LTV-M61 High Speed 1MBit/s TTL Compatible Optocouplers Description The LTV-M61 consists of a high efficient AlGaAs Light Emitting Diode and a high speed optical detector. This design provides excellent AC and DC isolation between the input and output sides of the Optocoupler. The output of the optical detector features an open collector Schottky clamped transistor. The enable function allows the optical detector to be strobed. The internal shield ensures high common mode transient immunity. A guaranteed common mode transient immunity is up to 15,V/µs. The Optocoupler operational parameters are guaranteed over the temperature range from -4 o C ~ +85 o C. Functional Diagram Pin No. and Internal connection diagram 6 5 4 Features SOP5 package High speed 1MBd typical Guaranteed AC and DC performance over temperature -4 o C ~ +85 o C. Internal Shield for High Common Mode Rejection (CMR) LTV-M61: 1KV/us at V CM = 1V LSTTL/TTL Compatible. Strobable output. Safety approval UL/ cul 1577, Cert. No.E113898. 375 Vrms/1 min VDE DIN EN6747-5-5, Cert. No. 138213 V IORM = 567 V peak 1 3 1. Anode 3. Cathode 4. GND 5. Vo (Output) 6. Vcc Truth Table (Positive Logic) LED OUT ON L OFF H A.1µF bypass Capacitor must be connected between Pin4 and Pin6 Application Isolation in line receivers Ground loop elimination Feedback Element in Switching Mode Power Supplier High Speed Logic Ground Isolation TTL/TTL, TTL/CMOS, TTL/LSTTL Pulse transformer replacement Power transistor isolation in motor drives Interface between Microprocessor system, computer and their peripheral Part No. : LTV-M61 (Rev.-A, Mar 13, 213) Page : 1 of 13
Package Dimensions 5-pin SOP Package (LTV-M61) Date Code *1 Factory Code *2. *1. The first digit is year date code, second and third digit is work week *2. Factory identification mark (W :China-CZ) Dimensions are in Millimeters and (Inches). Part No. : LTV-M61 (Rev.-A, Mar 13, 213) Page : 2 of 13
Taping Dimensions LTV-M61 Description Symbol Dimensions in millimeters ( inches ) Tape wide W 12 ±.3 (.63 ) Pitch of sprocket holes P 4 ±.1 (.15 ) Distance of compartment F P2 5.5 ±.1 (.295 ) 2 ±.1 (.79 ) Distance of compartment to compartment P1 8 ±.1 (.472 ) Quantity Per Reel Package Type LTV-M61 Quantities(pcs) 3 Part No. : LTV-M61 (Rev.-A, Mar 13, 213) Page : 3 of 13
Absolute Maximum Ratings*1 Parameter Symbol Min Max Units Note Storage Temperature T ST -4 125 Operating Temperature T A -4 85 o C o C Isolation Voltage V ISO 375 V RMS Supply Voltage V CC 7 V Lead Solder Temperature * 2 26 C 2 Input Average Forward Input Current I F 5 ma Reverse Input Voltage V R 5 V Input Power Dissipation P I 4 mw Output Output Collector Current I O 5 ma Output Collector Voltage V O 7 V Output Collector Power Dissipation P O 85 mw 1.Ambient temperature = 25 o C, unless otherwise specified. Stresses exceeding the absolute maximum ratings can cause permanent damage to the device. Exposure to absolute maximum ratings for long periods of time can adversely affect reliability. 2.26 o C for 1 seconds. Refer to Lead Free Reflow Profile. Part No. : LTV-M61 (Rev.-A, Mar 13, 213) Page : 4 of 13
Electrical Specifications Input Parameters Test Condition Symbol Min Typ Max Units Input Forward Voltage I F = 1mA V F 1.38 1.8 V Input Forward Voltage Temperature Coefficient I F = 1mA V F / T -1.6 mv/ O C Input Reverse Voltage I R = 1µA BV R 5 V Input Threshold Current V CC = 5.5V, V O =.6V I OL (sinking) = 13mA I TH 1.8 (1) 3 ma Input Capacitance f = 1MHz, V F = V C IN 34 pf Detector High Level Supply Current V CC = 5.5V, I F = ma I CCH 6 1 ma Low Level Supply Current V CC = 5.5V, I F = 1mA I CCL 8 13 ma High Level Output Current Low Level Output Voltage V CC = 5.5V, V O = 5.5V, I F = 25µA V CC = 5.5V, I F = 5mA, I OL (sinking) = 13mA I OH 2 1 µa V OL.4.6 V Specified over recommended temperature (T A = -4 o C to +85 o C) unless otherwise specified. Typical values applies to V CC = 5V, T A = 25 o C. See note 1. Part No. : LTV-M61 (Rev.-A, Mar 13, 213) Page : 5 of 13
Switching Specifications Parameter Test Condition Symbol Min Typ Max Units Propagation Delay Time to Low Output Level t PHL 3 75 Propagation Delay Time to High Output Level t PLH 4 75 t Pulse Width Distortion PLH - 1 35 t PHL T A =25 o C (R L =35Ω, C L = 15pF) Propagation Delay Skew t PSK 4 ns Output Rise Time (1 to 9%) t r 21 Output Fall Time (9 to 1%) t f 7 Common Mode Transient Immunity at High Output Level Common Mode Transient Immunity at Low Output Level V CM = 1V, R L = 35Ω, IF = ma T A = 25 o C V CM = 1V, R L = 35Ω, IF=1.mA T A = 25 o C CMH 1 CML 1 Specified over recommended temperature (T A = -4 o C to +85 o C), V CC = 5V, I F = 7.5mA unless otherwise specified. Typical values applies to V CC = 5V, T A = 25 o C. KV/µs Part No. : LTV-M61 (Rev.-A, Mar 13, 213) Page : 6 of 13
Isolation Characteristics Parameter Test Condition Symbol Min Typ Max Units Input-Output Insulation Leakage Current Withstand Insulation Test Voltage 45% RH, t = 5s, V I-O = 3kV DC, T A = 25 o C RH 5%, t = 1min, T A = 25 o C I I-O 1. µa V ISO 375 V Input-Output Resistance V I-O = 5V DC R I-O 1 12 Ω Input-Output Capacitance *All Typical at T A =25 o C f = 1MHz, T A = 25 o C C I-O 1. pf Notes 1. A.1µF or bigger bypass capacitor for V CC is needed as shown in Fig.1 2. Peaking driving circuit may be used to speed up the LED. The peak drive current of LED may go up to 5mA and maximum pulse width 5ns, as long as average current doesn t exceed 2mA. 3. t PLH (propagation delay) is measured from the 3.75 ma point on the falling edge of the input pulse to the 1.5 V point on the rising edge of the output pulse. 4. t PHL (propagation delay) is measured from the 3.75 ma point on the rising edge of the input pulse to the 1.5 V point on the falling edge of the output pulse. 5. The t ELH enable propagation delay is measured from the 1.5 V point on the falling edge of the enable input pulse to the 1.5 V point on the rising edge of the output pulse. 6. The t EHL enable propagation delay is measured from the 1.5 V point on the rising edge of the enable input pulse to the 1.5 V point on the falling edge of the output pulse. 7. CM H is the maximum tolerable rate of rise of the common mode voltage to assure that the output will remain in a high logic state (i.e., VO > 2. V). 8. CM L is the maximum tolerable rate of fall of the common mode voltage to assure that the output will remain in a low logic state (i.e., VO <.8 V). 9. No external pull up is required for a high logic state on the enable input. If the enable pin is not used, tying it to V CC. 1. Device is considered a two-terminal device: pins 1, 2, 3, and 4 shorted together, and pins 5, 6, 7, and 8 shorted together. 11. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage 3 V rms for one second (leakage current less than 5 ua). This test is performed before the 1% production test for partial discharge Part No. : LTV-M61 (Rev.-A, Mar 13, 213) Page : 7 of 13
Switching Time Test Circuit PULSE GEN. Z O tf = t r = 5 ns I F 1 Vcc 6 5.1 uf BYPASS RL +5V VO CL INPUT 3 GND 4 RM ILED IF=7.5mA IF =3.75mA tphl tplh VOUT 1.5V Figure 1: Single Channel Test Circuit for t PHL and t PLH I F VFF B A 1 Vcc 6 5.1 uf BYPASS +5V VO 3 GND 4 VCM + - PULSE GEN. VCM(PEAK) VCM V VO 5V SWITCH AT A: IF =ma CMH VO(MIN) SWITCH AT A: IF =7.5mA VO(MAX) VO.5V CML Figure 2: Single Channel Test Circuit for Common Mode Transient Immunity Part No. : LTV-M61 (Rev.-A, Mar 13, 213) Page : 8 of 13
Typical Performance Curves V F - Forward Voltage - V 1.5 1.45 1.4 1.35 1.3 1.25 Figure 3: Typical Input Diode Forward Characteristics 1.2 5 1 15 2 25 3 I F - Forward Current - ma T A = 25 o C V OL - Low Level Output Voltage - V 6 5 4 3 2 1 Figure 6: Typical Output Voltage vs. Input Forward Current R L = 35Ω R L = 1KΩ R L = 4KΩ 1 2 3 4 5 6 I F - Forward Current - ma V CC = 5.V, T A = 25 o C Figure 4: Typical Input Diode Forward Voltage vs. Ambient Temperature Figure 7: Typical Low Level Output Voltage vs. Ambient Temperature V F - Forward Voltage - V 2 1.8 1.6 I F = 2mA I F = 3mA 1.4 1.2 I F = 2mA I F = 1mA 1 V OL - Low Level Output Voltage - V.6 V CC = 5.5V, V E = 2.V, I F = 5.mA.5 I OL = 16mA I.4 OL = 12.8mA.3.2 I OL = 9.6mA I OL = 6.4mA.1 Figure 5: Typical Input Diode Threshold Current vs. Ambient Temperature Figure 8: Typical Low Level Output Current vs. Ambient Temperature I TH - Input Threshold Current - ma 4. V CC = 5.V, V O =.6V 3.5 R L =35Ω 3. 2.5 R L =1KΩ 2. 1.5 R L =4KΩ 1..5. I OL - Low Level Output Current - ma 7 V CC = 5., V E = 2.V, V OL =.6V 6 5 I F = 1 ~ 15mA 4 I F = 5mA 3 2 Part No. : LTV-M61 (Rev.-A, Mar 13, 213) Page : 9 of 13
Typical Performance Curves t E - Enable Propagation Delay - ns 8 7 6 5 4 3 2 Figure 9: Typical Enable Propagation Delay vs. Ambient Temperature V CC = 5.V V EH = 3.V V EL = V I F = 7.5mA t ELH, R L = 4KΩ t EHL, R L = 35Ω 1 t ELH, R L = 1KΩ, 4KΩ t ELH, R L = 1KΩ t ELH, R L = 35Ω t P - Propagation Delay - ns 8 7 6 5 4 3 2 1 Figure 12: Typical Propagation Delay vs. Input Forward Current V CC = 5.V, T A = 25 o C T PLH, R L = 35Ω T PHL, R L = 35Ω, 1KΩ, 4KΩ 7 8 9 1 11 12 13 14 15 I F - Forward Current - ma T PLH, R L = 4KΩ T PLH, R L = 1KΩ Figure 1: Typical Rise and Fall Time vs. Ambient Temperature Figure 13: Typical Pulse Width Distortion vs. Input Forward Current t R, t F - Rise, Fall Time - ns 3 25 2 15 1 5 V CC = 5.V, I F = 7.5mA t R, R L = 35Ω t R, R L = 1KΩ t R, R L = 4KΩ t F, R L = 35Ω, 1KΩ, 4KΩ Figure 11: Typical Propagation Delay vs. Ambient PWD - Pulse Width Distortion - ns 3 25 2 15 1 5 V CC = 5.V, T A = 25 o C 5 7 9 11 13 15 I F - Forward Current - ma R L = 4KΩ R L = 35Ω R L = 1KΩ Figure 14: Typical Pulse Width Distortion vs. Ambient Temperature t P - Propagation Delay - ns 1 9 V CC = 5.V, I F = 7.5mA T PLH, R L = 4KΩ 8 7 T PLH, R L = 1KΩ 6 T PLH, R L = 35Ω 5 4 3 2 T PHL, R L = 35Ω, 1KΩ, 4KΩ 1 PWD - Pulse Width Distorsion - ns 6 V CC = 5.V, I F = 7.5mA 5 R L = 4KΩ 4 3 R L = 1KΩ 2 R L = 35Ω 1 Part No. : LTV-M61 (Rev.-A, Mar 13, 213) Page : 1 of 13
Temperature Profile Of Soldering Reflow (1) IR Reflow soldering (JEDEC-STD-2C compliant) One time soldering reflow is recommended within the condition of temperature and time profile shown below. Profile item Preheat - Temperature Min (T Smin ) - Temperature Max (T Smax ) - Time (min to max) (ts) Soldering zone - Temperature (T L ) - Time (t L ) Peak Temperature (T P ) Ramp-up rate Ramp-down rate Conditions 15 C 2 C 9±3 sec 217 C 6 ~ 1sec 26 C 3 C / sec max. 3~6 C / sec Ramp-up 2 sec TP 26 C Temperature ( C) Tsmin 15 C TL 217 C Tsmax 2 C 6-1 sec tl (Soldering) Ramp-down 25 C 6 ~ 12 sec ts (Preheat) Time (sec) Part No. : LTV-M61 (Rev.-A, Mar 13, 213) Page : 11 of 13
Temperature Profile Of Soldering Reflow (2) Wave soldering (JEDEC22A111 compliant) One time soldering is recommended within the condition of temperature. Temperature: 26+/-5 C Time: 1 sec. Preheat temperature:25 to 14 C Preheat time: 3 to 8 sec. (3) Hand soldering by soldering iron Allow single lead soldering in every single process. One time soldering is recommended. Temperature: 38+/-5 C Time: 3 sec max. Part No. : LTV-M61 (Rev.-A, Mar 13, 213) Page : 12 of 13
Note: Specifications of the products displayed herein are subject to change without notice. The products shown in this publication are designed for the general use in electronic applications such as office automation equipment, communications devices, audio/visual equipment, electrical instrumentation and application. For equipment/devices where high reliability or safety is required, such as space applications, nuclear power control equipment, medical equipment, etc, please contact our sales representatives. Part No. : LTV-M61 (Rev.-A, Mar 13, 213) Page : 13 of 13