AKM AK8973 and AK8974 Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please call Sales at Chipworks. 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: 613.829.0414 Fax: 613.829.0515 www.chipworks.com
Process Review Some of the information is this report may be covered by patents, mask and/or copyright protection. This report should not be taken as an inducement to infringe on these rights. 2009 Chipworks Inc. This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization s corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information. MPR-0910-801 13999SJDWJM Revision 1.0 Published: December 11, 2009
Process Review Table of Contents 1 Overview 1.1 List of Figures 1.2 List of Tables 1.3 Company Profile 1.4 Introduction 1.5 AK8973 and AK8974 Device Summary and Comparison 1.6 AK8973 Process Summary 2 AK8973 Package and Die 2.1 Package 2.2 Die 2.3 Die Features 2.4 Package Cross-Sectional Analysis 3 AK8973 Detailed Process Analysis 3.1 General Structure 3.2 Dielectrics 3.3 Metals 3.4 Vias and Contacts 3.5 Transistors and Poly 3.6 Isolation 3.7 Wells and Substrate 4 AK8973 Magnetic Hall Sensor Analysis 4.1 Plan View Layout Analysis 4.2 Diagonal Cross-Sectional SCM and SEM Analyses 4.3 SRP Analysis 4.4 SIMS Analysis 5 AK8973 Critical Dimensions 5.1 Horizontal Dimensions 5.2 Vertical Dimensions 6 Appendix: AK8974 Comparative Device Analysis 6.1 AK8974 Package 6.2 AK8974 Die and Die Features 6.3 AK8974 Basic Package Cross-Sectional Analysis 6.4 AK8974 Basic Process Analysis
Process Review 7 References 8 Statement of Measurement Uncertainty and Scope Variation About Chipworks
Overview 1-1 1 Overview 1.1 List of Figures 1 Overview 1.4.1 3-Axis Hall Sensor Structure 2 AK8973 Package and Die 2.1.1 Package Top 2.1.2 Package Bottom 2.1.3 Plan-View Package X-Ray 2.1.4 Side-View Package X-Ray A 2.1.5 Side-View Package X-Ray B 2.1.6 Plan-View Package X-Ray with Back Plane Removed 2.2.1 Die Photograph 2.2.2 Die Markings 2.2.3 Die Photograph at Metal 1 Annotated with Functional Blocks 2.2.4 Die Photograph at Substrate (Dark Field) 2.2.5 Die Photograph at Metal 1 Annotated with Analysis Areas 2.3.1 Die Corner A 2.3.2 Die Corner B 2.3.3 Die Corner C 2.3.4 Die Corner D 2.3.5 Minimum Pitch Bond Pads 2.3.6 Bond Pad 2.3.7 Resistors and Capacitors 2.3.8 Bipolar Transistors 2.3.9 Hall Sensors 2.3.10 Mask Markings 2.4.1 Package Cross Section Overview 2.4.2 Die Edge Optical 2.4.3 Die Beneath Magnetic Concentrator SEM 2.4.4 SEM-EDS Analysis of Ag Loaded Die Attach 2.4.5 Magnetic Concentrator Optical 2.4.6 Magnetic Concentrator Right Edge Optical 2.4.7 Magnetic Concentrator Left Edge SEM 2.4.8 Magnetic Concentrator Right Edge SEM 2.4.9 Die Coat SEM 2.4.10 SEM-EDS of FeNi Magnetic Concentrator 2.4.11 SEM-EDS of Magnetic Concentrator Cu Pad 3 AK8973 Detailed Process Analysis 3.1.1 General Die Structure 3.1.2 Die Edge 3.1.3 Die Seal 3.1.4 Test Pad Edge 3.1.5 Mask Mark
Overview 1-2 3.2.1 Passivation 3.2.2 IMD 2 3.2.3 IMD 1 and PMD 3.2.4 PMD and Isolation 3.3.1 Minimum Pitch Metal 3 3.3.2 Minimum Pitch Metal 2 3.3.3 Minimum Pitch Metal 1 3.4.1 Minimum Pitch Via 2 3.4.2 Minimum Pitch Via 1 3.4.3 Minimum Pitch Contacts 3.5.1 Minimum MOS Transistor 3.5.2 Minimum Poly Pitch 3.5.3 Poly-Poly Capacitor 3.6.1 Minimum Width Isolation 3.7.1 N-Well 3.7.2 P-Well 4 AK8973 Magnetic Hall Sensor Analysis 4.1.1 Magnetic Sensor 4.1.2 Magnetic Sensor Detail 1 4.1.3 Magnetic Sensor Detail 2 4.1.4 Magnetic Sensor Detail 3 4.1.5 Magnetic Sensor Detail 4 4.1.6 Magnetic Sensor at Substrate 4.1.7 Magnetic Hall Sensor Detail at Substrate 4.1.8 Hall Sensor Device Detail at Substrate SCM 4.2.1 Diagonal Cross Section Overview SEM 4.2.2 Diagonal Cross Section Overview SCM 4.2.3 Diagonal Cross Section Detail SEM 4.2.4 Diagonal Cross Section Detail SCM 4.3.1 SRP Profile Location on Hall Sensor 4.3.2 SRP Profile for Hall Sensor 4.4.1 SIMS Profile Location on Hall Sensor 4.4.2 SIMS Profile for Hall Sensor 6 Appendix: AK8974 Comparative Device Analysis 6.1.1 AK8974 Package Top 6.1.2 AK8974 Package Bottom 6.1.3 AK8974 Plan-View Package X-Ray 6.1.4 AK8974 Side-View X-Ray 6.2.1 AK8974 Die Photograph 6.2.2 AK8974 Die Markings 6.2.3 AK8974 Die Corner 6.2.4 AK8974 Minimum Pitch Bond Pads 6.2.5 AK8974 Die Features 6.2.6 AK8974 Magnetic Sensor
Overview 1-3 6.2.7 AK8974 Hall Sensor Detail 6.2.8 AK8974 Hall Sensor at Substrate Detail 6.3.1 AK8974 Package Cross Section Overview 6.3.2 AK8974 Die Beneath Magnetic Concentrator Optical 6.3.3 AK8974 Magnetic Concentrator Right Edge SEM 6.4.1 General Structure 6.4.2 Die Seal 6.4.3 Poly-Poly Capacitor
Overview 1-4 1.2 List of Tables 1 Overview 1.4.1 AK8973 and AK8974 Sample Markings 1.5.1 Device Summary and Comparison 1.6.1 Summary of Major Process Findings for AK8973 2 AK8973 Package and Die 2.2.1 Die Utilization 2.3.1 Package and Die Horizontal Dimensions 2.4.1 Package and Die Vertical Dimensions 3 AK8973 Detailed Process Analysis 3.2.1 Dielectric Layer Thicknesses 3.3.1 Minimum Metal Horizontal Dimensions 3.3.2 Metal Layer Thicknesses 3.4.1 Minimum Via Horizontal Dimensions 3.5.1 Polysilicon Thicknesses 3.5.2 Minimum Transistors and Polysilicon Horizontal Dimensions 3.6.1 Isolation Horizontal Dimensions 3.7.1 Wells and Substrate 4 AK8973 Magnetic Hall Sensor Analysis 4.1.1 Magnetic Sensor Parameters and Horizontal Dimensions 4.2.1 Magnetic Sensor Vertical Dimensions 5 AK8973 Critical Dimensions 5.1.1 Package and Die Horizontal Dimensions 5.1.2 Minimum Metal Horizontal Dimensions 5.1.3 Minimum Via Horizontal Dimensions 5.1.4 Minimum Transistors and Polysilicon Horizontal Dimensions 5.1.5 Isolation Horizontal Dimensions 5.1.6 Magnetic Sensor Parameters and Horizontal Dimensions 5.2.1 Package and Die Vertical Dimensions 5.2.2 Dielectric Layer Thicknesses 5.2.3 Metal Layer Thicknesses 5.2.4 Polysilicon Thicknesses 5.2.5 Wells and Substrate 5.2.6 Magnetic Sensor Vertical Dimensions 6 Appendix: AK8974 Comparative Device Analysis 6.2.1 AK8974 Package and Die Horizontal Dimensions 6.3.1 AK8974 Package and Die Vertical Dimensions
Statement of Measurement Uncertainty and Scope Variation 8-1 8 Statement of Measurement Uncertainty and Scope Variation Statement of Measurement Uncertainty Chipworks calibrates length measurements on its scanning electron microscopes (SEM), transmission electron microscope (TEM), and optical microscopes, using measurement standards that are traceable to the International System of Units (SI). Our SEM/TEM cross-calibration standard was calibrated at the National Physical Laboratory (NPL) in the UK (Report Reference LR0304/E06050342/SEM4/190). This standard has a 146 ± 2 nm (± 1.4%) pitch, as certified by NPL. Chipworks regularly verifies that its SEM and TEM are calibrated to within ± 2% of this standard, over the full magnification ranges used. Fluctuations in the tool performance, coupled with variability in sample preparation, and random errors introduced during analyses of the micrographs, yield an expanded uncertainty of about ± 5%. A stage micrometer, calibrated at the National Research Council of Canada (CNRC) (Report Reference LS-2005-0010), is used to calibrate Chipworks optical microscopes. This standard has an expanded uncertainty of 0.3 µm for the stage micrometer s 100 µm pitch lines. Random errors, during analyses of optical micrographs, yield an expanded uncertainty of approximately ± 5% to the measurements. The materials analysis reported in Chipworks reports is normally limited to approximate elemental composition, rather than stoichiometry, since calibration of our SEM and TEM based methods is not feasible. Chipworks will typically abbreviate, using only the elemental symbols, rather than full chemical formulae, usually starting with silicon or the metallic element, then in approximate order of decreasing atomic % (when known). Elemental labels on energy dispersive X-ray spectra (EDS) will be colored red for spurious peaks (elements not originally in sample). Elemental labels in blue correspond to interference from adjacent layers. Secondary ion mass spectrometry (SIMS) data may be calibrated for certain dopant elements, provided suitable standards were available. Statement of Scope Variation Due to the nature of reverse engineering, there is a possibility of minor content variation in Chipworks standard reports. Chipworks has a defined table of contents for each standard report type. At a minimum, the defined content will be included in the report. However, depending on the nature of the analysis, additional information may be provided in a report, as value-added material for our customers.
AKM AK8974 Hall Sensor Analysis Appendix for AKM AK8973 and AK8974 Process Review
AKM AK8974 Electronic Compass Hall Sensor Analysis 2 Some of the information is this report may be covered by patents, mask and/or copyright protection. This report should not be taken as an inducement to infringe on these rights. 2010 Chipworks Inc. This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization s corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information. MPR-0910-801 Appendix 14282JMSDW Revision 1 Published: March 29, 2010
AKM AK8974 Electronic Compass Hall Sensor Analysis 21 About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at: Chipworks 3685 Richmond Rd. Suite 500 Ottawa, Ontario K2H 5B7 Canada T: 1.613.829.0414 F: 1.613.829.0515 Web site: www.chipworks.com Email: info@chipworks.com Please send any feedback to feedback@chipworks.com