Photocoupler Product Data Sheet LTV-0501 Spec No.: DS70-2013-0017 Effective Date: 01/07/2014 Revision: A LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660 DEMA Electronic AG Phone: +49 (0)89 28 69 41 0 Fax: +49 (0)89 http://www.liteon.com/opto 28 35 09 Email: info@dema.net Web: http://www.dema.net
LTV-0501 Single Channel, High Speed Optocouplers Description The LTV-0501 consists of a high efficient AlGaAs Light Emitting Diode and a high speed optical detector. This design provides excellent AC and DC isolation between the input and output sides of the Optocoupler. Connection for the bias of the photodiode improves the speed that of a conventional phototransistor coupler by reducing the base-collector capacitances. The internal shield ensures high common mode transient immunity. A guaranteed common mode transient immunity is up to 15KV/μsec. Functional Diagram Features SO8 package High speed 1MBd typical TTL compatiable Open collector output Storable output. Safety approval UL/ cul 1577, Cert. No.E113898. 3750 Vrms/1 min VDE DIN EN60747-5-5, Cert. No. 40015248 V IORM = 560 V peak Truth Table (Positive Logic) LED OUT ON L OFF H A 0.1μF bypass Capacitor must be connected between Pin8 and Pin5 Application High Voltage Isolation Isolation in line receivers Feedback element in switching mode power supplier Power transistor isolation in motor drives Interface between Microprocessor system, computer and their periphe Replace pulse transformers. Replace slower optocoupler isolators. Analog signal ground isolation Part No. : LTV-0501 (Rev.-A, August 30, 2013) Page : 1 of 13
Package Dimensions SO8 Package (LTV-0501) *1. Date code *2. V to represent VDE0884 *3. 1 st digit year code, 2 nd and 3 rd digit work week code Dimensions are all in Millimeters. Part No. : LTV-0501 (Rev.-A, August 30, 2013) Page : 2 of 13
Taping Dimensions Description Symbol Dimensions in millimeters ( inches ) Tape wide W 16.0±0.30(0.63) Pitch of sprocket holes P0 4.0±0.10(0.15) Distance of compartment F P2 7.5±0.10(0.295) 2±0.10(0.079) Distance of compartment to compartment P1 8.0±0.10(0.47) Quantities Per Reel Package Type LTV-0501 Quantities (pcs) 3000 Part No. : LTV-0501 (Rev.-A, August 30, 2013) Page : 3 of 13
Absolute Maximum Ratings*1 Parameter Symbol Min Max Units Note Storage Temperature T ST -55 125 Operating Temperature T A -55 110 o C o C Isolation Voltage V ISO 3750 V RMS Supply Voltage V CC -0.5 30 V Lead Solder Temperature * 2 260 C Input Average Forward Input Current I F 25 ma Reverse Input Voltage V R 5 V Input Power Dissipation P I 45 mw Output Output Collector Current I O 8 ma Output Collector Voltage V O -0.5 20 V Output Collector Power Dissipation P O 100 mw 1.Ambient temperature = 25 o C, unless otherwise specified. Stresses exceeding the absolute maximum ratings can cause permanent damage to the device. Exposure to absolute maximum ratings for long periods of time can adversely affect reliability. 2.260 o C for 10 seconds. Refer to Lead Free Reflow Profile. Part No. : LTV-0501 (Rev.-A, August 30, 2013) Page : 4 of 13
Electrical Specifications Parameters Test Condition Symbol Min Typ Max Units Input Forward Voltage I F =16mA, T A =25 o C V F 1.8 V Input Reverse Voltage I R = 10μA BV R 5.0 V Current transfer ratio I F =16mA;Vcc=4.5V; T A =25 o C;Vo=0.4V I F =16mA;Vcc=4.5V; T A =25 o C;Vo=0.5V CTR 19 24 50 15 25 % Logic low output voltage output voltage I F =16mA;Vcc=4.5V; I o =2.4mA; T A =25 o C I F =0mA, Vo=Vcc=5.5V T A =25 o C V OL 0.1 0.5 V 0.003 0.5 Logic high output current I F =0mA, Vo=Vcc=15V T A =25 o C I OH 0.01 1 μa VO = VCC = 15 V 50 Logic low supply current Logic high supply current I F =16mA, V o =open (Vcc=15V) I F =0mA, V o =open ; T A =25 o C (Vcc=15V) I ccl 50 200 I cch 0.02 1 μa *All Typical at T A =25 o C Part No. : LTV-0501 (Rev.-A, August 30, 2013) Page : 5 of 13
Switching Specifications T A =0~70 o C, Vcc=5V, unless otherwise specified. Parameter Test Condition Symbol Min Typ Max Units Propagation Delay Time to Low Output Level t PHL 0.2 0.8 Propagation Delay Time to High Output Level T A =25 o C (R L =1.9KΩ, I F =16mA) t PLH 0.6 0.8 μs Logic High Common Mode Transient Immunity I F =0mA;V CM =1500Vpp; C L = 15 pf; T A =25C, R L =1.9KΩ CM H 15 KV/μs Logic Low Common Mode Transient Immunity I F =16mA;V CM =1500Vp -p C L = 15 pf; T A =25C, R L =1.9KΩ CM L 15 *All Typical at T A =25 o C Part No. : LTV-0501 (Rev.-A, August 30, 2013) Page : 6 of 13
Isolation Characteristics Parameter Test Condition Symbol Min Typ Max Units Input-Output Insulation Leakage Current Withstand Insulation Test Voltage 45% RH, t = 5s, V I-O = 3kV DC, T A = 25 o C RH 50%, t = 1min, T A = 25 o C I I-O 1.0 μa V ISO 3750 V RMS Input-Output Resistance V I-O = 500V DC R I-O 10 12 Ω *All Typical at T A =25 o C Part No. : LTV-0501 (Rev.-A, August 30, 2013) Page : 7 of 13
Switching Time Test +5V Circuit +5V R L P U LSE G E N. Z O = 50Ω t r = t r = 5 ns 10% DUTY CYCLE 1/f < 100us I F M O N ITO R I F 0.1 uf C L V O =15 pf 0.1 uf R L C L V O =15 pf IN P U T( I F ) O U TPU T( VIN OP ) U T ( ) I F O U T PU T( V O) 1.5V 1.5V R M t PHLt P HL t P LHt P LH +5V Figure 1: Single Channel Test Circuit for t PHL and t PLH +5V I F R L VC M (P E A K ) V FF B A R L VCM VC M (P EAK) 0.1 uf V O 0.1 uf V O 0V VO 5V VCM 0V VO 5V S W A : I F=0m A S W A: I F=0m A VO (M IN) CMH CMH VCM VO 5V VO VOL VO (M AX) VO (M IN ) CML S W B: I F=16m A VO (M A X ) CML S W B : IF=16m A VCM + - PULSE GEN. + - P U LS E G E N. Figure 2: Single Channel Test Circuit for Common Mode Transient Immunity Part No. : LTV-0501 (Rev.-A, August 30, 2013) Page : 8 of 13
IOH-LOGIC HIGH OUTPUT CURRENT (na) IO- SMALL SIGNAL CURRENT TRANSFER RATIO IF-FORWORD CURRENT-mA NORMALIZED CTR (%) IO-OUTPUT CURRENT-mA NORMALIZAED CTR LITE-ON TECHNOLOGY CORPORATION Characteristics Curves Figure 3: DC and pulsed transfer characteristics Figure 6: Current transfer ratio vs. input current 20 15 10 5 0 0 10 20 VO-OUTPUT-V IF=40mA IF=35mA IF=30mA IF=25mA IF=20mA IF=15mA IF=10mA IF=5mA 45 40 35 30 25 20 15 10 5 0 0 5 10 15 20 25 IF-FORWARD CURRENT (ma) Figure 7: 4: Normalized Input current CTR vs. vs. forward temperature voltage Figure 7: Current transfer ratio vs. temperature 1000 100 10 1 Ta=25 o C 100 10 0.1 0.01 0.001 1.1 1.2 1.3 1.4 1.5 1.6 1.7 VF-FORWORD VOLTAGE-VOLTS Figure 5: Logic high output current vs. temperature 1 IF=16mA VCC=5V VO=0.4V 0-40 C -20 C 0 C 20 C 40 C 60 C 85 C Temperature Ta ( C) Figure 8: Small-signal current transfer ratio vs. quiescent current 1000 IF=0mA VCC=5V VO=5V 0.7 0.6 0.5 0.4 10 0.3 0.2 0.1 0-40 C -20 C 0 C 20 C 40 C 60 C 80 C 100 C 0 0 4 8 12 16 20 24 28 32 36 40 Temperature Ta ( C) IF-QUIESCENT INPUT CURRENT - ma Part No. : LTV-0501 (Rev.-A, August 30, 2013) Page : 9 of 13
Tp - PROPAGATION DELAY (ns) RL (K ohm) LITE-ON TECHNOLOGY CORPORATION Characteristics Curves Figure 9: Propagation delay time vs. temperature Figure 10: Propagation delay time vs. load resistance 10 1400 1200 1000 800 600 400 200 0 IF=16mA Vcc=5V RL = 1.9 kw (T PHL ) RL = 4.1 kw (T PHL ) RL = 4.1 kw (T PLH ) RL = 1.9 kw (T PLH ) 1 0.1 TPLH at IF=16mA TPLH at IF=10mA TPHL at IF=10mA TPHL at IF=16mA -40 C -20 C 0 C 20 C 40 C Temperature-TA ( C) 60 C 80 C 100 C 0.01 1 10 Propagation delay time (us) Part No. : LTV-0501 (Rev.-A, August 30, 2013) Page : 10 of 13
Tem perature ( C ) LITE-ON TECHNOLOGY CORPORATION Temperature Profile Of Soldering Reflow (1) IR Reflow soldering (JEDEC-STD-020C compliant) One time soldering reflow is recommended within the condition of temperature and time profile shown below. Profile item Preheat - Temperature Min (T Smin ) - Temperature Max (T Smax ) - Time (min to max) (ts) Soldering zone - Temperature (T L ) - Time (t L ) Peak Temperature (T P ) Ramp-up rate Ramp-down rate Conditions 150 C 200 C 90±30 sec 217 C 60 sec 260 C 3 C / sec max. 3~6 C / sec 20 sec R am p-up TP 260 C TL 217 C Tsm ax 200 C R am p-dow n Tsm in 150 C 60 sec tl (S oldering) 25 C 60 ~ 120 sec ts (P reheat) 35~70 sec Tim e (sec) Part No. : LTV-0501 (Rev.-A, August 30, 2013) Page : 11 of 13
Temperature Profile Of Soldering Reflow (2) Wave soldering (JEDEC22A111 compliant) One time soldering is recommended within the condition of temperature. Temperature: 260+0/-5 C Time: 10 sec. Preheat temperature:25 to 140 C Preheat time: 30 to 80 sec. (3) Hand soldering by soldering iron Allow single lead soldering in every single process. One time soldering is recommended. Temperature: 380+0/-5 C Time: 3 sec max. Part No. : LTV-0501 (Rev.-A, August 30, 2013) Page : 12 of 13
Notice 1. A 0.1µF or bigger bypass capacitor for V CC is needed as shown in Fig.1 2. Current Transfer Ratio is defined as the ratio of output collector current Io, to the forward LED input current IF, times 100. 3. The 1.9KΩ load represents 1TTL unit load of 1.6mA and the 5.6KΩ pull-up resistor. 4. The 4.1KΩ load represents 1LSTTL unit load of 0.36mA and the 6.1KΩ pull-up resistor. Specifications of the products displayed herein are subject to change without notice. The products shown in this publication are designed for the general use in electronic applications such as office automation equipment, communications devices, audio/visual equipment, electrical instrumentation and application. For equipment/devices where high reliability or safety is required, such as space applications, nuclear power control equipment, medical equipment, etc, please contact our sales representatives. Part No. : LTV-0501 (Rev.-A, August 30, 2013) Page : 13 of 13