Electronics Resurgence Initiative Presentation at the Design Automation Conference 6/21/17
What is DARPA?
The purpose of this directive is to provide within the Department of Defense an agency for the direction and performance of certain advanced research and development projects. -- DoD Directive 5105.15 February 7, 1958 Nytimes.com Gettyimages.com
How do we operate? Academia Defense Industry Commercial Sector Program managers from the community on a temporary 3 to 5 year assignment Programs executing ~$3 billion in the hands of ~90 PM s through ~250 programs Commercial Impact National Defense Needs to eliminate technical surprise.
1970 2000 2005 2010 2015 Today 2020 CH-9 CH-10 CH-11 CH-12 CH-13 CH-14 CH-15 CH-16 TEAM Array Decoder (Control Logic & Memory) Bandgap Bias 1:2 Differential Divider 1:8 Differential Divider 1:8 Differential Divider Active Balun Single Channel RF Input CH-8 CH-7 CH-6 CH-5 CH-4 CH-3 CH-2 CH-1 ARPANET MGR GPS receiver TEA RF CMOS FET SiGe bipolar transistor mmw arrays MIMIC GaAS MEMS Inertial sensors SiGe Silicon Germanium mmw Millimeter wave FinFET - Fin-Shaped Field Effect Transistor AME Advanced Microelectronics MEMS Micro Electrical Mechanical Systems MGR Miniature GPS Receiver AME FinFET PAL MIMIC Microwave/Millimeter-Wave Monolithic Integrated Circuits RF CMOS Radio Frequency Complimentary Metal Oxide Semiconductor PAL Personal Assistant that Learns TEAM Technology for Efficient, Agile Microsystems Siri 5G: The most exciting innovations that could transform the future of mobile internet - IBTimes, 2/27/16
How do we operate? Academia Defense Industry Commercial Sector Program managers from the community on a temporary 3 to 5 year assignment Programs / Challenges executing ~$3 billion in the hands of ~90 PM s through ~250 programs Commercial Impact National Defense Needs to eliminate technical surprise.
DARPA has evolved to using challenges 2005 2015 Today 2020 Grand Challenge (2005-2007)
2014 2015 2016 2017 2015 Robotics Challenge
2014 2015 2016 2017 2016 Cyber Grand Challenge
2014 2015 2016 2017 DARPA Spectrum Challenge Spectrum Collaboration Challenge 2017
2005 2015 Today 2020 Exploring the capabilities of learning / autonomy and their societal impact Grand Challenge (2005-2007) Robotics Challenge (2012-2015) Cyber Grand Challenge (2016) Spectrum Collaboration Challenge (2017-2018)
But, we still have a long way to go A revolution in sensing and processing is required
The miracle of Moore s Law has taken us incredibly far Electronics, April 19, 1965: Cramming More Components onto Integrated Circuits; Gordon Moore P.1 P.2 Fig.1 Everyone focuses on page 2 The complexity for minimum component costs has increased at a rate of roughly a factor of two per year (see graph)
But nothing lasts forever VIII. DAY OF RECKONING Electronics, April 19, 1965: Cramming More Components onto Integrated Circuits; Gordon Moore P.3 Clearly, we will be able to build such componentcrammed equipment. Next, we ask under what circumstances we should do it. The total cost of making a particular system function must be minimized. To do so, we could amortize the engineering over several identical items, or evolve flexible techniques for the engineering of large functions so that no disproportionate expense need be borne by a particular array. Perhaps newly devised design automation procedures could translate from logic diagram to technological realization without any special engineering. It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and interconnected. The availability of large functions, combined with functional design and construction, should allow the manufacturer of large systems to design and construct a considerable variety of equipment both rapidly and economically. Architecture Maximizing specialized functions Design Quickly enabling specialization Materials & Integration Adding separately packaged novel materials and using integration to provide specialized computing
Pseudolithic Integration Specialized Hardware Blocks Software Hardware Co-design 3.0 µm Compiler-directed Hardware Reconfiguration Sparse + Dense
Where are we heading? Sowing the seeds for a revolution in processing
Academia Defense Industry Commercial Sector What is the initiative? Program managers hired directly from the electronics community Programs / Challenges Electronics Resurgence Initiative Beyond Scaling: Materials Architectures Design Aligning incentives as we both stare at an uncertain future Co-developing electronics to manage the coming inflection to support both a national electronics base and national defense Commercial Impact National Defense Needs
MTO ELECTRONICS RESURGENCE INITIATIVE TIMELINE Launch, Learn, & Organize Summer of Listening Open Competition Complete Contracting 6/21: Industry Discussion 7/11: Defense Base Summit 7/18: 2-day workshop on Materials, Architectures, Designs 9/12: Proposals Requested (Expected) 4/20: Start Work Happening Now Summer 2017 Fall 2017 Spring 2018 May Jun Jul Aug Sep Oct Nov Dec Jan Apr V V $75 Million Additional in FY18 Budget Press Release Announcing Initiative
NATIONAL ELECTRONICS CAPABILITY $216 MILLION TOTAL (FY18) materials architectures designs $75 million Of New Funding (FY18) JUMP + Traditional Programs $141 million in Current Efforts (FY18)
Linton Salmon DARPA Program Manager The intersection of industry, academics, and government materials architectures designs JUMP + Traditional Programs
Joint University Microelectronics Program Experience Industry: 22 years 14 years silicon development 8 years defense Industry Academia: 8 years as a professor Government: 4 years (DARPA/NSF) 40% 60% Outlook CMOS is here for the foreseeable future Novel algorithms, architectures, and devices will be used in accelerators to augment von Neumann computing Joint University Microelectronics Program (JUMP) Advances increasingly will be driven at the edge, where power is a major limitation RF to THz Distributed Computing Cognitive Computing Intelligent Memory/Storage Advanced IC Architectures Devices/ Materials
Joint University Microelectronics Program Industry 40% 60% World Class Idea Generation Joint University Microelectronics Program (JUMP) Stanford University 3D System on Chip RF to THz Distributed Computing Cognitive Computing Intelligent Memory/Storage Advanced IC Architectures Devices/ Materials
National Electronics Capability Tomorrow World Class Translation of Technology Industry Government, Commercial, and Defense World Class Idea Generation Stanford University 3D System on Chip
Beyond Scaling Hardware Possibilities Cognitive Computing http://edublogs.loretonh.nsw.edu.au/isabellamin19/ JUMP Program Machine learning at the edge training and inference Cognitive computing algorithms and hardware JUMP Program Monolithic 3D SoC fabrication and architecture
National Electronics Capability materials architectures designs Industry Engagement JUMP + Traditional Programs Foundational University-driven
Andreas Olofsson Designs From Kickstarter to Supercomputer materials architectures designs JUMP + Traditional Programs
12 years at TI and Analog Devices 9 years as CEO/founder at Adapteva Harvard.edu Fab Circuit Design Analogdevices.com Logic Design Majority of career spent in the semiconductor trenches Americansemi.com Semiconductor Test EDA/CAD Architecture
World s First Crowd-Funded Chip 16-core 65nm Processor (<2W) Parallella.org 2012 Parallella Kickstarter
My DARPA funded super-chip Process TSMC 16FF+ Transistors 4.5B Die Area 117 mm 2 Performance 2 TFLOPS RTL to GDS ~24hrs Engineers 1 CRAFT Program
My DARPA dream 48 Hours Code EDA tovatech.com keysight.com when I leave DARPA shutterstock.com amazon.com fedex.com
Dan Green Materials Steering the science of materials to commercial product lines materials architectures designs JUMP + Traditional Programs
QORVO
DAHI Program 300mm diameter Si CMOS wafer DAHI Program Si (45nm), InP (TF5 HBT), GaN (GaN20 HEMT)
Applied Physics: Feb 2012; Experimental realization of superconducting quantum interference devices with topological insulator junctions. M. Veldhorst et. al. What is a transistor: The World of Modern Electrons; Sam Sattel 1946 2012
Fundamental Science Moore s Law Shutterstock.com Integration Changing the fundamental compute building blocks allows us to question: Where and how should we do our thinking?
Tom Rondeau Architectures The intersection of connectivity and computation materials architectures designs JUMP + Traditional Programs
Virginia Tech
IDA: Institute for Defense Analyses Center for Communications Research - Princeton
GNU Radio
Intel.com General Purpose Processor Portable and programmable Xilinx.com Programmable Logic concurrent stream processing nvidia.com Graphics Processing Unit Embarrassingly Parallel analogdevices.com Digital Signal Processor Optimized serial processing Accelerator The best at one thing Math Domains Dense Linear Algebra Transforms Learning, optimization Performance Power Bandwidth Latency Programming Tools Compilers Debuggers Performance measurements/tools Data Representation Data Structures Fixed point math Numerical precision / quantization
Models for engagement? An introduction to current corporate engagements
MTO has started new partnerships with the commercial sector in areas of shared interest Traversing a 1 trillion edge graph Defense Industry Application layer - Northrop Grumman HIVE Hierarchical Identify, Verify, Exploit Universities and Labs Software Commercial sector Hardware - Pacific Northwest National Laboratory - Georgia Tech - Intel - Qualcomm
MTO has started new partnerships with the commercial sector in areas of shared interest 75% Reduction in DoD Product Cycle Time CRAFT Circuit Realization At Faster Timescales - Northrop Grumman - Boeing Defense Industry - Harvard, UC-Berkeley - UCSD, CMU Universities - NVIDIA Commercial Sector Defense, University, and Commercial sectors working sideby-side towards a common goal
Defense and National Needs (HIVE) (CRAFT) (Possible)
So How Do You Get Involved? Timeline and structure
MTO ELECTRONICS RESURGENCE INITIATIVE TIMELINE Launch, Learn, & Organize Summer of Listening Open Competition Complete Contracting 6/21: Industry Discussion 7/11: Defense Base Summit 7/18: 2-day workshop on Materials, Architectures, Designs 9/12: Proposals Requested (Expected) 4/20: Start Work Happening Now Summer 2017 Fall 2017 Spring 2018 7 months May Jun Jul Aug Sep Oct Nov Dec Jan Apr V V Defense Base Summit 2-day Workshop Proposals Requested Proposals Submitted Partners Selected Funding Released
MTO ELECTRONICS RESURGENCE INITIATIVE POINTS OF CONTACT Commercial Engagement Lead Mr. David Henshall david.henshall@darpa.mil Architectures Thrust Lead Program Manager (PM) Dr. Thomas Rondeau thomas.rondeau@darpa.mil Design Thrust Lead PM Mr. Andreas Olofsson andreas.olofsson@darpa.mil Materials Thrust Lead PM Dr. Daniel Green daniel.green@darpa.mil Joint University Microelectronics Program PM Dr. Linton Salmon linton.salmon@darpa.mil For general questions, please contact Mr. David Henshall For thrust-specific questions, please contact the relevant PM