Physically-Based Distributed Models for Multi-Layer Ceramic Capacitors

Similar documents
Non-linear Control for very fast dynamics:

Advanced Topics in EMC Design. Issue 1: The ground plane to split or not to split?

March 6-9, 2016 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive- Session 4

Understanding, measuring, and reducing output noise in DC/DC switching regulators

Power Plane and Decoupling Optimization. Isaac Waldron

Sample Question Paper

Aries Kapton CSP socket

Passive Component Analysis. OMICRON Lab Webinar Nov. 2015

Non-ideal Behavior of Electronic Components at High Frequencies and Associated Measurement Problems

Understanding and Optimizing Electromagnetic Compatibility in Switchmode Power Supplies

The Facts about the Input Impedance of Power and Ground Planes

Decoupling capacitor placement

Development and Validation of a Microcontroller Model for EMC

Decoupling capacitor uses and selection

Considerations for Capacitor Selection in FPGA Designs CARTS 2005

AP Physics C. Alternating Current. Chapter Problems. Sources of Alternating EMF

INTRODUCTION TO AC FILTERS AND RESONANCE

Grundlagen der Impedanzmessung

Exclusive Technology Feature. An Accurate Method For Measuring Capacitor ESL. ISSUE: April by Steve Sandler, Picotest, Phoenix, Ariz.

Non-Ideal Behavior of Components

Background (What Do Line and Load Transients Tell Us about a Power Supply?)

Core Technology Group Application Note 6 AN-6

SWITCHED CAPACITOR VOLTAGE CONVERTERS

Custom Interconnects Fuzz Button with Hardhat Test Socket/Interposer 1.00 mm pitch

Application Note. Piezo Amplifier. Piezoelectric Amplifier Connection. accelinstruments.com

JOHANSON DIELECTRICS INC Bledsoe Street, Sylmar, Ca Phone (818) Fax (818)

Controlling Input Ripple and Noise in Buck Converters

Application Guidelines for Non-isolated Converters AN Filtering and Layout Guidelines for Non-Isolated Converters

Application Guidelines for Non-isolated Converters AN Filtering and Layout Guidelines for Non-Isolated Converters

Chapter 30 Inductance, Electromagnetic. Copyright 2009 Pearson Education, Inc.

APPLICATION NOTE 2027 Simple Methods Reduce Input Ripple for All Charge Pumps

Verifying Simulation Results with Measurements. Scott Piper General Motors

1.5MHz, 600mA Synchronous Step-Down Regulator

PHY203: General Physics III Lab page 1 of 5 PCC-Cascade. Lab: AC Circuits

Designing a Multi-Phase Asynchronous Buck Regulator Using the LM2639

CHAPTER 6: ALTERNATING CURRENT

The Inductance Loop Power Distribution in the Semiconductor Test Interface. Jason Mroczkowski Multitest

Experiment 2: Transients and Oscillations in RLC Circuits

Application Guidelines for Non-Isolated Converters AN Input Filtering for Austin Lynx Series POL Modules

Study of Inductive and Capacitive Reactance and RLC Resonance

Lab 2: Linear and Nonlinear Circuit Elements and Networks

Input Filter Design for Switching Power Supplies Michele Sclocchi Application Engineer National Semiconductor

Aries QFP microstrip socket

Noise Aware Decoupling Capacitors for Multi-Voltage Power Distribution Systems

Importance of measuring parasitic capacitance in isolated gate drive applications. W. Frank Infineon Technologies

Designing low-frequency decoupling using SIMPLIS

LCR Parallel Circuits

Lab E5: Filters and Complex Impedance

Microwave Metrology -ECE 684 Spring Lab Exercise T: TRL Calibration and Probe-Based Measurement

PHASES IN A SERIES LRC CIRCUIT

Chapter 2 Displaying Characteristics

Best Available Copy. Advanced Filters and Components for Power Applications. ONR Grant N

Course Introduction. Content: 19 pages 3 questions. Learning Time: 30 minutes

TECHNICAL REPORT: CVEL

1.5MHz, 800mA Synchronous Step-Down Regulator

MP1496 High-Efficiency, 2A, 16V, 500kHz Synchronous, Step-Down Converter

Passive Probe Ground Lead Effects

Impact of the Output Capacitor Selection on Switching DCDC Noise Performance

1.5MHz, 3A Synchronous Step-Down Regulator

BASIS OF ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUIT Chapter VI - MODELLING PCB INTERCONNECTS Corrections of exercises

Physical RF Circuit Techniques and Their Implications on Future Power Module and Power Electronic Design

Practical Limitations of State of the Art Passive Printed Circuit Board Power Delivery Networks for High Performance Compute Systems

Application Note 323. Flex Power Modules. Input Filter Design - 3E POL Regulators

3 GHz Wide Frequency Model of Surface Mount Technology (SMT) Ferrite Bead for Power/Ground and I/O Line Noise Simulation of High-speed PCB

Current sensor by IZM

ME 365 EXPERIMENT 1 FAMILIARIZATION WITH COMMONLY USED INSTRUMENTATION

LABORATORY #3 QUARTZ CRYSTAL OSCILLATOR DESIGN

5V, 3A, 1.5MHz Buck Constant Current Switching Regulator for White LED

West Coast Magnetics. Advancing Power Electronics FOIL WINDINGS FOR SMPS INDUCTORS AND TRANSFORMERS. Weyman Lundquist, CEO and Engineering Manager

In Search of Powerful Circuits: Developments in Very High Frequency Power Conversion

MP1495 High Efficiency 3A, 16V, 500kHz Synchronous Step Down Converter

R5 4.75k IN OUT GND 6.3V CR1 1N4148. C8 120pF AD8517. Figure 1. SSTL Bus Termination

12. Output Ripple Attenuator Module (MicroRAM )

Current sensor demonstrator by IZM

EMI-Simulation of a SiC based DCDC-Converter in a CISPR25 component test setup

FMS6363 Low-Cost, Three-Channel, 6th-Order, High-Definition, Video Filter Driver

Minimizing Input Filter Requirements In Military Power Supply Designs

Filters and Ring Core Chokes

FPA Printed Circuit Board Layout Guidelines

Dual 1.5MHz, 1A Synchronous Step-Down Regulator

340KHz, 2A, Asynchronous Step-Down Regulator

ELC224 Final Review (12/10/2009) Name:

MP2307 3A, 23V, 340KHz Synchronous Rectified Step-Down Converter

Quick guide to Power. V1.2.1 July 29 th 2013

P-cell and N-cell based IGBT Module: Layout Design, Parasitic Extraction, and Experimental Verification

Accessories Selection Guide For Impedance Measurements. April 2005

ECE 497 JS Lecture 16 Power Distribution

Application of Generalized Scattering Matrix for Prediction of Power Supply Noise

BAKISS HIYANA BT ABU BAKAR JKE,POLISAS

Reducing EMI in buck converters

Internal Model of X2Y Chip Technology

A KYOCERA GROUP COMPANY. AVX Low Inductance Capacitors

POWER DELIVERY MODEL OF TEST PROBE CARDS

Passive Components around ADAS Applications By Ron Demcko, AVX Fellow, AVX Corporation

Positive to Negative Buck-Boost Converter Using LM267X SIMPLE SWITCHER Regulators

Physics 310 Lab 2 Circuit Transients and Oscilloscopes

SIMULATION OF A SERIES RESONANT CIRCUIT ECE562: Power Electronics I COLORADO STATE UNIVERSITY. Modified in Fall 2011

Filters With Inductance Cancellation Using Printed Circuit Board Transformers

Lecture 16 Date: Frequency Response (Contd.)

MP1496S High-Efficiency, 2A, 16V, 500kHz Synchronous, Step-Down Converter

Transcription:

Physically-Based Distributed Models for Multi-Layer Ceramic Capacitors Charles R Sullivan and Yuqin Sun Thayer School of Engineering Dartmouth College http://power.thayer.dartmouth.edu/

Introduction Why an RLC model won t do.

Standard RLC Model for a Cap Simple but not accurate (as much as 5X impedance error). 0.1 Ω Z 1 mω 10 khz Calculated Curve 100 µf MLC EIA 2220 X5R 400 khz 10 MHz Frequency

Measurements vs. RLC Model 100 µf MLC EIA 2220 X5R RLC Model Z 5X 0.1 Ω Z, ESR Measured Z Measured ESR 1 mω 100 khz RLC Model ESR 1 MHz 10 MHz 100 MHz Frequency

What s Going On? Inductance is distributed effect; different for each plate. High Inductance Low Inductance Behavior is like a transmission line.

Measurements

What to Measure Need to be sure measurement technique captures real in-circuit behavior. Inductance is only defined for a closed loop. Z undefined Z defined.. But includes some Z interconnect!

Defining Impedance Z total Z board Z cap = Z total Z board The relevant impedance for application with adjacent ground plane. Same inductance as Z total with zero board thickness. Can correct for resistance. How to measure: ph accuracy test fixture: Session 35, paper 2 here this afternoon.

New Low-Impedance Test Fixture Based on Agilent 4TP (four terminal pair) configuration. Less than 100 ph stray inductance, ~3 ph repeatability A V ~ DUT 3 mil (75 µm) polyimide (Kapton) Ground traces underneath

A Better Model

I. Simple Transmission Line Model T Actual system: hundreds of plates. Model as continuous distributed transmission line. Z 0

Two Parameters Describe the Transmission Line Model l w h T Parameters linked to geometry. = 1 µ 0 Z0 w C v Z 0 T = 2 hl µ C 0 v where C v is capacitance per unit volume.

Ideal Transmission-Line Behavior Calculated from geometry and ESR Z 1 Ω 0.1 Ω 10 mω Real behavior exhibits: Some ESL Much greater damping Shifted resonance frequencies Lumped Model Measured Distributed Model 1 mω 100 khz 1 MHz 10 MHz Frequency 100 MHz

II. Improving the Model External L: Models Coating Effect Damping: Real damping effects include: Series R of plates. Eddy-current losses in plates. Must model both effects

Distributed Model with Added External L 1 Ω 0.1 Ω Lumped model Measured Z 10 mω Distributed model with L ext 1 mω 100 khz 1 MHz 10 MHz 100 MHz Frequency

Model with Damping from Series R of Plates 1 Ω Z 0.1 Ω One section of transmission line Peak too high Distributed model Measured 10 mω 1 mω 100 khz 1 MHz 10 MHz 100 MHz Frequency

Add Effect of Eddy Currents in Plates 1 Ω 0.1 Ω One section of transmission line Distributed model Z 10 mω Peak positions don t match Measured 1 mω 100 khz 1 MHz 10 MHz 100 MHz Frequency

III. Final Model Improvements Damping model works OK by including Series R of plates. Eddy-current losses in plates. Last remaining discrepancy: non-uniform spacing of resonant peaks. Two possible causes: Non-uniform distributed inductance. Mutual Inductance. LM LE LD1 LD1 RM RSD1 RED RSD2 Model including mutual inductance CD RPD

Model with Both Damping Effects and Non-Uniform Inductance 1 Ω Z 0.1 Ω Distributed model Measured 10 mω 1 mω 100 khz 1 MHz 10 MHz Frequency 100 MHz

Coating Effect

Why Does Cap Have Extra Series L? Thickness of coating Coating Cap Element Opportunity: Reduce coating thickness to reduce external L and HF Z Extra Loop

Measured Effect of Coating Thickness 0.1 Ω Standard X5R 100 µf ~0.25 mm thick coating 356 ph theory 385 ph meas. Z 1 mω 100 khz Same cap with coating reduced by 0.11 mm Inductance reduction: 156 ph theoretical 169 ph actual Actual HF inductance 216 ph 1 MHz 10 MHz 100 MHz Frequency

Observations

Simple Frequency Domain Model All parameters needed to sketch impedance can be simply calculated 0.1 Ω Z Z = 1/(jωC LF ) Z = Z 0 f 0 = 1/(2T round trip ) Z = jωl EXT 1 µ 0 Z 0 w C v T = 2 hl µ 0C v 1 mω 100 khz 1 MHz 10 MHz Frequency 100 MHz = L EXT = µ 0 t cl / w

Frequency Effect of Plate Orientation 22 µf MLC capacitor square ends 0.1 Ω Z 10 mω 2 mω 0.1 Ω ESR 10 mω 1 mω 100 khz 1 MHz 10 MHz 100 MHz

Application

DC-to-DC Converter Output Filter PWM waveform and output voltage waveform. Measured V=37.6mV New model V=37.7mV Lumped RLC model V=66.4mV 12 V to 1.2 V, 1 MHz buck converter with 2 x 22 µf caps Distributed model is much better than RLC model.

Conclusions MLC capacitors exhibit distributed behavior. LRC model can have factor-of-five error. Improved distributed model can Fit measurements precisely. Match observed in-circuit behavior. Simple model is also useful conceptually. Parameters are easily obtained from geometry. High-frequency impedance: Dominated by L EXT, due to coating thickness. Reducing coating thickness can greatly reduce highfrequency impedance.