TSMS37 Infrared Emitting Diode, 95 nm, GaAs Description TSMS37 is a standard GaAs infrared emitting diode in a miniature PLCC-2 package. Its flat window provides a wide aperture, making it ideal for use with external optics. The diode is case compatible to the TEMT37 phototransistor, allowing the user to assemble his own optical interrupters. Features SMT IRED with high radiant power 9 8553 Low forward voltage Compatible with automatic placement equipment EIA and ICE standard package Suitable for infrared, vapor phase and wavesolder process Available in 8 mm tape Suitable for DC and high pulse current operation Wide angle of half intensity ϕ = ± 6 Peak wavelength λ p = 95 nm High reliability Matching to TEMT37 phototransistor Lead-free component Component in accordance to RoHS 22/95/EC and WEEE 22/96/EC Applications Infrared source in tactile keyboards IR diode in low space applications Matching with phototransistor TEMT37 in reflective sensors PCB mounted infrared sensors Infrared emitter for miniature light barriers Parts Table Part Ordering code Remarks TSMS37-GS8 TSMS37-GS8 MOQ: 75 pcs TSMS37-GS8 TSMS37-GS8 MOQ: 8 pcs Absolute Maximum Ratings T amb = 25 C, unless otherwise specified Parameter Test condition Symbol Value Unit Reverse Voltage V R 5 V Forward current I F ma Peak Forward Current t p /T =.5, t p = µs I FM 2 ma Surge Forward Current t p = µs I FSM.5 A Power Dissipation P V 7 mw Junction Temperature T j C Operating Temperature Range T amb - 55 to + C Document Number 837 Rev..7, 8-Mar-5
TSMS37 Parameter Test condition Symbol Value Unit Storage Temperature Range T stg - 55 to + C Soldering Temperature t sec T sd 26 C Thermal Resistance Junction/ Ambient on PC board R thja 5 K/W Electrical Characteristics T amb = 25 C, unless otherwise specified Parameter Test condition Symbol Min Typ. Max Unit Forward Voltage I F = ma, t p = 2 ms V F.3.7 V I F = A, t p = µs V F.8 V Temp. Coefficient of V F I F = ma TK VF -.3 mv/k Reverse Current V R = 5 V I R µa Junction capacitance V R = V, f = MHz, E = C j 3 pf Optical Characteristics T amb = 25 C, unless otherwise specified Parameter Test condition Symbol Min Typ. Max Unit Radiant Intensity I F = ma, t p = 2 ms I e.6.5 8 mw/sr I F =.5 A, t p = µs I e 35 mw/sr Radiant Power I F = ma, t p = 2 ms φ e 5 mw Temp. Coefficient of φ e I F = ma TKφ e -.8 %/K Angle of Half Intensity ϕ ± 6 deg Peak Wavelength I F = ma λ p 95 nm Spectral Bandwidth I F = ma λ 5 nm Temp. Coefficient of λ p I F = ma TKλ p.2 nm/k Rise Time I F = 2 ma t r 8 ns I F = A t r ns Fall Time I F = 2 ma t f 8 ns I F = A t f ns Virtual Source Diameter.5 mm 2 Document Number 837 Rev..7, 8-Mar-5
Typical Characteristics (Tamb = 25 C unless otherwise specified) TSMS37 25 P - Power Dissipation ( mw ) V 2 5 5 R thja I - Forward Current ( ma ) F 3 2 9 829 2 6 8 9 7996-2 3 V F - Forward Voltage (V) Figure. Power Dissipation vs. Ambient Temperature Figure. Forward Current vs. Forward Voltage 25.2 I F - Forward Current ( ma ) 75 5 25 R thja V Frel - Relative Forward Voltage...9.8 I F =ma 9 796 2 6 8 9 799.7 2 6 8 Figure 2. Forward Current vs. Ambient Temperature Figure 5. Relative Forward Voltage vs. Ambient Temperature I - Forward Current ( ma ) F t p /T =.5..2.5 DC. T amb <6 C.2.5 I - Radiant Intensity ( mw/sr ) e 95 9985.. t p - Pulse Length ( ms ) 9 7956. 2 3 I F - Forward Current ( ma ) Figure 3. Pulse Forward Current vs. Pulse Duration Figure 6. Radiant Intensity vs. Forward Current Document Number 837 Rev..7, 8-Mar-5 3
TSMS37 2 3 - Radiant Power ( mw ) e Φ 9 82. 2 3 I F - Forward Current ( ma ) I e rel - Relative Radiant Intensity 9 83..9.8.7.6..2.2. 5 6 7 8.6 Figure 7. Radiant Power vs. Forward Current Figure. Relative Radiant Intensity vs. Angular Displacement.6 I e rel ; Φ e rel.2.8 I F =2mA. 9 7993-5 Figure 8. Rel. Radiant Intensity/Power vs. Ambient Temperature.25 - Relative Radiant Power e rel Φ 9 799..75.5.25 I F = ma 9 95 λ - Wavelength ( nm ) Figure 9. Relative Radiant Power vs. Wavelength Document Number 837 Rev..7, 8-Mar-5
TSMS37 Package Dimensions in mm 3.5 ±.2.65 +. -.5.85 technical drawings according to DIN specifications Pin identification Mounting Pad Layout.2 area covered with solder resist 2.8 +.5 C A 2.2 2.6 (2.8).6 (.9) 2. 3 +.5 Dimensions: IR and Vaporphase (Wave Soldering) Drawing-No. : 6.5-525.- Issue: 7; 5.. 95 3 Document Number 837 Rev..7, 8-Mar-5 5
TSMS37 Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (987) and its London Amendments (99) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 99 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/5/EEC and 9/69/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use products for any unintended or unauthorized application, the buyer shall indemnify against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-725 Heilbronn, Germany Telephone: 9 ()73 67 283, Fax number: 9 ()73 67 223 6 Document Number 837 Rev..7, 8-Mar-5
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