SHENMAO Technology Inc. Your Ultimate Choice for Solder

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Transcription:

Your Ultimate Choice for Solder

Company Profile TSE Code: 3305 Founded: Oct. 1973 Capital: US $40 million (2015) Revenue: US $157 million (2015) President: Mr. S. L. Lee General Manager: Mr. H. W. Lee Employee: 600 staffs Headquarter: Taoyuan, Taiwan 2 of 18

About Shenmao Listed company in Taiwan Dedicated in solder business for more than 40 years Top 3 solder material manufacturer in the world ISO-9001, ISO-14001, TS-16949, OHSAS-18001 certificated 10 manufacturing sites worldwide Vertical integrated production lines from tin ingot (current) and tin ore (estimated in 2016) 3 of 18

Global Directory Germany NeVo GmbH CHONGQING, CHINA DONGGUAN, CHINA DONG GUAN Soldering Tin Co. Ltd. DONG GUAN SHENYANG Solder Material Co. Ltd. SUZHOU, CHINA SAN JOSE AMERICA INDIA Electronics Technology Co. Ltd. Persang Alloy Industries Pyt. Ltd. THAILAND MALAYSIA Solder (Malaysia) Sdn. Bhd. Technology (Thailand) Co. Ltd. Solder Material (Suzhou) Co. Ltd. TAIWAN JAPAN group Japan Office Headquarter R&D Center Micro-Materials Institute America, Inc. BRAZIL White Solder Ltda. Headquarter R&D Asia North America Technical Collaboration Partner 4 of 18

Certifications ISO 9001:2000 ISO/TS 16949:2002 OHSAS 18001:2007 ISO 14001:2004 5 of 18

Products Flip-Chip Flux WLP Flux Bumping Solder Paste BGA and μbga Balls Ball-Attach Flux Packaging LED Die Bonding Solder Paste PoP Solder Paste PoP Flux PCB Assembly Solder Paste Solder Preform Solder Wire Solder Bar Liquid Flux Others Solder Powder Plating Anode PV Ribbon (Solar) 6 of 18

Total solution for packaging process Flip Chip Tacky Flux:SMF-WC52/SMF-B52 Micro BGA:PF684-S, 0.1mm PoP Paste:PF606-XP/PF606-XP36 PoP Flux:SMF-D01/SMF-D52 Water Soluble Solder Paste: PF606-PW008, Type 6 PoP Fan-Out WLP Flip Chip BGA PCB Solder Ball:PF682-S, 0.25mm Ball Attach Flux:SMF-WC52/SMF-WB02 Solder Ball:PF684-S, 0.15mm WLP Flux:SMF-WB51 7 of 18

Total Solution for Solder Industry New Factory in Taiwan (under construction) Tin Ore (SnO 2 ) Pyrometallurgy Tin Ingot 3N Pure Tin 4N Pure Tin LA Pure Tin ULA Pure Tin Indium Tin Oxide* Babbitt metal* Pewter* Electronics* * Applications for reference only 8 of 18

Micro Materials Institute Basic Information Date of Established: MAY, 2003 Area: 1500 m 2 Numbers of Staffs: 36 (3 Ph.D, 8 Masters) Location: Taoyuan, TAIWAN 9 of 18

Micro Materials Institute Paste Properties Viscometer Rheometer Tackiness tester Wetting balance Reflow simulator In-circuit test (ICT) Chemical Analysis ICP IC GC/MS FTIR GPC Instruments Metallurgical Properties SPARK Grinder polisher Stereo/ metallurgical microscope Laser powder size measure 3D vision inspection SEM/EDS Reliability Multi-function bond tester Humid chamber Migration tester Thermal shock chamber X-ray inspection system Thermal Analysis Oxygen/ Nitrogen analyzer TG/DTA DSC 10 of 18

Micro Materials Institute SMT Process Wafer Bumping Process Printer Wafer printer Reflow oven X-ray inspection Reflow oven 11 of 18

FC-CSP/ FC-BGA Micro Materials Institute LED Flip Chip & Die Bond Die attachment solder Recent Research PoP (Package on Package) Wafer bumping paste u-bga Bonding flux Substrate bumping paste u-bga BGA solder ball BGA flux Cleaners PoP solder paste 12 of 18

Micro Materials Institute Warpage Study Recent Research Solder Powder Type7 Micro BGA Solder Sphere D 10 : 5.01μm D 90 : 10.06μm D 50 : 7.50μm Type8 100μm 70μm 50μm D 10 : 4.13μm D 90 : 8.82μm D 50 : 6.21μm 13 of 18

Corporate Social Responsibility Health, Safety and Environment Concepts Follow ISO 14001 and OHSAS 18001 Standard - Pursue the best quality Research and develop green products - Lead free and no toxic materials Protect the safety of employees and customers - Protection tools and labor insurance Support the communities - Founder for scholarship Survey of Metal Conflict-Free Assure DRC Conflict-Free for the metals of gold, tantalum, tungsten, tin and cobalt. Do not derive from or source from mines in conflict areas. The conflict areas include Democratic Republic of Congo (DRC) and its adjoining countries. 14 of 18

Customers (Semiconductor) 15 of 18

EMS Customers 16 of 18

Your ultimate choice for solder!