Specification. SGP.15a. Part No. SGP A.02. Product Name. GPS SMT Patch Antenna. Feature

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SGP.15a Specification Part No. SGP.1575.15.4.A.02 Product Name GPS SMT Patch Antenna Feature 15mm*15mm*4.5mm 1575MHz Centre Frequency Patent Pending RoHS Compliant SPE-11-8-137/E/SS page 1 of 12

1. Introduction This ceramic GPS patch antenna is based on smart XtremeGain TM technology. It is mounted via SMT process and has been selected as optimal solution for the 45x45mm ground plane. 2. Specification Original Patch Specification tested on 45mm ground plane NO 1 2 3 4 5 6 7 8 9 10 11 PARAMETER SPECIFICATION NOTES Range of Receiving Frequency 1575.42 MHz ± 1.023 MHZ Center Frequency Bandwidth VSWR 1575.42 ± 3MHz 6MHz min 1.5 max With 45*45mm Ground Plane Return Loss -10 db Gain at Zenith +1.0 dbic typ. Gain at 10 elevation - Axial Ratio 3.0 db max Polarization RHCP Impedance 50 Ohms Frequency Temperature Coefficient (tf) 0 ± 20ppm / C -40 C to +85 C Operating Temperature -40 C to +85 C **Changes in user groundplane and environment will offset centre frequency SPE-11-8-137/E/SS page 2 of 12

3. Electrical Specifications 3.1 Return Loss, SWR, Impedance, measured on the test fixture 27 May 2009 09:19:09 CH1 RFL LOG 5 db / REF 0 db 1:-12.229 db 1 575.420 000 MHz CH3 RFL 1 U F8 1: 31.552 Ω -7.8398 Ω 12.886 pf * Cor Cor 1.57542 GHz 3 1 4 2 CH1 Markers BW: 4.843399 MHz cent: 1575.228894 MHz Q: 325.23 1 loss: -12.229 db > > 4 3 1 2 CH3 Markers 2: 31.505 Ω -7.6631 Ω 1.57522 GHz 3: 27.301 Ω -9.5859 Ω 1.57280 GHz 4: 26.695 Ω -7.0801 Ω 1.57765 GHz Center 1 575.420 000 MHz Span 100.000 000 MHz SPE-11-8-137/E/SS page 3 of 12

tial Design Kiwi 2011/11/2 4. Mechanical Specifications end Dimension By 0.5 to 1.0 Jaosn 2012/3/1 4.1 Dimensions and Drawing Side Bottom B NOTE: NOTE: 1. 1.Solder mask. 2. 2.Area to to be be soldered. 3. 3.Clearance area. 4. Dimension 4.Diemension of 50 of 50 Ohm Ohm CPW CPW dependent on on individual individual board. board. 5. Must 5.Must be be soldered soldered to to complete complete antenna antenna feed connection. feed connection. Name Part No. Material Finish Quantity 1 SGP.15 Patch 15x15x4 SGP.15 Ceramic Clear 1 2 SGP.15 PCB FR4 0.5t Green 1 1 Name Part no. Material Finish QTY SGP.12 Patch 12x12x4 SGP.12 Ceramic Clear 1 2 SGP.12 PCB FR 0.5t Green 1 TW Design Centre This drawing and its inherent design concepts are property of Taoglas. Not to be copied or given to third parties without the written consent of Taoglas. SPE-11-8-137/E/SS page 4 of 12

4.2 Antenna Footprint 4.2.1 Top Copper SPE-11-8-137/E/SS page 5 of 12

4.2.2 Top Paste SPE-11-8-137/E/SS page 6 of 12

4.2.3 Top Mask SPE-11-8-137/E/SS page 7 of 12

4.2.4 Composite SPE-11-8-137/E/SS page 8 of 12

4.3 Test Jig and Dimension NOTE: 1. Solder Mask (Black) 2. Solder Area Name P/N Material Finish Qty 1 SGP.15 Patch 15x15x4 SGP.15A Ceramic Clear 1 2 FR4 PCB FR4 1t Black 1 3 SMA(F)Straight Edge Mount SMA.F.ST.JACK.PANELM.2H.CM Brass Gold 1 SPE-11-8-137/E/SS page 9 of 12

4.4 Test Fixture set up and measurements Test Fixture Antenna Setup & Measurements 575C Calibration Point Calibration Point 45 by 45mm Ground Plane Plane Patch Antenna Network Network Analyzer Analyzer S11 Characteristics Log map Smith Chart SMA Adapter SPE-11-8-137/E/SS page 10 of 12

5. Recommended Reflow Soldering Profile SGP.15A can be assembled following Pb-free assembly. According to the Standard IPC/JEDEC J-STD- 020C, the temperature profile suggested is as follow: Phase Profile Features PREHEAT Temperature Min(Tsmin) Temperature Max(Tsmax) Time(ts) from (Tsmin to Tsmax) RAMP-UP Avg. Ramp-up Rate (Tsmax to TP) REFLOW Temperature(TL) Total Time above TL (tl) PEAK Temperature(TP) Time(tp) RAMP-DOWN Rate Time from 25 C to Peak Temperature Composition of solder paste Solder Paste Model Pb-Free Assembly (SnAgCu) 150 C 200 C 60-120 seconds 3 C/second(max) 217 C 30-100 seconds 260 C 2-5 seconds 3 C/second(max) 8 minutes max. 96.5Sn/3Ag/0.5Cu SHENMAO PF606-P26 Soldering Iron condition: Soldering iron temperature 270 C±10 C. Apply preheating at 120 C for 2-3 minutes. Finish soldering for each terminal within 3 seconds, if soldering iron temperature over 270 C±10 C or 3 seconds, it will make cause component surface peeling or damage. SPE-11-8-137/E/SS page 11 of 12

6. Packaging 200 pcs per reel / inner carton 4 reels per outer carton - 800 pcs Taoglas makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Taoglas reserves all rights to this document and the information contained herein. Reproduction, use or disclosure to third parties without express permission is strictly prohibited. Copyright Taoglas Ltd. SPE-11-8-137/E/SS page 12 of 12