PART. MAX1103EUA C to + 85 C 8 µmax +4V. MAX1104EUA C to + 85 C 8 µmax V DD +Denotes a lead(pb)-free/rohs-compliant package.

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19-1873; Rev 1; 1/11 8-Bit CODECs General Description The MAX112/MAX113/MAX114 CODECs provide both an 8-bit analog-to-digital converter () and an 8-bit digital-to-analog converter () with a 4-wire logic interface. The MAX112/MAX113 include an onboard +2V/+4V reference, providing a well-regulated, low noise reference for both the and. The MAX114 offers ratiometric conversion, with the reference internally connected to V DD. The MAX112/MAX113/MAX114 are low-cost, lowpower CODECs for use with microcontrollers (µcs). They allow for greater flexibility when selecting a µc. Less expensive µcs without onboard converters can be used while maintaining overall system performance. The MAX112 operates from a single +2.7V to +3.6V supply, the MAX113 operates from a +4.5V to +5.5V supply, and the MAX114 operates from a +2.7V to +5.5V supply. The MAX112/MAX113 incorporate a V DD monitor in addition to AIN for power supply monitoring. All devices feature a low 18µA standby mode, where both data converters are disabled while the reference remains active, and three shutdown modes: disabled, disabled, and complete shutdown (1µA). A quick 1µs wake-up time allows the MAX112/MAX113/MAX114 to cycle in and out of shutdown even during short-duration idle times. The MAX112/MAX113/MAX114 are available in a space-saving 8-pin µmax package. Applications Analog I/O for Microcontrollers Analog System Signal Supervision Voice Recording and Playback Functional Diagram V DD Features 8-Bit ±1LSB INL Built-In Track-and-Hold 48dB of SINAD 8-Bit ±1LSB INL 55dB of SFDR Internal Conversion Clock Single-Supply Operation +2.7V to +3.6V (MAX112) +4.5V to +5.5V (MAX113) +2.7V to +5.5V (MAX114) Low Power Consumption.5mA at 25ksps 1µA Shutdown Mode 6MHz 4-Wire SPI, QSPI, and MICROWIRE Compatible Interface Compact 8-Pin µmax Package Internal Voltage Reference +2V: MAX112 +4V: MAX113 Power-Supply Monitor (MAX112/MAX113) Rail-to-rail Output Buffer PART Ordering Information TEMP RANGE PIN- PA CKA GE REFER ENC E MAX112EUA+ - 4 C to + 85 C 8 µmax +2V MAX113EUA+ - 4 C to + 85 C 8 µmax +4V MAX114EUA+ - 4 C to + 85 C 8 µmax V DD +Denotes a lead(pb)-free/rohs-compliant package. Pin Configuration MAX112/MAX113/MAX114 DIN D SERIAL INTERFACE AND CONTROL LOGIC MAX112 MAX113 MAX114 VOLTAGE REFERENCE LATCH T/H V DD/2 AIN A TOP VIEW V DD GND AIN 1 2 3 4 + MAX112 MAX113 MAX114 8 7 6 5 DIN D GND µmax µmax is a registered trademark of Maxim Integrated Products, Inc. SPI/QSPI are trademarks of Motorola, Inc. MICROWIRE is a trademark of National Semiconductor Corp Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim s website at www.maxim-ic.com.

MAX112/MAX113/MAX114 ABSOLUTE MAXIMUM RATINGS V DD to GND...-.3V to +6V AIN,, D to GND...-.3V to (V DD +.3V) DIN,, to GND...-.3V to +6V Continuous Power Dissipation (T A = +7 C) 8-Pin µmax (derate 4.1mW/ C above +7 C)...33mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTI Operating Temperature Range...-4 C to +85 C Maximum Junction Temperature...+15 C Storage Temperature Range...-65 C to +15 C Lead Temperature (soldering,1s)...+3 C Soldering Temperature (reflow)...+26 C (V DD = +2.7V to +3.6V (MAX112), V DD = +4.5V to +5.5V (MAX113), V DD = +2.7V to +5.5V (MAX114), f = 6.MHz (5% duty cycle), R = 1kΩ, C = 1pF, T A = T MIN to T MAX. Typical values are at T A = +25 C, unless otherwise noted.) PARAMETER SYM B O L CONDITIONS MIN TYP MAX UNITS DC ACCURACY (Note 1) Resolution 8 Bits Relative Accuracy (Note 2) INL All codes ±1/4 ±1 LSB Differential Nonlinearity DNL Guaranteed monotonic ±1/4 ±1 LSB Offset Error ±1 LSB Gain Error MAX112/MAX113 ±5 % (Note 3) MAX114 ±1 LSB DYNAMIC SPECIFICATIONS (f AIN = 1kHz SINE WAVE. V AIN =.9 V REFp-p ) Signal to Noise and Distortion Ratio SINAD 48 db Spurious-Free Dynamic Range SFDR 59 db Total Harmonic Distortion THD 58 db Full-Power Bandwidth 2.5 MHz Wake-Up Time from Standby Reference enabled (MAX112/MAX113) 3 µs Wake-Up Time from Full MAX112/MAX1113 2 Shutdown MAX114 3 ANALOG INPUT Analog Input Voltage V AIN V REF V Input Resistance R IN 1 MΩ Input Capacitance C IN 2 pf VOLTAGE REFERENCE MAX112 2 Reference Voltage V REF MAX113 4 µs V Temperature Coefficient MAX112/MAX113 1 ppm/ o C CONVERSION RATE Conversion Time t CONV 24 36 µs Track/Hold Acquisition Time t ACQ 3.5 µs Internal Clock Frequency 375 khz 2

ELECTRICAL CHARACTERISTI (continued) (V DD = +2.7V to +3.6V (MAX112), V DD = +4.5V to +5.5V (MAX113), V DD = +2.7V to +5.5V (MAX114), f = 6.MHz (5% duty cycle), R = 1kΩ, C = 1pF, T A = T MIN to T MAX. Typical values are at T A = +25 C unless otherwise noted.) PARAMETER SYM B O L CONDITIONS MIN TYP MAX UNITS Throughput Rate in continuous conversion mode 25 ksps DC ACCURACY Resolution 8 Bits Relative Accuracy (Note 2) INL ±1/4 ±1 LSB Differential Nonlinearity DNL Guaranteed monotonic ±1/4 ±1 LSB Offset Error ±3 mv Gain Error MAX112/MAX113 ±5 % (Note 3) MAX114 ±3 mv DYNAMIC SPECIFICATIONS (f = 1kHz SINE WAVE, V =.9 V REFp-p ) Spurious-Free Dynamic Range SFDR 55 db Total Harmonic Distortion THD 53 db Small-Signal Bandwidth 1 MHz Full-Power Bandwidth 72 khz Wake-Up Time from Standby (Note 4) Wake-Up Time from Full Shutdown (Note 4) PUT Reference enabled (MAX112/MAX113) 1 µs MAX112/MAX113 2 MAX114 1 Full-Scale Swing MAX114 Settling Time (Note 5) Settle to within ±1/2 LSB 11 µs Slew Rate 1.2 Vµs Load Regulation LOGIC INPUTS AND PUTS (DIN, SLCK, ) R L open to 1kΩ < V < V DD -.1V Input High Voltage V IH V DD x.7 V DD -.1 µs V.5 LSB Input Low Voltage V IL V DD x.3 Input Current V LOGIC = V GND or V DD ±.1 ±5 µa Digital Input Hysteresis.5 V Digital Input Capacitance 15 pf Output High Voltage V OH I SOURCE = 1.mA Output Low Voltage V OL I SINK = 1.mA Three-State Leakage I LEAK ±5. µa V DD x.9 V DD x.1 V V V V MAX112/MAX113/MAX114 3

MAX112/MAX113/MAX114 ELECTRICAL CHARACTERISTI (continued) (V DD = +2.7V to +3.6V (MAX112), V DD = +4.5V to +5.5V (MAX113), V DD = +2.7V to +5.5V (MAX114), f = 6.MHz (5% duty cycle), R = 1kΩ, C = 1pF, T A = T MIN to T MAX. Typical values are at T A = +25 C unless otherwise noted.) PARAMETER SYM B O L CONDITIONS MIN TYP MAX UNITS POWER SUPPLY REQUIREMENTS MAX112 2.7 3.6 Supply Voltage V DD MAX113 4.5 5.5 MAX114 2.7 5.5 on (25ksps), off.25.5 Supply Current I CC off, on (V DD = +5.5V).4.66 Standby Current off, off, clock off, reference on 18 35 µa Full Shutdown Current off, off, clock off 1 µa TIMING CHARACTERISTI (Figures 4a and 4b) (V DD = +2.7V to +3.6V (MAX112), V DD = +4.5V to +5.5V (MAX113), V DD = +2.7V to +5.5V (MAX114), f = 6.MHz (5% duty cycle), R = 1kΩ, C = 1pF, T A = T MIN to T MAX. Typical values are at T A = +25 C unless otherwise noted.) PARAMETER SYM B O L CONDITIONS MIN TYP MAX UNITS Power Up to Reset Complete t9 4 µs Rise-to-D = High-Z t1 4 ns Fall-to-D Valid t11 R D = 3kΩ, C D = 5pF 6 ns Fall-to- Rise t3 15 ns Fall-to- Rise t8 25 ns DIN-to- Setup Time t4 1 ns DIN-to- Hold Time t5 15 ns Fall to D Valid t6 R D = 3kΩ, C D = 5pF 78 ns Maximum Frequency f 6 MHz Pulse Width High t CH 6 ns Pulse Width Low t CL 7 ns V ma Note 1: MAX112/MAX114 tested with V DD = +3V. MAX113 tested with V DD = +5V. Note 2: Relative accuracy is the deviation of the analog value at any code from its theoretical value after the gain error and offset error have been nulled. Note 3: Gain error calculation is referenced to the ideal FS output. Gain error for the MAX112/MAX113 also includes reference initial accuracy error. Note 4: Wake-up time is the time it takes for the output to settle to within ±1/2 LSB of the FS value after a power-up command. Note 5: Output settling time is measured by taking the from code hex to FFhex. 4

Typical Operating Characteristics (V DD = +3.V (MAX112), V DD = +5V (MAX113), f = 6.MHz (5% duty cycle), R = 1kΩ, C = 1pF, T A = +25 C, unless otherwise noted.) SUPPLY CURRENT (µa) SUPPLY CURRENT (µa) GAIN ERROR (%FS) 3 25 2 15 1 5 2 15 1 5 2. 1.75 1.5 1.25 1..75.5.25 SUPPLY CURRENT vs. SUPPLY VOLTAGE ( ENABLED, DISABLED) CODE = AAhex 2.5 3. 3.5 4. 4.5 5. 5.5 SUPPLY VOLTAGE (V) SHUTDOWN SUPPLY CURRENT vs. SUPPLY VOLTAGE and OFF REFERENCE ON 2.5 3. 3.5 4. 4.5 5. 5.5 SUPPLY VOLTAGE (V) V REF = 2.V CODE = FFhex,, and REFERENCE OFF GAIN ERROR vs. SUPPLY VOLTAGE 2.5 3. 3.5 4. 4.5 5. 5.5 SUPPLY VOLTAGE (V) MAX112 toc1 MAX112 toc4 MAX112 toc7 SUPPLY CURRENT (µa) OFFSET ERROR (mv) GAIN ERROR (mv) 35 3 25 2 15 1 5 5. 4.5 4. 3.5 3. 2.5 2. 1.5 1..5 1 9 8 7 6 5 4 3 2 1 SUPPLY CURRENT vs. SUPPLY VOLTAGE ( ENABLED, DISABLED) CODE = FFhex CODE = hex 2.5 3. 3.5 4. 4.5 5. 5.5 SUPPLY VOLTAGE (V) OFFSET ERROR vs. SUPPLY VOLTAGE 2.5 3. 3.5 4. 4.5 5. 5.5 SUPPLY VOLTAGE (V) GAIN ERROR vs. TEMPERATURE V REF = 2.V CODE = 7Fhex -4-15 1 35 6 85 TEMPERATURE ( C) MAX112 toc2 MAX112 toc5 MAX112 toc8 SUPPLY CURRENT (µa) OFFSET ERROR (mv) GAIN ERROR (mv) 5 45 4 35 3 25 2 15 1 5 1 9 8 7 6 5 1 SUPPLY CURRENT vs. SUPPLY VOLTAGE ( ENABLED, ENABLED) CODE = FFhex CODE = hex CODE = AAhex 2.5 3. 3.5 4. 4.5 5. 5.5 SUPPLY VOLTAGE (V) CODE = Ahex OFFSET ERROR vs. SUPPLY VOLTAGE 2.5 3. 3.5 4. 4.5 5. 5.5 SUPPLY VOLTAGE (V) 9 8 7 6 5 4 3 2 1 GAIN ERROR vs. SUPPLY VOLTAGE V REF = 2.V CODE = FFhex 2.5 3. 3.5 4. 4.5 5. SUPPLY VOLTAGE (V) MAX112 toc3 MAX112 toc6 MAX112 toc9 5.5 MAX112/MAX113/MAX114 5

MAX112/MAX113/MAX114 GAIN ERROR (mv) INTERGRAL NONLINEARITY (LSB) 2 15 1 5 1..75.5.25 GAIN ERROR vs. TEMPERATURE V DD = +5.V V REF = +2.V CODE = FFhex -4-15 1 35 6 85 -.25 -.5 -.75 TEMPERATURE ( C) INTEGRAL NONLINEARITY vs. CODE MAX112 toc1 MAX112 toc13 PUT VOLTAGE (mv) DIFFERENTIAL NONLINEARITY (LSB) 16 14 12 1 8 6 4 2 1..75.5.25 -.25 -.5 -.75 Typical Operating Characteristics (continued) (V DD = +3.V (MAX112), V DD = +5V (MAX113), f = 6.MHz (5% duty cycle), R = 1kΩ, C = 1pF, T A = +25 C, unless otherwise noted.) PUT LOW VOLTAGE vs. PUT SINK CURRENT V DD = +5.V CODE = hex CODE = Ahex 2 4 6 8 1 PUT SINK CURRENT (ma) DIFFERENTIAL NONLINEARITY vs. CODE MAX112 toc11 MAX112 toc14 PUT VOLTAGE (V) INTERGRAL NONLINEARITY (LSB) 3.95 3.9 3.85 3.8 3.75 3.7 3.65 3.6 3.55 1..75.5.25 -.25 -.5 -.75 PUT HIGH VOLTAGE vs. PUT SOURCE CURRENT CODE = FFhex CODE = Fhex V DD = +5.V V REF = +4.V 2 4 6 8 1 PUT SOURCE CURRENT (ma) INTEGRAL NONLINEARITY vs. CODE MAX112 toc12 MAX112 toc15-1. 5 1 15 2 25 PUT CODE 3-1. 5 1 15 2 25 PUT CODE 3-1. 5 1 15 2 25 PUT CODE 3 DIFFERENTIAL NONLINEARITY (LSB) 1..75.5.25 -.25 -.5 -.75 DIFFERENTIAL NONLINEARITY vs. CODE MAX112 toc16 WORST-CASE 1LSB DIGITAL STEP CHANGE (POSITIVE) MAX112 toc17 3V 2mV/div WORST-CASE 1LSB DIGITAL STEP CHANGE (NEGATIVE) MAX112 toc18 3V 2mV/div -1. 5 1 15 2 25 PUT CODE 3 1µs/div 1µs/div 6

Typical Operating Characteristics (continued) (V DD = +3.V (MAX112), V DD = +5V (MAX113), f = 6.MHz (5% duty cycle), R = 1kΩ, C = 1pF, T A = +25 C, unless otherwise noted.) POSITIVE SETTLING TIME MAX112 toc19 MAGNITUDE (db) 1µs/div -2-4 -6-8 -1 V DD = +4.5V F SAMPLE = 24.576kHz F L = 1.2kHz 3V 1V/div FFT NEGATIVE SETTLING TIME MAX112 toc2 MAX112 toc22 1µs/div MAGNITUDE (db) 4 2-2 -4-6 -8 V DD = +4.5V 3V 1V/div FFT CLOCK FEEDTHROUGH MAX112 toc23 1µs/div MAX112 toc21 3V 2mV/div MAX112/MAX113/MAX114-12 -1-14 2 4 6 8 1 12 14 FREQUENCY (khz) -12 1 2 3 4 5 6 7 8 9 1 FREQUENCY (khz) 7

MAX112/MAX113/MAX114 PIN NAME FUNCTION 1 V DD Voltage Supply 2 GND Ground 3 AIN Analog Input 4 Analog Voltage Output 5 Chip Select Input. Device ignores all logic signals when is high. Detailed Description The MAX112/MAX113/MAX114 are 8-bit CODECs in a compact 8-pin package. These devices consist of an 8-bit, an 8-bit, track/hold (T/H), output buffer amplifier, internal voltage reference, input multiplexer (mux) and a 6MHz SPI, QSPI and MICROWIRE compatible 4-wire serial interface. A single 8-bit word configures the MAX112/MAX113/MAX114, providing a simple interface to a microcontroller (µc). Analog-to-Digital Converter The MAX112/MAX113/MAX114 section uses a successive-approximation (SAR) conversion technique and input T/H circuitry to convert an analog signal to an 8-bit digital output. No external hold capacitors are required. The MAX112/MAX113 have an input multiplexer that directs either AIN or V DD /2 to the input of the T/H, allowing these devices to either convert the analog input, or monitor the power supply. Figure 1 Pin Description 6 Serial Clock Input. Data in is latched on the rising edge, data out transitions on the falling edge. 7 D Digital Output. Output is high impedance when is high. 8 DIN Digital Input. Input ignores all signals when is high. shows the detailed functional diagram of the block. Operation The input architecture of the is illustrated in Figure 2, the equivalent input circuit, and is composed of the T/H, input mux (MAX112/MAX113), input comparator, switched capacitor, and the auto-zero rail. The switched capacitor is independent of the R-2R ladder and does not provide the converted analog output on. The T/H is in hold mode while a conversion is taking place. Once the conversion is completed, the T/H enters acquisition mode, and tracks the input signal until the start of the next conversion. In single conversion mode, conversion starts at the falling clock edge corresponding to the last bit of the control word. In continuous conversion mode, the first conversion following the control word starts on the falling clock edge of the DIN CONTROL LOGIC/2 INTERNAL OSCILLATOR MAX112 MAX113 AIN V DD /2 ANALOG INPUT MUX T/H CHARGE REDISTRIBUTION SUCCESSIVE APPROXIMATION REGISTER INTERNAL OSCILLATOR ANALOG PUT INPUT SHIFT REGISTER MUX D Figure 1. Detailed Functional Diagram 8

LSB of the control word. Successive conversions are initiated after the last bit of the previous conversion result has been clocked out. Resultant data is only available after conversion is complete. The time required for the T/H to acquire an input signal is a function of how quickly its input capacitance is charged. If the input signal s source impedance is high, the acquisition time lengthens, and more time must be allowed between conversions. This time, t ACQ2, is calculated by the following equation: t ACQ2 = (6.2 R S 15pF) + t ACQ where R S = the source impedance of the input signal; t ACQ is the T/H acquisition time from the Electrical Characteristics table. AIN HOLD TRACK 5pF V REF 15pF CAPACITIVE Figure 2. Equivalent Input Circuit GND HOLD ZERO V DD /2 TRACK MAX112 MAX113 MAX114 Conversion Progress The comparator s negative input is connected to the auto-zero rail. Since the device requires only a single supply, the ZERO node at the input of the comparator equals V DD /2. The capacitive restores node ZERO to have no voltage difference at the comparator inputs within the limits of an 8-bit resolution. Input Voltage Range Internal protection diodes that clamp the analog input to V DD and GND allow AIN to swing from (VGND -.3V) to (V DD +.3V) without damaging the device. However, for accurate conversions, the input must not exceed (V DD +.5V) or be less than (V GND -.5V). The valid input range for the analog input is from GND to V REF. The output code is invalid (code zero) when a negative input voltage is applied, and full scale (FS) when the input voltage exceeds the reference. Input Bandwidth The s input tracking circuitry has a 2.5MHz fullpower bandwidth, so it is possible to digitize highspeed transient events and measure periodic signals with bandwidths exceeding the s sampling rate by using undersampling techniques. To avoid high-frequency signals being aliased into the frequency band of interest, low-pass filters such as the MAX7418 MAX7426 are recommended. Digital-to-Analog Converter The MAX112/MAX113/MAX114 section uses an R-2R ladder network that converts the 8-bit digital input into an equivalent analog output voltage proportional to the applied reference voltage (Figure 3). The features a double-buffered input, and a buffered analog output. MAX112/MAX113/MAX114 R R R R R R R 2R 2R 2R 2R 2R 2R 2R 2R 2R REF GND LSB MSB _ REGISTER NOTE: SWITCH POSITIONS SHOWN FOR CODE FFhex. Figure 3. Simplified Circuit Diagram 9

MAX112/MAX113/MAX114 Output Buffer The MAX112/MAX113/MAX114 analog output is internally buffered by a precision unity-gain buffer that slews at 1.2V/µs (typ). The output swings from V GND to V DD -.1V. With a to V DD -.1V (or V DD -.1V to ) A D DIN AIN t3 output transition, the amplifier output typically settles to 1/2LSB in 11µs when loaded with 1kΩ in parallel with 1pF. The buffer amplifier is stable with any combination of resistive ( 1kΩ) or capacitive ( 1pF) loads. CONVERSION CYCLE ( PREVIOUSLY ENABLED. DISABLED) t11 t4 D7 D6 D5 D4 D3 D2 D1 D t5 MSB CONTROL WORD LSB INPUT SAMPLING INSTANT Figure 4a. Serial Interface Timing Diagram. enabled and disabled. tconv D7 D6 D5 D4 D3 D2 D1 D MSB CONVERSION RESULT LSB t1 t3 VDD A twake-up tsettling t3 t3 D t4 DIN D7 D6 D5 D4 D3 D2 D1 D D7 D6 D5 D4 D3 D2 D1 D t5 MSB CONTROL WORD LSB MSB LSB Figure 4b. Serial Interface Timing Diagram. disabled and disabled. 1

Serial Interface and Control Logic The MAX112/MAX113/MAX114 have 4-wire serial interfaces (Figure 4). The,, and DIN inputs are used to control and configure the device, while the three-state D provides access to the conversion result. DIN also serves as the data input to the. The serial interface provides easy connection to µcs with SPI, QSPI, and MICROWIRE serial interfaces at clock rates up to 6MHz. For SPI and QSPI, set CPOL = CPHA = in the SPI control registers of the µc. Figure 4 gives detailed timing information. Digital Inputs and Outputs The logic levels of the MAX112/MAX113/MAX114 digital inputs are set to accept voltage levels from both +3V and +5V systems regardless of the supply voltages. Performing a Conversion Configuring the MAX112/MAX113/MAX114 The MAX112/MAX113/MAX114 must be configured before a conversion can occur. Following falling, on each rising edge of, a bit from DIN is clocked into the MAX112/MAX113/MAX114 s internal shift register. After falls, the first arriving logic 1 bit defines the MSB of the control byte (START). Until the START bit arrives, any number of logic bits can be clocked into DIN with no effect. Table 1 shows the control-byte format. Table 1. Control-Byte Format The control word sets the mode in which the MAX112/ MAX113/MAX114 operate. The enable bits, E to E2, determine what sections of the device are operating by either enabling or shutting down the two converters and voltage reference (see Shutdown Modes). The enable bits are independent of the address bits; for example, the need not be addressed for it to be shutdown or powered up. C and C1 are the control bits. C sets the conversion mode, either single or continuous (see Conversion Modes). C1 determines whether the monitors V DD /2 or AIN (see Power Sense). When changing C1, two control words must be written. The first control word changes the state of the mux. Then wait 3.5µs for the T/H to acquire the new input. Finally, the second control word causes the conversion to take place. For MAX114 set C1 =. A is the address bit. A logic 1 on A addresses the. The control word configures the. A logic on A deselects the. In this state, the is still active, but does not perform any conversions. A1 is the address bit. A logic 1 on A1 addresses the. The control word configures the, and the eight bits following the control word are read in as data. The converted analog output is available after the eighth data bit is read into the device. A logic deselects the. In this state the is still active, but ignores any digital inputs. Both the and can be addresses from the same control word, allowing both converters to operate simultaneously. MAX112/MAX113/MAX114 BIT NAME DESCRIPTION 7 (MSB) START 1 = designates a new control word. = control word ignored, unless byte is data. 6 A1 1 = addressed. Current byte configures, the following byte is data. = not addressed. 5 A 4 C1* 1 = addressed. Current byte configures. After the 36µs conversion time, the next eight clock cycles clock out the conversion result. = not addressed. 1 = input to V DD /2. = input to AIN. 3 C 1 = Continuous conversion. Control word not required unless the device is reconfigured. = Single conversion. New control word required before next conversion. 2 E2 1 = Reference enabled. = Reference disabled. Don t care for MAX114. 1 E1 1 = enabled. = disabled. E 1 = enabled. = disabled. * Leave C1 = for MAX114. 11

MAX112/MAX113/MAX114 Configuring the When configuring the immediately following power-up, the first control word enables the and sets the T/H to track mode. Then wait 2µs for the internal reference to stablize (3µs typical from standby mode). Finally, the second control word sets the into either single or continuous mode and causes conversion to take place. Conversion Modes The MAX112/MAX113/MAX114 have two conversion modes, single and continuous. In single conversion mode (C = ), a control word must be written before an conversion result can be read, or input data is accepted. Once a conversion has occurred, the device will ignore any input until a new control word is written. Figures 5 and 6 show the and single conversion mode timing diagrams. DIN ON ON ON In continuous conversion mode (C = 1), the device maintains its configuration from a single control word, and continuously updates the conversion result, or accepts new input data. When operating the and simultaneously, both converters must be in the same conversion mode. Single Conversion Mode Set C = to select single conversion mode. The falling edge of after the eighth bit of each control word causes the to switch from track to hold mode and begin conversion. To avoid corruption of the conversion result, must be disabled for 36µs (Figure 6). After completing the conversion, the automatically returns to track mode, and the next eight clock cycles shift out the result on D. A minimum of 3.5µs in track mode is required for complete acquisition. OFF ON NOTE: "S" DENOTES THE BEGINNING OF A CONTROL WORD Figure 5. Single Conversion Mode Timing Diagram DIN S ON ON ON OFF S ON ON ON AIN t CONV 1 tconv ACQUISITION MODE 2 ACQUISITION MODE 3 4 D MSB LSB ACQUISITION MSB LSB MODE MSB LSB MSB LSB CONVERSION RESULT FOR 1 CONVERSION RESULT FOR 2 CONVERSION CONVERSION RESULT FOR 3 RESULT FOR 4 Figure 6. Single Conversion Mode Timing Diagram 12

DIN OFF Figure 7. Continuous Conversion Mode Timing Diagram DIN AIN D S ON ON T/MIN ACQUISITION MODE 1 MSB LSB 2 CONVERSION RESULT FOR 1 t CONV MSB LSB 3 CONVERSION RESULT FOR 2 ON ON MSB LSB CONVERSION RESULT FOR 3 S ON ON 4 5 MSB LSB CONVERSION RESULT FOR 4 6 MSB LSB CONVERSION RESULT FOR 5 7 MSB LSB CONVERSION RESULT FOR 6 MAX112/MAX113/MAX114 Figure 8. Continuous Conversion Mode Timing Diagram Continuous Conversion Mode Once the is configured in continuous conversion mode, the analog output,, is updated at the rising edge of every eighth clock pulse (Figure 7). To exit continuous conversion mode, toggle. The device requires a new control word before any further conversions take place. PUT CODE 11111111 1111111 1111111 FULL-SCALE TRANSITION Continuous Conversion Mode Set C = 1 to select continuous conversion mode. The falling edge of after the eighth bit of the control word causes the to switch from track to hold mode and begin conversion. To avoid corruption of the conversion result, must be disabled for 36µs (Figure 8). After completing the conversion, the automatically returns to track mode, and the next eight clock cycles shift out the result on D. The falling edge of during the eighth bit of the result will again cause the to switch from track to hold mode and begin the next conversion. 11 1 1.5 1.5 2.5 FS (IN-) INPUT VOLTAGE (LSB) FS - 1.5LSB Figure 9. Input/Output Transfer Function 13

MAX112/MAX113/MAX114 A minimum of 3.5µs in track mode is required for complete acquisition. In continuous -only conversion mode, a new control word (START = 1) reconfigures the device. Interrupted Communication Results If transitions from low to high during the reception of a control word, the MAX112/MAX113/MAX114 enters its power-on reset state (full shutdown mode). If is toggled while receiving data, the input is ignored and any received bits are discarded. In both cases, once returns low, the device requires a new control word before further conversions can occur. If goes high while data is read from the device, D enters a high-impedance state, and the serial clock is ignored. When returns low, the remaining bits of the conversion result can be clocked out. Applications Information Power-On Reset When power is first applied, the device enters full shutdown mode and the registers are reset to. To wake up the device, the proper control word must be written and 2µs allowed for the internal reference to stablize. data may be written to the device immediately following the control word, but will not finish settling until the wake-up time has passed. Power Sense The MAX112/MAX113 provide a multiplexer which sets the T/H to either AIN or one-half of V DD. With C1 = 1, the converts the V DD /2 voltage, providing power sensing capability to the system. When switching the input multiplexer, two control words must be written before any conversion takes place. The first control word changes the multiplexer state, and the second starts the conversion. Reference The full-scale range of both the and is set by the internal voltage reference. The MAX112 provides a +2.V reference, the MAX113 has a +4.V reference, and the MAX114 uses V DD as the reference voltage. Transfer Function Figure 9 depicts the input/output transfer function. Code transitions occur at the center of every LSB step. Output coding is binary; with a 2.V reference 1LSB = (V REF /256) = 7.8125mV. Full scale is achieved at V AIN = V REF - 1.5LSB. Negative input voltages are invalid and give a zero output code. Voltages greater than full scale give an all ones output code. Shutdown Modes The MAX112/MAX113/MAX114 feature four software-selectable shutdown modes, helping to conserve power by disabling any unused portion of the device. Bits through 2 of the control word select the device shutdown mode (Table 1). Table 2 details the four power modes with the corresponding supply current and operating sections. The and are individually controlled and can be shutdown independently of each other. Bit (E) controls the, a logic 1 enables the, a logic disables the. Bit 1 (E1) controls the, a logic 1 enables the, a logic disables the. Either the or or both can be shutdown, conserving power when one or both converters are not in use. A fast wake-up time (3µs, 1µs ) allows the converters to be cycled in and out of shutdown even during short duration idle times. Data can be written to the while it is in shutdown. A control word with A1 = 1 and E = disables the while allowing data to be written to the. The eight bits following this control word are shifted into the register. Conversion takes place once the is enabled. Table 2. Operation Modes BIT SUPPLY CURRENT OPERATING SECTIONS E2 E1 E REF 1µA Off Off Off 1 18µA On Off Off 1 1 25µA On On Off 1 1 4µA On Off On 1 1 1 52µA On On On 14

GND GND SYSTEM POWER SUPPLIES 1µF.1µF MAX112 MAX113 MAX114 DGND +3V/+5V Two control words are necessary to enable the. The first control word brings the out of shutdown, and sets the T/H in acquisition mode. The second control word initiates the conversion. Bit 2 (E2) controls the reference. A logic 1 enables the reference, a logic disables the reference, further reducing power consumption. V DD Figure 1. Power-Supply Connections 1Ω V DD DIGITAL CIRCUITRY Power Supply Bypassing and Layout For best performance, use printed circuit boards. Wirewrap boards are not recommended. Board layout should ensure that digital and analog signal lines are separated from each other. Do not run analog and digital (especially clock) lines parallel to one another or run digital lines underneath the device. Figure 1 shows the recommended system-ground connections. A single-point analog ground (star-ground point) should be established at the device ground. Connect all analog grounds to the star ground. No digital-system ground should be connected to this point. The ground return to the power supply for the star ground should be connected to this point. The ground return to the power supply for the star ground should be low impedance and as short as possible for noisefree operation. High-frequency noise in the VDD power supply may affect device performance. Bypass the supply to the star ground with.1µf and 1µF capacitors close to the device. Minimize capacitor lead lengths for best supply-noise rejection. If the power supply is very noisy, connect a 1Ω resistor in series with VDD to form a lowpass filter. MAX112/MAX113/MAX114 15

MAX112/MAX113/MAX114 PROCESS: BiCMOS Chip Information Package Information For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages. Note that a +, #, or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE LINE NO. LAND PATTERN NO. 8 µmax U8+1 21-36 9-92 16

REVISION NUMBER REVISION DATE DESCRIPTION Revision History PAGES CHANGED 12/ Initial release 1 1/11 Changed spec in Timing Characteristics section 4 MAX112/MAX113/MAX114 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 12 San Gabriel Drive, Sunnyvale, CA 9486 48-737-76 17 211 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.