Product Data Sheet LTV-M5 Spec No.: DS7-23-9 Effective Date: 6/7/26 Revision: B LITE-ON DCC RELEASE BNS-OD-FC/A4 LITE-ON Technology Corp. / Optoelectronics No.9,Chien Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-68 Fax: 886-2-222-948 / 886-2-222-66 http://www.liteon.com/opto
Small Outline, 5Lead, High Speed Optocouplers. DESCRIPTION The consists of a high efficient AlGaAs Light Emitting Diode and a high speed optical detector. This unique design provides excellent AC and DC isolation between the input and output sides of the Optocoupler. Connection for the bias of the photodiode improves the speed that of a conventional phototransistor coupler by reducing the base-collector capacitances. The internal shield ensures high common mode transient immunity. A guaranteed common mode transient immunity is up to 5KV/μs (Min.).. Features Surface mountable High speed MBd typical Compatible with infrared vapor phase reflow and wave soldering process Very high common mode transient immunity: 5K V/μs at VCM = 5 V guaranteed TTL compatible Open collector output Lead free option Functional Diagram Pin No. and Internal connection diagram 6 5 4. Anode 3. Cathode 4. G N D 5. Vo (Output) 6. V cc Worldwide Safety approval : UL/ cul 577, Cert. No.E3898. 375 Vrms/ min 3 VDE DIN EN6747-5-5, Cert. No. 3823 V IORM = 56 V peak Truth Table (Positive Logic).2 Applications Line receivers: High common mode transient immunity (> V/μs) LED ON OFF OUT L H and low input-output capacitance (.6 pf). Ground loop elimination Feedback Element in Switching Mode Power Supplier A.μF bypass Capacitor must be connected between Pin4 and Pin6 High Speed Logic Ground Isolation TTL/TTL, TTL/LTTL,TTL/CMOS, TTL/LSTTL Pulse transformer replacement: save board space and weight Analog signal ground isolation: Integrated photon detector provides improved linearity over phototransistor type. /2
2. PACKAGE DIMENSIONS 2. D ate C ode * Halogen Free O ption*4 Factory Code *2. VDE Option *3 Notes :. The first digit is year date code, second and third digit is work week 2. Factory identification mark (W :China-CZ) 3. VDE option 4. Halogen free option * Dimensions are in Millimeters and (Inches). * Mold flash on each side is.5mm maximum 2/2
3. TAPING DIMENSIONS 3. LTV-M5 3.2 LTV-M5-TP Description Symbol Dimension in mm (inch) Tape wide W 2.3 (.472) Pitch of sprocket holes P 4. (.57) F 5.5. (.27) Distance of compartment P 2 2. (.79) Distance of compartment to compartment P 8. (.35) 3.3 Quantities Per Reel Package Type Quantities (pcs) 3 3/2
4. RATING AND CHARACTERISTICS 4. Absolute Maximum Ratings at Ta=25 C * Parameter Symbol Min Max Units Note Storage Temperature T ST -55 25 C Operating Temperature T A -55 C Isolation Voltage V ISO 375 V RMS Supply Voltage V CC -.5 3 V Lead Solder Temperature ** 26 C Input Average Forward Input Current I F 25 ma Peak Input Current (5% duty cycle, ms pulse width) Peak Transient Input Current ( μs pulse width, 3 pps) I F 5 ma I F. A Reverse Input Voltage V R 5 V Input Power Dissipation P I 45 mw Output Output Collector Current I O 8 ma Peak Output Current I O 6 ma Output Collector Voltage V O -.5 2 V Output Collector Power Dissipation P O mw *Ambient temperature = 25 C, unless otherwise specified. Stresses exceeding the absolute maximum ratings can cause permanent damage to the device. Exposure to absolute maximum ratings for long periods of time can adversely affect reliability. **26 C for seconds. Refer to Lead Free Reflow Profile. 4/2
4.2 ELECTRICAL OPTICAL CHARACTERISTICS Parameters Test Condition Symbol Min Typ Max Units Fig. Note Input Input Forward Voltage I F =6mA, T A=25 C V F.2.4.8 V 2 Input Reverse Voltage I R = μa BV R 5 V Detector Current transfer ratio I F = 6mA; V CC = 4.5V; T A = 25 C; V O =.4V I F = 6mA; V CC = 4.5V; T A = 25 C; V O =.5V CTR 2 36 5 38 % 4,5 2 Logic low output voltage output voltage I F = 6mA;V CC = 4.5V; I o = 3.mA; T A = 25 C I F = 6mA;V CC = 4.5V; I o = 2.4mA; T A = 25 C V OL.2.4.5 V I F = ma, V O = V CC = 5.5V, T A = 25 C.2.5 Logic high output current I F = ma, V O = V CC = 5V T A = 25 C I OH.5 7 T A = ~ 7 C 5 μa Logic low supply current Logic high supply current I F = 6mA, V o = open (V CC=5V) I F = ma, V o = open ; T A = 25 C (V CC = 5V) I CCL 85 I CCH.2 *Over recommended temperature (TA = C to 7 C) unless otherwise specified. *All Typical at T A =25 C 5/2
5. SWITCHING SPECIFICATION Parameters Test Condition Symbol Min Typ Max Units Fig. Note Propagation Delay Time to Low Output Level T A = 25 C 9 8 t PHL ~ C 8 3.6,9 3, 4 R L=.9KΩ ns Propagation Delay Time to High Output Level T A = 25 C 5 8 t PLH ~ C 8 3.6,9 3, 4 Logic High Common Mode Transient Immunity Logic Low Common Mode Transient Immunity I F = ma;v CM = 5Vp-p; C L = 5 pf; T A=25 C, R L=.9KΩ I F = 6mA;V CM = 5Vp-p C L = 5 pf; T A = 25 C, R L =.9KΩ CM H 5 25 KV/μs 3, 4 CM L 5 25 KV/μs 3, 4 *Over recommended temperature (TA = C to 7 C) VCC = 5 V, IF = 6mA unless otherwise specified. *All Typical at T A =25 C 6/2
6. ISOLATION CHARACTERISTIC Parameter Symbol Min. Typ. Max. Unit Test Condition Note Input-Output Insulation Leakage Current I I-O. μa 45% RH, t = 5s, V I-O = 3kV DC, T A =25 C 5 Withstand Insulation Test Voltage V ISO 375 V RMS RH 5%, t = min, T A = 25 C 5, 6 Input-Output Resistance R I-O 2 Ω V I-O = 5V DC 5 Typical values applies to T A = 25 C Note. Use of a. μf bypass capacitor connected between pins 4 and 6 is recommended. 2. Current Transfer Ratio is defined as the ratio of output collector current Io, to the forward LED input current IF, times. 3. The.9KΩ load represents TTL unit load of.6ma and the 5.6KΩ pull-up resistor. 4. The 4.KΩ load represents LSTTL unit load of.36ma and the 6.KΩ pull-up resistor. 5. Device considered a two-terminal device: Pins, 2 and 3 shorted together and Pins 4, 5 and 6 shorted together. 6. In accordance with UL577, each optocoupler is proof tested by applying an insulation test voltage 3937.5Vrms for one second (leakage current less than μa). This test is performed before the % production test for partial discharge 7/2
t P - Propagation Delay - ns t P - Propagation Delay - ns V F - Forward Voltage - V Normalized Current Transfer Ratio I O - Output Current - ma Normalized Current Transfer Ratio 7. TYPICAL PERFORMANCE CURVES Figure : DC and Pulsed Transfer Characteristics. Photocoupler Figure 4: Current Transfer Ratio vs. Input Current. 8 6 4 2 8 6 4 2 T A = 25 o C V CC = 5V 4mA 35mA 3mA 25mA 2mA 5mA ma I F = 5mA 5 5 2 V O - Output Voltage - V.2.8.6.4 Normalized to I F = 6mA V O =.4V.2 V CC = 5V T A = 25 o C. I F - Forward Current - ma Figure 2: Input Current vs. Forward Voltage. T A = 25 o C....9..2.3.4.5.6 I F - Forward Current - ma Figure 5: Current Transfer Ratio vs. Temperature..2.8.6.4 Normalized to I F = 6mA V.2 O =.4V V CC = 5V T A = 25 o C -6-4 -2 2 4 6 8 T A - Ambient Temperature - o C 6 5 Figure 3: Propagation Delay vs. Load Resistance. I F = ma I F = 6mA 5 4 Figure 6: Propagation Delay Time vs.temperature. I F = 6mA, V CC = 5.V R L =.9KΩ 4 t PLH 3 3 t PLH 2 2 t PHL t PHL R L - Load Resistance - kω -6-4 -2 2 4 6 8 T A - Ambient Temperature - o C 8/2
I OH - Logic High Output Current - na Normalized Response - db Photocoupler Figure 7: Logic High Output Current vs. Temperature. Figure 8: Frequency Response. I F = V O = V CC = 5.V 5-5 - -5 T A = 25 o C I F = 6mA V CC = 5.V R L = Ω R L = 22Ω R L = 47Ω R L = KΩ -2-6 -2 2 6 T A - Temperature - o C -25.. f - Frequency - MHz Figure 9: Switching Test Circuit. IF VO IF tphl VO.5V.5V tplh VOL 5V 5V P U LSE G E N. Z O = 5Ω t r = 5 ns I F % DUTY CYCLE /f < 5us P U LSE G E N. Z O = 5Ω I F M O N ITOt r R= 5 ns I F % DUTY CYCLE R M /f < 5us 3 6 5 4 6. uf 5 R L +5V V O R L C L =5 pf +5V V O tphl VCM V.5V S W A: I F=m A 9% % tr S W B: I F=.6m A tr,tf=6ns V tf.5v tplh VOL Figure : Test Circuit for Transient Immunity and Typical Waveforms. VCM V VO VO % 9% tr tr,tf=6ns V tf 5V VOL I F 3 4 I F M O N ITO R * INCLUDES PROBE AND FIXTURE CAPACITANCE I F V FF V FF B A R M 6 * INCLUDES PROBE AND FIXTURE CAPACITANCE 22Ω B 3 A 5 4. uf 6 5 *R CC. uf R L *R CC 22Ω C L =5 pf +5V V O +5V R L V O VO S W A: I F=m A 5V 3 VCM + - PULSE GEN. 4. uf VO S W B: I F=.6m A VOL VCM + - PULSE GEN. 9/2
Tem perature ( C ) 8. TEMPERATURE PROFILE OF SOLDERING Photocoupler 8. IR Reflow soldering (JEDEC-STD-2C compliant) One time soldering reflow is recommended within the condition of temperature and time profile shown below. Do not solder more than three times. Profile item Conditions Preheat - Temperature Min (T Smin) - Temperature Max (T Smax) - Time (min to max) (ts) 5 C 2 C 9±3 sec Soldering zone - Temperature (T L) - Time (t L) Peak Temperature (T P) Ramp-up rate Ramp-down rate 27 C 6 ~ sec 26 C 3 C / sec max. 3~6 C / sec 2 sec R am p-up TP 26 C TL 27 C Tsm ax 2 C R am p-dow n Tsm in 5 C 6- sec tl (S oldering) 25 C 6 ~ 2 sec ts (P reheat) Tim e (sec) /2
8.2 Wave soldering (JEDEC22A compliant) One time soldering is recommended within the condition of temperature. Photocoupler Temperature: 26+/-5 C Time: sec. Preheat temperature:25 to 4 C Preheat time: 3 to 8 sec. 8.3 Hand soldering by soldering iron Allow single lead soldering in every single process. One time soldering is recommended. Temperature: 38+/-5 C Time: 3 sec max. /2
9. NAMING RULE Photocoupler Part Number Options LTV-M5 LTV-M5-TP LTV-M5-G LTV-M5-TP-G LTVM5-V-G LTVM5TP-V-G Definition of Suffix M5 TP no suffix V G Remark LiteOn model name Pin location at lower left of the tape Pin location at upper right of the tape VDE approved option Halogen free option. NOTES LiteOn is continually improving the quality, reliability, function or design and LiteOn reserves the right to make changes without further notices. The products shown in this publication are designed for the general use in electronic applications such as office automation equipment, communications devices, audio/visual equipment, electrical application and instrumentation. For equipment/devices where high reliability or safety is required, such as space applications, nuclear power control equipment, medical equipment, etc, please contact our sales representatives. When requiring a device for any specific application, please contact our sales in advice. If there are any questions about the contents of this publication, please contact us at your convenience. The contents described herein are subject to change without prior notice. Immerge unit s body in solder paste is not recommended. 2/2