called 'my_mos_dc_basics' and a group (DUT) 'my_diode_dc_cv_basic'. - We can add as many Setups to each group, depending on our planned measurements. The only prerequisite is to have the 3 Specific-Names-Transforms defined. These 3 Transforms are the jumping points for WaferPro IMPORTANT WaferPro FEATURE: Your PEL Programs can communicate with the WaferPro settings, applying the PEL Functions - WPro_set_info(): PEL -> WaferPro - WPro_lookup_info(): WaferPro -> PEL 31

Routine ModelFile WaferPro For the measurement conditions, we apply variables, which are set by WaferPro. This allows to re-use our Setups for different technologies 32

Our Demo Wafer 5 inch (=127mm diameter) Die 15mm x 16mm 16mm 15mm Wafer Orientation Flat Subsite (probe card contact) 33

Entering the Demo Wafer Details into WaferPro 34

The Dies and their Subsites on our Demo Wafer MOS1 Subsite x=0mm, y=12mm 15mm 16mm Diode1 Subsite x=9mm, y=11mm Wafer Flat Orientation 35

Defining the Die Subsites locations in WaferPro 36

MOS1 subsite (3 NMOS & 1 PMOS & 1 CV structure) 120um 35um 120um 130um 1 3 5 7 9 11 13 15 17 A B C D 19 21 23 Substrate (Bulk) 370um 2 4 6 8 10 12 14 16 18 20 22 24 MOSFET Width Length Type A 1um 500nm N B 1um 250nm N C 250nm 500nm N D 250nm 250nm P 37

Diode1 subsite (2 devices, DC & CV measurement) 120um 35um 120um 1 3 5 7 9 11 13 15 17 19 21 23 130um Diode_A Substrate (Bulk) 370um 2 4 6 8 10 12 14 16 18 20 22 24 38

Setting Up the Device Definition Tables (pins, geometry, polarity, etc.) 39

Defining Lists of Die Test Candidates tbd 40

Defining Lists of Subsite Test Candidates 41

Defining Lists of Measurement Conditions Note: you can apply the same test (the IC-CAP Setup in ModelFile 'Routine') to different technologies! 42

From the previously defined information, build Lists of Subsites, how to Measure then and what Meas. Limits to apply 43

Finally, Setting Up Groups of Tasks from the available Lists 44

Executing the Test Plan 45

Layout Sketch of our Demo Devices and entering this info into the WaferPro GUI y Die 600um ThruDummy Subsites 400um ShortDummy 200um OpenDummy NPN_A 200um NPN_B x 47

If not yet available, add the new Device Type(s) to WaferPro 48

Set Up Measurements in ModelFile /Routine in WaferPro's Modelfile /Routine, add a new DUT, here called 'my_npn_basic' -> like it is best practice with IC-CAP, name the DC and CV nodes after the transistor pin names (e.g. C, B, E, S for a bipolar transistor) and call the Spar nodes P1 and P2. DC Spar Note: we group the transistor and the de-embedding dummies within the same /Routine/DUT, so that we can apply DUT-Variables 'fmin', 'fmax' and 'fpts' for all Spar Setups. 49

Define the fixed SMU connections (SMU<->NWA cabling) in WaferPro enter here your cablings Very Important: The SMU connections defined here will overwrite the ones specified in the /Routine Setups!!! Reason: this allows to switch from bench to bench without manipulating the /Routine Setups!! 50

WaferPro: Sequence Control Make sure to correctly specify the sequence of Char.Steps: first the de-embedding dummies, then the transistors Reason (best practice): When the transistor will be measured, the dummies have been measured already, and we can apply a simple de-embedding without loading first the.mdm files of the de-embedding dummies! 51

For more details, see the documentation in $ICCAP_ROOT/ 52

IC-CAP WaferPro Is An Extremely Powerful Test Plan Suite, For On-Wafer DC/CV And RF Device Modeling Measurements. It supports a variety of thermo chucks, wafer probers, matrices and instruments, including the Agilent parametric testers. Own drivers can be added easily. It includes several built-in measurement routines, which are nevertheless open for users to customize or enhance the measurement and post-processing. It will be compatible with a new IC-CAP Database feature and provide the foundation for advanced Statistical Modeling. 54

Where To Find More Information IC-CAP WaferPro Webpage: http://www.agilent.com/find/eesof-waferpro WaferPro White Paper: http://cp.literature.agilent.com/litweb/pdf/5990-6494en.pdf IC-CAP Device Modeling Software: http://www.agilent.com/find/eesof-iccap Latest IC-CAP Demos see the IC-CAP KnowledgeCenter at: http://edocs.soco.agilent.com/display/eesofkc/demo_features+directory+iccap+(latest+v ersion) Device Modeling Handbook see http://edocs.soco.agilent.com/display/iccapmhb/home 55

Thank you for your attention! 56