Surface Mount Glass Passivated Rectifier

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Transcription:

Surface Mount Glass Passivated Rectifier DO-24AC (SMA) PRIMARY CHARACTERISTICS I F(AV) 2.0 A V RRM 200 V, 400 V, 600 V, 800 V, 00 V I FSM 50 A I R 5.0 μa V F at I F = 2.0 A (T A = 25 C) 0.90 V T J max. 50 C Package DO-24AC (SMA) Diode variations Single die FEATURES Low profile package Ideal for automated placement Glass passivated pallet chip junction Low forward voltage drop Low leakage current High forward surge capability Meets MSL level, per J-STD-020, LF maximum peak of 260 C Material categorization: for definitions of compliance please see www.vishay.com/doc?9992 TYPICAL APPLICATIONS For use in general purpose rectification of power supplies, inverters, converters, and freewheeling diodes for consumer, and telecommunication. MECHANICAL DATA Case: DO-24AC (SMA) Molding compound meets UL 94 V-0 flammability rating Base P/N-E3 - RoHS-compliant, commercial grade Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B2 E3 suffix meets JESD 20 class 2 whisker test Polarity: Color band denotes cathode end MAXIMUM RATINGS (T A = 25 C unless otherwise noted) PARAMETER SYMBOL CSA2D CSA2G CSA2J CSA2K CSA2M UNIT Device marking code D2 G2 J2 K2 M2 Maximum repetitive peak reverse voltage V RRM 200 400 600 800 00 V Average forward rectified current Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load I () F(AV).6 A I (2) F(AV) 2.0 I FSM 50 A Operating junction and storage temperature range T J, T STG -55 to +50 C () Free air, mounted on recommended copper pad area (2) Mounted on 4 mm x 4 mm copper pad areas Revision: 5-Jan-6 Document Number: 87638

ELECTRICAL CHARACTERISTICS (T A = 25 C unless otherwise noted) PARAMETER TEST CONDITIONS SYMBOL TYP. MAX. UNIT I F =.0 A 0.92 - T A = 25 C I F = 2.0 A 0.99.5 Maximum instantaneous forward voltage V () F V I F =.0 A 0.8 - T A = 25 C I F = 2.0 A 0.90 0.98 Maximum DC reverse current at rated DC T A = 25 C - 5.0 Rated V blocking voltage R I (2) R T A = 25 C - 350 μa Typical reverse recovery time I F = 0.5 A, I R =.0 A, I rr = 0.25 A t rr 2. - μs Typical junction capacitance 4.0 V, MHz C J - pf () Pulse test: 300 μs pulse width, % duty cycle (2) Pulse test: pulse width 40 ms THERMAL CHARACTERISTICS (T A = 25 C unless otherwise noted) PARAMETER SYMBOL CSA2D CSA2G CSA2J CSA2K CSA2M UNIT Typical thermal resistance R JA () 2 R JM (2) 4 () Free air, mounted on recommended copper pad area; thermal resistance R JA - junction to ambient (2) Mounted on 4 mm x 4 mm copper pad areas, R JM - junction to mount at the terminal C/W ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE CSA2J-E3/I 0.064 I 7500 3" diameter plastic tape and reel Revision: 5-Jan-6 2 Document Number: 87638

RATINGS AND CHARACTERISTICS CURVES (T A = 25 C unless otherwise noted) Average Forward Rectified Current (A) 2.4 2.2 2.0.8.6.4.2.0 0.8 0.6 0.4 0.2 0 Rth JA = 2 C/W Rth JM = 4 C/W Mounted on 4 mm x 4 mm copper pad areas 0 25 50 75 0 25 50 Instantaneous Reverse Current (ma) 00 T J = 50 C 0 T J = 75 C 0. 0.0 20 30 40 50 60 70 80 90 0 Mount Temperature ( C) Fig. - Maximum Forward Current Derating Curve Percent of Rated Peak Reverse Voltage (%) Fig. 4 - Typical Reverse Leakage Characteristics Average Power Loss (W) 2.4 2.0.6.2 0.8 0.4 D = 0. D = 0.2 D = 0.5 D = 0.3 D = t p /T 0.0 0 0. 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9..2 Average Forward Current (A) D = 0.8 D =.0 Fig. 2 - Maximum Non-Repetitive Peak Forward Surge Current T t p Junction Capacitance (pf) 0 0. 0 Reverse Voltage (V) f =.0 MHz V sig = 50 mv p-p Fig. 5 - Typical Junction Capacitance Instantaneous Forward Current (A) 0 T J = 50 C T J = 75 C 0. 0.0 0.2 0.4 0.6 0.8.0.2.4.6.8 Instantaneous Forward Voltage (V) Fig. 3 - Typical Instantaneous Forward Characteristics Transient Thermal Impedance ( C/W) 00 Junction to Ambient 0 0.0 0. 0 00 t - Pulse Duration (s) Fig. 6 - Typical Transient Thermal Impedance Revision: 5-Jan-6 3 Document Number: 87638

PACKAGE OUTLINE DIMENSIONS in inches (millimeters) DO-24AC (SMA) Cathode Band Mounting Pad Layout 0.065 (.65) 0.049 (.25) 0. (2.79) 0.0 (2.54) 0.066 (.68) MIN. 0.074 (.88) MAX. 0.77 (4.50) 0.57 (3.99) 0.02 (0.305) 0.006 (0.52) 0.060 (.52) MIN. 0.090 (2.29) 0.078 (.98) 0.208 (5.28) REF. 0.060 (.52) 0.030 (0.76) 0.008 (0.203) 0 (0) 0.208 (5.28) 0.94 (4.93) Revision: 5-Jan-6 4 Document Number: 87638

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