BAT30. Small signal Schottky diodes. Description. Features

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Transcription:

Small signal Schottky diodes Description Datasheet - production data The BAT30 series uses 30 V Schottky barrier diodes encapsulated in SOD-523 or SOT-323 packages. This device is specially suited for switching mode applications needing low forward voltage drop diodes. Features Very low conduction losses Negligible switching losses Low forward and reverse recovery times Extremely fast switching Surface mount device Low capacitance diode ECOPACK 2 and RoHS compliant component Table 1. Device summary Symbol Value I F 300 ma V RRM 30 V C (typ.) 14 pf T j (max.) 150 C April 2015 DocID12564 Rev 5 1/12 This is information on a product in full production. www.st.com

Characteristics BAT30 1 Characteristics Table 2. Absolute ratings (limiting values at T amb = 25 C, unless otherwise specified) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 30 V I F Continuous forward current 300 ma I FSM Surge non repetitive forward current t p = 10 ms Sinusoidal 1 A I FRM Repetitive peak forward current, square wave T A = 85 C, δ = 0.1 0.9 A P D (1) Power dissipation 1. On epoxy printed circuit board with recommended pad layout SOT-323 225 SOD-523 200 T stg Storage temperature range -65 to +150 C T j Maximum operating junction temperature 150 C T L Maximum soldering temperature 260 C mw Table 3. Thermal parameters Symbol Parameter Value Unit R th(j-a) Junction to ambient (1) SOT-323 550 SOD-523 600 C/W 1. On epoxy printed circuit board with recommended pad layout 2/12 DocID12564 Rev 5

Characteristics Table 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit V R = 5 V - 0.5 I R (1) Reverse leakage current T j = 25 C V R = 10 V - 1 V R = 25 V - 0.65 3 V R = 30 V - 5 µa T j = 70 C VR = 10 V - 7 20 T j = 85 C - 18 50 I F = 0.1 ma - 240 I F = 1 ma - 300 I F = 10 ma - 375 V F (2) Forward voltage drop T j = 25 C I F = 30 ma - 430 mv I F = 100 ma - 500 I F = 200 ma - 580 I F = 300 ma - 530 1. Pulse test: t p = 5 ms, < 2 % 2. Pulse test: t p = 380 µs, < 2 % Table 5. Dynamic characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit V R = 0 V, F = 1 MHz - 22 - C Diode capacitance V R = 1 V, F = 1 MHz - 14 - pf V R = 10 V, F = 1 MHz - 6 - DocID12564 Rev 5 3/12 12

Characteristics BAT30 Figure 1. Power dissipation versus average forward current Figure 2. Continuous forward current versus ambiant temperature 0.175 P (W) 0.150 0.125 δ=0.05 δ=0.1 δ=0.2 δ=0.5 δ=1 0.100 0.075 0.050 T 0.025 I F(AV) (A) δ=tp/t tp 0.000 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 Figure 3. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 5. Leakage current versus reverse applied voltage (typical values) Figure 6. Relative variation of reverse leakage current versus junction temperature (typical values) 4/12 DocID12564 Rev 5

Characteristics Figure 7. Junction capacitance versus reverse applied voltage (typical values) Figure 8. Forward voltage drop versus forward current (typical values) Figure 9. Forward voltage drop versus forward current (typical values) DocID12564 Rev 5 5/12 12

Package information BAT30 2 Package information Epoxy meets UL94, V0 Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SOD-523 package information Figure 10. SOD-523 package outline 6/12 DocID12564 Rev 5

Package information Table 6. SOD-523 package mechanical data Dimensions Ref. Millimeters Inches (1) Typ. Min. Max. Typ. Min. Max. A 0.60 0.50 0.70 0.024 0.020 0.028 E 1.60 1.50 1.70 0.063 0.059 0.067 E1 1.20 1.10 1.30 0.047 0.043 0.051 D 0.80 0.70 0.90 0.031 0.028 0.035 b - 0.25 0.35-0.010 0.014 c - 0.07 0.20-0.003 0.008 L 0.20 0.15 0.25 0.008 0.006 0.010 L1-0.05 0.20-0.002 0.008 1. Values in inches are converted from mm and rounded to 4 decimal digits. Figure 11. SOD-523 footprint (dimensions in mm) DocID12564 Rev 5 7/12 12

Package information BAT30 2.2 SOT-323 package information Figure 12. SOT-323 package outline 8/12 DocID12564 Rev 5

Package information Table 7. SOT-323 package mechanical data Dimensions Ref. Millimeters Inches (1) Typ. Min. Max. Typ. Min. Max. A - 0.8 1.1-0.031 0.043 A1-0.0 0.1-0.0 0.004 b - 0.25 0.4-0.010 0.016 c - 0.1 0.26-0.004 0.010 D 2.0 1.8 2.2 0.079 0.071 0.086 E 1.25 1.15 1.35 0.049 0.045 0.053 e 0.65 - - 0.026 - - H 2.1 1.8 2.4 0.083 0.071 0.094 L 0.2 0.1 0.3 0.008 0.004 0.012 q - 0 30-0 30 1. Values in inches are converted from mm and rounded to 4 decimal digits. Figure 13. SOT-323 footprint (dimensions in mm) DocID12564 Rev 5 9/12 12

Ordering information BAT30 3 Ordering information Table 8. Ordering information Order code Marking Package Weight Base qty. Packing mode BAT30CWFILM C30 SOT-323 Common cathode 6 mg 3000 Tape and reel BAT30KFILM 30 SOD-523 Single 1.45 mg 3000 Tape and reel BAT30SWFILM S30 SOT-323 Serial 6 mg 3000 Tape and reel Figure 14. Ordering information scheme 10/12 DocID12564 Rev 5

Revision history 4 Revision history Table 9. Document revision history Date Revision Changes 24-Jul-2006 1 First issue 08-Jul-2009 2 Added SOD-923 package. Table 12 sorted on alphabetic sequence of order code. Updated ECOPACK statement. 13-Oct-2009 3 Updated Table 6 quote L1 from 0.10 to 0.05. 01-Apr-2014 4 01-Apr-2015 5 Added Pin 1 anode marker to SOT-666 package graphics. Updated Table 2: Absolute ratings (limiting values at T amb = 25 C, unless otherwise specified). Package information updated and removed: SOD-323, SOD-923, SOT-23 and SOT666. Updated cover page. Updated Table 2 and Table 3. Updated Figure 14 and Figure 3. Format updated to current standard. DocID12564 Rev 5 11/12 12

IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2015 STMicroelectronics All rights reserved 12/12 DocID12564 Rev 5