SD38 Low profile power inductors Supersedes November 009 pplications Mobile/smart phones Tablets/e-readers Media players Digital cameras Small LED driver and LCD displays Handheld/mobile equipment Description Low profile shielded drum core Compact footprint utilizes less board space Inductance Range from.0μh to,000μh Current range from 0.083 to.94 amps 3. x 3.mm footprint surface mount package in a.8mm height Ferrite core material Halogen free, lead free, RoHS compliant Environmental Data Storage temperature range (Component): -40 C to +5 C Operating temperature range: -40 C to +5 C (ambient + self-temperature rise) Solder reflow temperature: J-STD-00D compliant Pb HLOGEN HF FREE
SD38 Product Specifications OCL Part Number 6 (μh) Part marking designator I rms (amps) I sat 3 (amps) DCR (Ω) typical @ +0 C K-factor 4 SD38-R0-R.04±30%.0 3.07 0.04 84 SD38-R5-R.44±30% B.8.4 0.05 68 SD38-R-R.±30% C.50.00 0.074 57 SD38-3R3-R 3.36±30% D..59 0. 56 SD38-4R7-R 4.90±30% E.0.3 0.6 39 SD38-6R8-R 6.7±30% F 0.85. 0.3 3 SD38-8R-R 8.±30% G 0.8.0 0.6 9 SD38-0-R.4±30% H 0.75 0.90 0.30 6 SD38-50-R 4.9±30% I 0.6 0.75 0.44 SD38-0-R.5±30% J 0.50 0.6 0.68 8 SD38-330-R 33.±30% K 0.4 0.5 0.99 4 SD38-470-R 47.5±30% L 0.37 0.4. SD38--R ±0% M 0.8 0.77 4.8 6 SD38-33-R 330±0% N 0.46 0.45 7.4 5 SD38-47-R 470±0% O 0.30 0. 9. 4 SD38-68-R 680±0% P 0.7 0. 4 3 SD38--R 999±0% Q 0.087 0.083 3. Open Circuit Inductance (OCL) Test Parameters: 0kHz, 0.Vrms, 0.0dc, @ +5 C. I rms: DC current for an approximate temperature rise of 40 C without core loss. Derating is necessary for C currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 5 C under worst case operating conditions verified in the end application. 3. I sat: Peak current for approximately 30% rolloff @ +0 C 4. K-factor: Used to determine B p-p for core loss (see graph). Bp-p = K * L * ΔI. B p-p: (mtesla), K: (K-factor from table), L: (Inductance in μh), ΔI (Peak to peak ripple current in mps). 5. Part Number Definition: SD38-xxx-R SD38 = Product code and size xxx= Inductance value in uh, R= decimal point, if no R is present then last character equals number of zeros -R suffix = RoHS compliant Dimensions (mm) Pin # indicator.8 max 3.9 max.5 typ Recommended Pad Layout.40 Schematic.70 3. max 3. max 0.8 Part marking: dot for pin indicator (orientation purposes only) xxx = 3 digit marking (first digit indicates inductance value per letter in Part marking designator, second digit is bi-weekly date code, third digit is last digit of year produced) ll soldering surfaces to be coplanar within 0. millimeters PCB tolerances are ±0. millimeters unless stated otherwise Do not route traces or vias underneath the inductor
SD38 Technical Data 4084 Packaging information (mm) Supplied in tape and reel packaging, 4,0 parts per 3 diameter reel.00 4.00.5 Dia. +0./-0.0. Dia. min..75 o = 4.0mm = 0.93mm Bo = 4.0mm B =.5mm Ko =.00mm Ko Bo B 3.4 3.4 5.50.5.0 ±0.3 SECTION - o 8.0 Direction of feed Temperature rise vs. total loss Temperature Rise ( C) 90 80 70 60 50 40 30 0 0 0 0.05 0. 0.5 0. 0.5 0.3 0.35 0.4 0.45 Total Loss(W) 3
SD38 Core loss vs. Bp-p Core Loss (W) 0. 0.0 0.00 MHz 500kHz 300kHz 00kHz 0kHz 50kHz 0.000 0.0000 B p-p (mt) 0 00 Inductance characteristics % % 0% 90% OCL vs. l sat % of L initial 80% 70% 60% 50% 40% 30% 0% -40 C 85 C 5 C % 0% 0% % 0% 30% 40% 50% 60% 70% 80% 90% 0% % % 30% 40% % of l sat 4
SD38 Technical Data 4084 Solder reflow profile T P Max. Ramp Up Rate = 3 C/s Max. Ramp Down Rate = 6 C/s t P T C -5 C Table - Standard SnPb Solder (T c ) Package Thickness mm3 <350 mm3 350 T L Temperature T smax T smin Preheat ts t <.5mm) 35 C 0 C.5mm 0 C 0 C Table - Lead (Pb) Free Solder (T c ) Package Thickness <350 350-000 >000 <.6mm 60 C 60 C 60 C.6.5mm 60 C 50 C 45 C >.5mm 50 C 45 C 45 C 5 C Time 5 C to Peak Time Reference JDEC J-STD-00D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak Temperature min. (T smin ) 0 C 50 C Temperature max. (T smax ) 50 C 00 C Time (T smin to T smax ) (t s ) 60- Seconds 60- Seconds verage ramp up rate T smax to T p 3 C/ Second Max. 3 C/ Second Max. Liquidous temperature (Tl) Time at liquidous (t L ) 83 C 60-50 Seconds Peak package body temperature (T P )* Table Table 7 C 60-50 Seconds Time (t p )** within 5 C of the specified classification temperature (T c ) 0 Seconds** 30 Seconds** verage ramp-down rate (T p to T smax ) 6 C/ Second Max. 6 C/ Second Max. Time 5 C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T p ) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 00 Eaton Boulevard Cleveland, OH 44 United States 05 Eaton ll Rights Reserved Printed in US Publication No. 4084 BU-MC508 September 05 Eaton is a registered trademark. ll other trademarks are property of their respective owners.