TMS27C BIT UV ERASABLE PROGRAMMABLE READ-ONLY MEMORY TMS27PC BIT PROGRAMMABLE READ-ONLY MEMORY

Similar documents
TMS27C BY 16-BIT UV ERASABLE TMS27PC BY 16-BIT PROGRAMMABLE READ-ONLY MEMORIES


TMS27C BIT UV ERASABLE PROGRAMMABLE TMS27PC BIT PROGRAMMABLE READ-ONLY MEMORY

TMS27C BIT UV ERSABLE PROGRAMMABLE TMS27PC BIT PROGRAMMABLE READ-ONLY MEMORY

description TMS27PC240 FN PACKAGE ( TOP VIEW ) A17 A13 A12 A11 A10 A9 GND DQ2 DQ1 DQ0 DQ9 DQ8 GND NC DQ7 DQ6 A8 A7 A6 A5 DQ15 DQ14

54ACT11020, 74ACT11020 DUAL 4-INPUT POSITIVE-NAND GATES

UVEPROM SMJ27C K UVEPROM UV Erasable Programmable Read-Only Memory. PIN ASSIGNMENT (Top View) AVAILABLE AS MILITARY SPECIFICATIONS

TMS27C BY 8-BIT UV ERASABLE TMS27PC BY 8-BIT PROGRAMMABLE READ-ONLY MEMORIES

SN54HC373, SN74HC373 OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS

SN54ACT00, SN74ACT00 QUADRUPLE 2-INPUT POSITIVE-NAND GATES

SN5407, SN5417, SN7407, SN7417 HEX BUFFERS/DRIVERS WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS

SN54HC365, SN74HC365 HEX BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS

SN54ALS08, SN54AS08, SN74ALS08, SN74AS08 QUADRUPLE 2-INPUT POSITIVE-AND GATES

ua9637ac DUAL DIFFERENTIAL LINE RECEIVER

SN54HC245, SN74HC245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

74ACT11374 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS

SN54ALS873B, SN54AS873A, SN74ALS873B, SN74AS873A DUAL 4-BIT D-TYPE LATCHES WITH 3-STATE OUTPUTS SDAS036D APRIL 1982 REVISED AUGUST 1995

SN54HC377, SN74HC377 OCTAL D-TYPE FLIP-FLOPS WITH CLOCK ENABLE

SN54HC175, SN74HC175 QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR

SN5407, SN5417, SN7407, SN7417 HEX BUFFERS/DRIVERS WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS SDLS032A DECEMBER 1983 REVISED NOVEMBER 1997

PRODUCT PREVIEW SN54AHCT257, SN74AHCT257 QUADRUPLE 2-LINE TO 1-LINE DATA SELECTORS/MULTIPLEXERS WITH 3-STATE OUTPUTS. description

SN75150 DUAL LINE DRIVER

SN54ALS688, SN74ALS688 8-BIT IDENTITY COMPARATORS

SN54ALS00A, SN54AS00, SN74ALS00A, SN74AS00 QUADRUPLE 2-INPUT POSITIVE-NAND GATES

SN75158 DUAL DIFFERENTIAL LINE DRIVER

SN54HCT373, SN74HCT373 OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS

MC3487 QUADRUPLE DIFFERENTIAL LINE DRIVER

SN54HC573A, SN74HC573A OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS SCLS147B DECEMBER 1982 REVISED MAY 1997

SN54ACT16373, 74ACT BIT D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS

54ACT11109, 74ACT11109 DUAL J-K POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH CLEAR AND PRESET

74AC11373 OCTAL TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS

SN54HC00, SN74HC00 QUADRUPLE 2-INPUT POSITIVE-NAND GATES

CDC337 CLOCK DRIVER WITH 3-STATE OUTPUTS

SN54ALS873B, SN54AS873A, SN74ALS873B, SN74AS873A DUAL 4-BIT D-TYPE LATCHES WITH 3-STATE OUTPUTS SDAS036D APRIL 1982 REVISED AUGUST 1995

SN55115, SN75115 DUAL DIFFERENTIAL RECEIVERS

SN54HC373, SN74HC373 OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS SCLS140B DECEMBER 1982 REVISED MAY 1997

SN QUADRUPLE HALF-H DRIVER

SN54ALS563B, SN74ALS563B OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS

SN75150 DUAL LINE DRIVER

SN54ALS74A, SN54AS74A, SN74ALS74A, SN74AS74A DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH CLEAR AND PRESET

SN54AS825A, SN74AS825A 8-BIT BUS-INTERFACE FLIP-FLOPS WITH 3-STATE OUTPUTS SDAS020B JUNE 1984 REVISED AUGUST 1995

SN75174 QUADRUPLE DIFFERENTIAL LINE DRIVER

SN55451B, SN55452B, SN55453B, SN55454B SN75451B, SN75452B, SN75453B, SN75454B DUAL PERIPHERAL DRIVERS

SN54HC132, SN74HC132 QUADRUPLE POSITIVE-NAND GATES WITH SCHMITT-TRIGGER INPUTS

TMS27C BY 8-BIT UV ERASABLE TMS27PC BY 8-BIT PROGRAMMABLE READ-ONLY MEMORIES

54AC16245, 74AC BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

SN75C1406 TRIPLE LOW-POWER DRIVERS/RECEIVERS

SN74ALVCH V 20-BIT BUS-INTERFACE FLIP-FLOP WITH 3-STATE OUTPUTS

SN54ACT241, SN74ACT241 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS

ORDERING INFORMATION PACKAGE

54AC11241, 74AC11241 OCTAL BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS

SN54ALS86, SN54AS86A, SN74ALS86, SN74AS86A QUADRUPLE 2-INPUT EXCLUSIVE-OR GATES

SN74ALVCH BIT BUS-INTERFACE FLIP-FLOP WITH 3-STATE OUTPUTS

description V CC 2CLR 2D 2CLK 2PRE 2Q 2Q 1CLR 1D 1CLK 1PRE 1Q 1Q GND 2CLR 1CLR 1CLK NC 1PRE NC 1Q 2CLK 2PRE GND

74ACT11652 OCTAL BUS TRANSCEIVER AND REGISTER WITH 3-STATE OUTPUTS

SN75C185 LOW-POWER MULTIPLE DRIVERS AND RECEIVERS

SN74ACT STROBED FIRST-IN, FIRST-OUT MEMORY

SN54HC04, SN74HC04 HEX INVERTERS

74AC11873 DUAL 4-BIT D-TYPE LATCH WITH 3-STATE OUTPUTS SCAS095 JANUARY 1990 REVISED APRIL 1993

SN54ALS244C, SN54AS244A, SN74ALS244C, SN74AS244A OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS

Am27C Megabit (524,288 x 8-Bit) CMOS EPROM DISTINCTIVE CHARACTERISTICS GENERAL DESCRIPTION BLOCK DIAGRAM

ORDERING INFORMATION PACKAGE

CD74HCT4514, CD74HCT LINE TO 16-LINE DECODERS/DEMULTIPLEXERS WITH INPUT LATCHES

SN54HC191, SN74HC191 4-BIT SYNCHRONOUS UP/DOWN BINARY COUNTERS

SN75C1406 TRIPLE LOW-POWER DRIVERS/RECEIVERS

SN75468, SN75469 DARLINGTON TRANSISTOR ARRAYS

SN74LVC1G06 SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT

SN54AHCT174, SN74AHCT174 HEX D-TYPE FLIP-FLOPS WITH CLEAR

SN74S ASYNCHRONOUS FIRST-IN, FIRST-OUT MEMORY WITH 3-STATE OUTPUTS

SN54ALS273, SN74ALS273 OCTAL D-TYPE FLIP-FLOPS WITH CLEAR

SN75C185 LOW-POWER MULTIPLE DRIVERS AND RECEIVERS

54AC11533, 74AC11533 OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS

LM139, LM139A, LM239, LM239A, LM339, LM339A, LM339Y, LM2901 QUAD DIFFERENTIAL COMPARATORS

ULN2804A DARLINGTON TRANSISTOR ARRAY

SOIC (SOP) NC A8 A9 A10 A11 A12 A13 A14 A15 A16 NC A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 BYTE/VPP GND O15/A-1 GND O7 O14 O6 O13 O5 O12 O4 VCC


MC1489, MC1489A, SN55189, SN55189A, SN75189, SN75189A QUADRUPLE LINE RECEIVERS

SN75374 QUADRUPLE MOSFET DRIVER

SN54ALS273, SN74ALS273 OCTAL D-TYPE FLIP-FLOPS WITH CLEAR SDAS218A APRIL 1982 REVISED DECEMBER 1994

MAX232, MAX232I DUAL EIA-232 DRIVER/RECEIVER

SN54LVC14A, SN74LVC14A HEX SCHMITT-TRIGGER INVERTERS

SN54221, SN54LS221, SN74221, SN74LS221 DUAL MONOSTABLE MULTIVIBRATORS WITH SCHMITT-TRIGGER INPUTS

NE556, SA556, SE556, SE556C DUAL PRECISION TIMERS

AM26LS31 QUADRUPLE DIFFERENTIAL LINE DRIVER

ULN2001A, ULN2002A, ULN2003A, ULN2004A DARLINGTON TRANSISTOR ARRAYS

6N135, 6N136, HCPL4502 OPTOCOUPLERS/OPTOISOLATORS

TL5632C 8-BIT 3-CHANNEL HIGH-SPEED DIGITAL-TO-ANALOG CONVERTER

TLC545C, TLC545I, TLC546C, TLC546I 8-BIT ANALOG-TO-DIGITAL CONVERTERS WITH SERIAL CONTROL AND 19 INPUTS

PCA8550 NONVOLATILE 5-BIT REGISTER WITH I 2 C INTERFACE

SN54AHCT132, SN74AHCT132 QUADRUPLE POSITIVE-NAND GATES WITH SCHMITT-TRIGGER INPUTS

SN74ALVCHR BIT UNIVERSAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS

TCM1030, TCM1050 DUAL TRANSIENT-VOLTAGE SUPPRESSORS

LM139, LM139A, LM239, LM239A, LM339 LM339A, LM339Y, LM2901, LM2901Q QUAD DIFFERENTIAL COMPARATORS SLCS006C OCTOBER 1979 REVISED NOVEMBER 1996

ULN2001A THRU ULN2004A DARLINGTON TRANSISTOR ARRAYS

ua747c, ua747m DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS

TL494M PULSE-WIDTH-MODULATION CONTROL CIRCUIT

ORDERING INFORMATION PACKAGE

TLC x8 BIT LED DRIVER/CONTROLLER

TPIC6A595 POWER LOGIC 8-BIT SHIFT REGISTER

CD54/74AC245, CD54/74ACT245

Transcription:

This Data Sheet is Applicable to All TMS27C128s and TMS27PC128s Symbolized with Code B as Described on Page 12. Organization...16K 8 Single 5-V Power Supply Pin Compatible With Existing 128K MOS ROMs, PROMs, and EPROMs All Inputs/Outputs Fully TTL Compatible Max Access/Min Cycle Times V CC ± 10% 27C128-12 27C/PC128-15 27C/PC128-20 27C/PC128-25 120 ns 150 ns 200 ns 250 ns Power Saving CMOS Technology Very High-Speed SNAP! Pulse Programming 3-State Output Buffers 400-mV Minimum DC Noise Immunity With Standard TTL Loads Latchup Immunity of 250 ma on All Input and Output Lines Low Power Dissipation (V CC = 5.25 V) Active...158 mw Worst Case Standby...1.4 mw Worst Case (CMOS Input Levels) PEP4 Version Available With 168-Hour Burn-In and Choices of Operating Temperature Ranges 128K EPROM Available With MIL-STD-883C Class B High-Reliability Processing (SMJ27C128) A6 A5 A4 A3 A2 A1 A0 NC DQ0 J AND N PACKAGES (TOP VIEW) V PP A12 A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 FM PACKAGE (TOP VIEW) A7 A12 V PP NU V CC V CC PGM A13 A8 A9 A11 G A10 E DQ7 DQ6 DQ5 DQ4 DQ3 4 3 2 1 32 31 30 5 6 7 8 9 10 11 12 13 29 28 27 26 25 24 23 22 21 14 15 16 17 18 19 20 DQ1 DQ2 V SS NU DQ3 PGM A13 DQ4 DQ5 A8 A9 A11 NC G A10 E DQ7 DQ6 description The TMS27C128 series are 131 072-bit, ultraviolet-light erasable, electrically programmable read-only memories. The TMS27PC128 series are 131 072-bit, one time electrically programmable read-only memories. A0 A13 E G GND NC NU PGM DQ0 DQ7 VCC VPP PIN NOMENCLATURE Address Inputs Chip Enable/Powerdown Output Enable Ground No Connection Make No External Connection Program Inputs (programming)/outputs 5-V Power Supply 12-13 V Programming Power Supply PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 1993, Texas Instruments Incorporated 1

These devices are fabricated using power-saving CMOS technology for high speed and simple interface with MOS and bipolar circuits. All inputs (including program data inputs) can be driven by Series 74 TTL circuits without the use of external pull-up resistors. Each output can drive one Series 74 TTL circuit without external resistors. The data outputs are three-state for connecting multiple devices to a common bus. The TMS27C128 and the TMS27PC128 are pin compatible with 28-pin 128K MOS ROMs, PROMs, and EPROMs. The TMS27C128 EPROM is offered in a dual-in-line ceramic package (J suffix) designed for insertion in mounting hole rows on 15,2-mm (600-mil) centers. The TMS27C128 is offered with two operating temperature ranges of 0 C to 70 C (JL suffix) and 40 C to 85 C (JE suffix). The TMS27C128 is also offered with 168-hour burn-in temperature ranges (JL4 and JE4 suffixes). (See table below). The TMS27PC128 PROM is offered in a dual-in-line plastic package (N suffix) designed for insertion in mounting hole rows on 15,2-mm (600-mil) centers. The TMS27PC128 is also supplied in a 32-lead plastic leaded chip carrier package using 1,25-mm (50-mil) lead spacing (FM suffix). The TMS27PC128 is also offered with two operating temperature ranges of 0 C to 70 C (NL and FML suffixes) and 40 C to 85 C (NE and FME suffixes). The TMS27PC128 is also offered with 168 hour burn-in temperature ranges (NL4, FML4, NE4, and FME4 suffixes). (See table below). All package styles conform to JEDEC standards. EPROM AND PROM SUFFIX FOR OPERATING TEMPERATURE RANGES WITHOUT PEP4 BURN-IN SUFFIX FOR OPERATING TEMPERATURE RANGES WITH PEP4 168 HR. BURN-IN 0 C TO 70 C 40 C TO 85 C 0 C TO 70 C 40 C TO 85 C TMS27C128-XXX JL JE JL4 JE4 TMS27PC128-XXX NL NE NL4 NE4 TMS27PC128-XXX FML FME FML4 FME4 These EPROMs and PROMs operate from a single 5-V supply (in the read mode), thus are ideal for use in microprocessor-based systems. One other 12-13-V supply is needed for programming. All programming signals are TTL level. These devices are programmable by using the SNAP! Pulse programming algorithm.the SNAP! Pulse programming algorithm uses a V PP of 13.0 V and a V CC of 6.5 V for a nominal programming time of two seconds. For programming outside the system, existing EPROM programmers can be used. Locations may be programmed singly, in blocks, or at random. 2

operation The seven modes of operation are listed in the following table. Read mode requires a single 5-V supply. All inputs are TTL level except for V PP during programming (13 V for SNAP! Pulse), and 12 V on A9 for the signature mode. FUNCTION READ OUTPUT DISABLE MODE STANDBY PROGRAMMING VERIFY PROGRAM INHIBIT SIGNATURE MODE E G X X PGM X X VPP VCC VCC VCC VPP VPP VPP VCC VCC VCC VCC VCC VCC VCC VCC VCC A9 X X X X X X VH VH A0 X X X X X X CODE DQ0 DQ7 Data Out HI-Z HI-Z Data In Data Out HI-Z MFG DEVICE X can be or. VH = 12 V ± 0.5 V. 97 83 3

read/output disable When the outputs of two or more TMS27C128s or TMS27PC128s are connected in parallel on the same bus, the output of any particular device in the circuit can be read with no interference from the competing outputs of the other devices. To read the output of a single device, a low-level signal is applied to the E and G pins. All other devices in the circuit should have their outputs disabled by applying a high-level signal to one of these pins. Output data is accessed at pins DQ0 through DQ7. latchup immunity Latchup immunity on the TMS27C128 and TMS27PC128 is a minimum of 250 ma on all inputs and outputs. This feature provides latchup immunity beyond any potential transients at the P.C. board level when the devices are interfaced to industry-standard TTL or MOS logic devices. Input/output layout approach controls latchup without compromising performance or packing density. power down Active I CC supply current can be reduced from 30 ma to 500 µa (TTL-level inputs) or 250 µa (CMOS-level inputs) by applying a high TTL or CMOS signal to the E pin. In this mode all outputs are in the high-impedance state. erasure (TMS27C128) Before programming, the TMS27C128 EPROM is erased by exposing the chip through the transparent lid to a high intensity ultraviolet light (wavelength 2537 Å). EPROM erasure before programming is necessary to assure that all bits are at the logic high level. Logic lows are programmed into the desired locations. A programmed logic low can be erased only by ultraviolet light. The recommended minimum ultraviolet light exposure dose (UV intensity exposure time) is 15-W s/cm 2. A typical 12-mW/cm 2, filterless UV lamp will erase the device in 21 minutes. The lamp should be located about 2.5 cm above the chip during erasure. It should be noted that normal ambient light contains the correct wavelength for erasure. Therefore, when using the TMS27C128, the window should be covered with an opaque label. initializing (TMS27PC128) The one-time programmable TMS27PC128 PROM is provided with all bits at the logic high level. The logic lows are programmed into the desired locations. Logic lows programmed into a PROM cannot be erased. SNAP! Pulse programming The 128K EPROM and PROM are programmed using the TI SNAP! Pulse programming algorithm, illustrated by the flowchart in Figure 1, which programs in a nominal time of two seconds. Actual programming time will vary as a function of the programmer used. Data is presented in parallel (eight bits) on pins DQ0 to DQ7. Once addresses and data are stable, PGM is pulsed. The SNAP! Pulse programming algorithm uses initial pulses of 100 microseconds (µs) followed by a byte verification to determine when the addressed byte has been successfully programmed. Up to 10 (ten) 100-µs pulses per byte are provided before a failure is recognized. The programming mode is achieved when V PP = 13 V, V CC = 6.5 V, G = V IH, and E = V IL. More than one device can be programmed when the devices are connected in parallel. Locations can be programmed in any order. When the SNAP! Pulse programming routine is complete, all bits are verified with V CC = V PP = 5 V. program inhibit Programming may be inhibited by maintaining a high level input on the E or PGM pin. 4

program verify Programmed bits may be verified with V PP = 13 V when G = V IL, E = V IL, and PGM = V IH. signature mode The signature mode provides access to a binary code identifying the manufacturer and type. This mode is activated when A9 is forced to 12 V ± 0.5 V. Two identifier bytes are accessed by A0; i.e., A0 = V IL accesses the manufacturer code, which is output on DQ0 DQ7; A0 = V IH accesses the device code, which is output on DQ0 DQ7. All other addresses must be held at V IL. The manufacturer code for these devices is 97, and the device code is 83. 5

Start Address = First Location VCC = 6.5 V ± 0.25 V, VPP = 13 V ± 0.25 V Program Mode Program One Pulse = tw = 100 µs Increment Address Last Address? No Yes Address = First Location X = 0 Program One Pulse = tw = 100 µs No Increment Address Verify One Byte Fail X = X + 1 X = 10? Interactive Mode Pass No Last Address? Yes VCC = VPP = 5 V ± 0.5 V Yes Device Failed Compare All Bytes To Original Data Fail Final Verification Pass Device Passed Figure 1. SNAP! Pulse Programming Flowchart 6

logic symbol EPROM 16 384 8 PROM 16 384 8 A0 10 0 A0 10 9 A1 A1 9 8 A2 A2 8 7 7 A3 11 A3 6 DQ0 6 A4 A4 12 A5 5 DQ1 A5 5 4 13 A 0 DQ2 4 A6 A6 3 16 383 15 DQ3 3 A7 A7 A8 25 16 DQ4 A8 25 24 A9 17 24 DQ5 A9 A10 21 18 DQ6 A10 21 23 A11 19 23 DQ7 A11 A12 2 A12 2 26 13 26 A13 A13 20 E [PWR DWN] E 20 0 A 13 [PWR DWN] 0 16 383 11 12 13 15 16 17 18 19 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 G 22 & EN G 22 & EN PGM 27 PGM 27 These symbols are in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. Pin numbers shown are J and N packages. absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, V CC (see Note 1).............................................. 0.6 V to 7 V Supply voltage range, V PP (see Note 1)............................................. 0.6 V to 14 V Input voltage range (see Note 1), All inputs except A9............................ 0.6 V to V CC + 1 V A9............................................... 0.6 V to 13.5 V Output voltage range (see Note 1)............................................. 0.6 V to V CC + 1 V Operating free-air temperature range ( 27C128- JL and JL4, 27PC128- NL, and NL4 FML, and FML4).................................. 0 C to 70 C Operating free-air temperature range ( 27C128- JE and JE4, 27PC128- NE, NE4, FME, and FME4)................................ 40 C to 85 C Storage temperature range....................................................... 65 C to 150 C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: Under absolute maximum ratings, voltage values are with respect to GND. 7

recommended operating conditions VCC VPP TA TA NOTES: Supply voltage Supply voltage High-level dc input voltage Low-level dc input voltage Operating free-air temperature Operating free-air temperature MIN NOM MAX UNIT Read mode (see Note 2) 4.5 5 5.5 SNAP! Pulse programming algorithm 6.25 6.5 6.75 Read mode VCC 0.6 VCC + 0.6 SNAP! Pulse programming algorithm 12.75 13 13.25 TTL 2 VCC +1 CMOS VCC 0.2 VCC +1 TTL 0.5 0.8 V CMOS 0.5 0.2 V 27C128- JL,JL4 27PC128 NL,NL4 FML, FML4 27C128- JE,JE4 27PC128 NE,NE4 FME, FME4 V V V 0 70 C 40 70 C 2. VCC must be applied before or at the same time as VPP and removed after or at the same time as VPP. The device must not be inserted into or removed from the board when VPP or VCC is applied. electrical characteristics over full ranges of operating conditions VOH VOL High-level dc output voltage Low-level dc output voltage PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IOH = 2.5 ma 3.5 V IOH = 20 µa VCC 0.1 V IOL = 2.1 ma 0.4 V IOL = 20 µa 0.1 V II Input current (leakage) VI = 0 to 5.5 V ±1 µa IO Output current (leakage) VO = 0 to VCC ±1 µa IPP1 VPP supply current VPP = VCC = 5.5 V 1 10 µa IPP2 VPP supply current (during program pulse) VPP = 13 V 35 50 ma ICC1 VCC supply current (standby) TTL-input level VCC = 5.5 V, E = 250 500 µa CMOS-input level VCC = 5.5 V, E = VCC 100 250 µa VCC = 5.5 V, E =, ICC2 VCC supply current (active) tcycle = minimum cycle time, 15 30 ma outputs open Typical values are at TA = 25 C and nominal voltages. capacitance over recommended ranges of supply voltage and operating free-air temperature, f = 1 MHz PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Ci Input capacitance VI = 0, f = 1 MHz 6 10 pf CO Output capacitance VO = 0, f = 1 MHz 10 14 pf Typical values are at TA = 25 C and nominal voltages. Capacitance measurements are made on sample basis only. 8

switching characteristics over full ranges of recommended operating conditions (see Notes 3 and 4) PARAMETER TEST CONDITIONS 27C128-12 27C/PC128-15 (SEE NOTES 3 AND 4) MIN MAX MIN MAX ta(a) Access time from address 120 150 ns ta(e) Access time from chip enable 120 150 ns CL = 100 pf, ten(g) Output enable time from G 1 Series 74 TTL Load, 55 75 ns Input tdis Output disable time from G or E, whichever occurs first tr 20 ns, 0 45 0 60 ns Input tf 20 ns Output data valid time after change of address, tv(a) 0 0 ns E, or G, whichever occurs first UNIT TEST CONDITIONS 27C/PC128-20 27C/PC128-25 (SEE NOTES 3 AND 4) MIN MAX MIN MAX ta(a) Access time from address 200 250 ns ta(e) Access time from chip enable 200 250 ns CL = 100 pf, ten(g) Output enable time from G 1 Series 74 TTL Load, 75 100 ns Input tdis Output disable time from Go r E, whichever occurs first tr 20 ns, 0 60 0 60 ns Input tf 20 ns Output data valid time after change of address, E, or G, tv(a) 0 0 ns whichever occurs first Value calculated from 0.5 V delta to measured level. This parameter is only sampled and not 100% tested. switching characteristics for programming:v CC = 6.5 V and V PP = 13 V (SNAP! Pulse), T A = 25 C (see Note 3) PARAMETER MIN NOM MAX UNIT tdis(g) Output disable time from G 0 130 ns ten(g) Output enable time from G 150 ns recommended timing requirements for programming: V CC = 6.5 V and V PP =13 V (SNAP! Pulse), T A = 25 C (see Note 3) UNIT MIN NOM MAX UNIT tw(ipgm) Initial program pulse duration SNAP! Pulse programming algorithm 95 100 105 µs tsu(a) Address setup time 2 µs tsu(e) E setup time 2 µs tsu(g) G setup time 2 µs tsu(d) Data setup time 2 µs tsu(vpp) VPP setup time 2 µs tsu(vcc) VCC setup time 2 µs th(a) Address hold time 0 µs th(d) Data hold time 2 µs NOTES: 3. For all switching characteristics the input pulse levels are 0.4 V to 2.4 V. Timing measurements are made at 2 V for logic high and 0.8 V for logic low (reference page 10). 4. Common test conditions apply for tdis except during programming. 9

PARAMETER MEASUREMENT INFORMATION 2.08 V RL = 800 Ω Output Under Test CL = 100 pf Figure 2. AC Testing Output Load Circuit AC testing input/output wave forms 2.4 V 0.4 V 2 V 0.8 V 2 V 0.8 V AC testing inputs are driven at 2.4 V for logic high and 0.4 V for logic low. Timing measurements are made at 2 V for logic high and 0.8 V for logic low for both inputs and outputs. A0 A13 Addresses Valid ta(a) E ta(e) G DQ0 DQ7 HI-Z ten(g) tv(a) Output Valid tdis HI-Z VOH VOL Figure 3. Read Cycle Timing 10

PARAMETER MEASUREMENT INFORMATION Program Verify A0 A13 Address Stable Address N + 1 tsu(a) th(a) DQ0 DQ7 Data In Stable tsu(d) Data Out Valid tdis(g) /VOH /VOL VPP VPP VCC tsu(vpp) VCC VCC VCC tsu(vcc) E PGM G tsu(e) tw(ipgm) th(d) tsu(g) ten(g) tdis(g) and ten(g) are characteristics of the device but must be accommodated by the programmer. 13-V VPP and 6.5-V VCC for SNAP! Pulse programming. Figure 4. Program Cycle Timing 11

device symbolization This data sheet is applicable to all TI TMS27C128 CMOS EPROMs and TMS27PC128 PROMs with the data sheet revision code B as shown below. TI FML TMS27PC128 TMS 27C128 B L X P YY WW B L X P YY WW Data Sheet Revision Code Wafer Fab Code Die Revision Code Assembly Site Code Year of Manufacture Month of Manufacture 12

TYPICAL TMS27C/PC128 CHARACTERISTICS Standby Supply Current (Normalized) 1.50 1.25 1.00 0.75 STANDBY SUPPLY CURRENT vs FREE-AIR TEMPERATURE V CC = 5 V Standby Supply Current (Normalized) 1.50 1.25 1.00 0.75 STANDBY SUPPLY CURRENT vs SUPPLY VOLTAGE T A = 25 C CC1 I 0.50 75 50 25 0 25 50 75 100 125 CC1 I 0.50 4.25 4.5 4.75 5 5.25 5.5 5.75 T A Free-Air Temperature C V CC Supply Voltage V Active Supply Current (Normalized) CC2 I 1.50 1.25 1.00 0.75 V CC = 5 V ACTIVE SUPPLY CURRENT vs FREE-AIR TEMPERATURE 0.50 75 50 25 0 25 50 75 100 125 Active Supply Current (Normalized) CC2 I 1.50 1.25 1.00 0.75 ACTIVE SUPPLY CURRENT vs SUPPLY VOLTAGE T A = 25 C f = Max 0.50 4.25 4.5 4.75 5 5.25 5.5 5.75 T A Free-Air Temperature C V CC Supply Voltage V A Acctss Time (Normalized) 1.50 1.25 1.00 0.75 V CC = 5 V ACCESS TIME vs FREE-AIR TEMPERATURE A Access Time (Normalized) T 1.50 1.25 1.00 0.75 T A = 25 C ACCESS TIME vs SUPPLY VOLTAGE T 0.50 75 50 25 0 25 50 75 100 125 T A Free-Air Temperature C 0.50 4.25 4.5 4.75 5 5.25 5.5 5.75 V CC Supply Voltage V 13

IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE ( CRITICAL APPLICATIONS ). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER S RISK. In order to minimize risks associated with the customer s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI s publication of information regarding any third party s products or services does not constitute TI s approval, warranty or endorsement thereof. Copyright 1998, Texas Instruments Incorporated