Analog High Speed Coupler, High Noise Immunity, MBd, kv/μs DESCRIPTION The is an optocoupler with a GaAlAs infrared emitting diode, optically coupled to an integrated photo detector consisting of a photo diode and a high speed transistor in a DIP-8 plastic package. The device is similar to the 6N3 but has an additional Faraday shield on the detector which enhances the input-output dv/dt immunity. Signals can be transmitted between two electrically separated circuits up to frequencies of 2 MHz. This an ideal solution for industrial communication bus isolation, as well as isolated drive circuit applications such as IPM (intelligent power module) drivers. NC A C NC 2 3 4 8 7 6 V CC NC C E FEATURES High-speed optocoupler without base connection Isolation test voltage: 3 V RMS GaAlAs emitter Integrated detector with photo diode and transistor High data transmission rate: MBit/s TTL compatible Open collector output Good CTR linearity relative to forward current Field effect stable Low coupling capacitance Very high common mode transient immunity dv/dt: kv/μs at V CM = V Material categorization: for definitions of compliance please see www.vishay.com/doc?9992 APPLICATIONS Data communications IGBT drivers Programmable controllers IPM (intelligent power module) drivers AGENCY APPROVALS UL77 file no. E2744, double protection DIN EN 6747-- (VDE884-) available with option cul components acceptance service no. A CQC GB8898-2, GB4943.-2 ORDERING INFORMATION DIP-8 Option 6 S F H 6 3 4 - X # # T PART NUMBER PACKAGE OPTION TAPE AND REEL 7.62 mm Option 7.6 mm Option 9 AGENCY CERTIFIED/PACKAGE CMR (kv/μs) UL, cul, CQC DIP-8 SMD-8, option 7 -X7T () SMD-8, option 9 -X9T () VDE, UL, cul, CQC DIP-8 -X DIP-8, 4 mil, option 6 -X6 SMD-8, option 7 -X7T () SMD-8, option 9 -X9T () Note () Also available in tubes; do not add T to end >.7 mm >. mm Rev. 2.2, 3-Aug- Document Number: 8368 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9
ABSOLUTE MAXIMUM RATINGS (T amb = 2 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT INPUT Reverse voltage V R 3 V DC forward current 2 ma Surge forward current t p = μs, 3 pulses/s SM A Power dissipation P diss 4 mw OUTPUT Supply voltage V S -. to 3 V Output voltage -. to 2 V Output current I O 8 ma Power dissipation P diss mw COUPLER Storage temperature range T stg - to + C Ambient temperature range T amb - to + C Junction temperature T j 2 C Soldering temperature max. s, max. dip soldering: distance to seating plane. mm T sld 26 C Note Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum ratings for extended periods of the time can adversely affect reliability. ELECTRICAL CHARACTERISTICS (T amb = 2 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT INPUT Forward voltage = 6 ma V F -.33.9 V Reverse current V R = 3 V I R -. μa Capacitance V R = V, f = MHz C O - 3 - pf Thermal resistance R thja - 7 - K/W OUTPUT Supply current, logic high = V, = open, V CC = V I CCH -. μa I () CCH -. 2 μa = V, = V CC =. V I OH -.3. μa Output current, output high I OH -. μa = V, = V CC = V I () OH - - μa Collector emitter capacitance V CE = V, f = MHz C CE - 3 - pf Thermal resistance R thja - 3 - K/W COUPLER Coupling capacitance C C -.6 - pf Collector emitter saturation voltage = 6 ma, I O = 2.4 ma, V CC = 4. V L -..4 V Logic low supply current = 6 ma, = open, V CC = V I CCL - 8 2 μa Notes Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluation. Typical values are for information only and are not part of the testing requirements. () T amb = C to 7 C, unless otherwise specified, typical values T amb = 2 C. Rev. 2.2, 3-Aug- 2 Document Number: 8368 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9
CURRENT TRANSFER RATIO (T amb = 2 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Current transfer ratio = 6 ma, =.4 V, V CC = 4. V CTR 9 3 - % = 6 ma, =. V, V CC = 4. V, T amb = C to 7 C CTR - - % SWITCHING CHARACTERISTICS (T amb = 2 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Propagation delay time (high to low), see fig. = 6 ma, V CC = V, R L =.9 kω t PHL -.3.8 μs Propagation delay time (low to high), see fig. = 6 ma, V CC = V, R L =.9 kω t PLH -.3.8 μs Pulse generator Z O = Ω t r,t f =ns duty cycle % t µs t monitor 2 3 8 7 6 C = nf V R L L. V V Ω 4 C L = pf t PHL t PLH t isfh634_ Fig. - Switching Times (Typ.) COMMON MODE TRANSIENT IMMUNITY (T amb = 2 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Common mode transient immunity (high), see fig. 2 Common mode transient immunity (low), see fig. 2 I O = ma, V CM = V P-P, R L =.9 kω, V CC = V I O = 6 ma, V CM = V P-P, R L =.9 kω, V CC = V CM H 3 - V/μs CM L 3 - V/μs V CM B A 2 3 8 7 6 C =. µf V R L V 9 % % % 9 % t t r f t V CC 4 V A: = ma Pulse generator t V CM L B: = 6 ma isfh634_2 t Fig. 2 - Common Mode Transient Immunity Rev. 2.2, 3-Aug- 3 Document Number: 8368 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9
SAFETY AND INSULATION RATINGS (T amb = 2 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT Climatic classification According to IEC 68 part //2 Pollution degree According to DIN VDE 9 2 Comparative tracking index Insulation group IIIa CTI 7 Maximum rated withstanding isolation voltage According to UL77, t = min V ISO 3 V RMS Maximum transient isolation voltage According to DIN EN 6747-- V IOTM 8 V peak Maximum repetitive peak isolation voltage According to DIN EN 6747-- V IORM 89 V peak Isolation resistance T amb = 2 C, V IO = V R IO 2 Ω T amb = C, V IO = V R IO Ω Output safety power P SO mw Input safety current I SI 3 ma Input safety temperature T S 7 C Creepage distance DIP-8 7 mm Clearance distance DIP-8 7 mm Creepage distance DIP-8, 4 mil, option 6 8 mm Clearance distance DIP-8, 4 mil, option 6 8 mm Creepage distance SMD-8, option 7 8 mm Clearance distance SMD-8, option 7 8 mm Creepage distance SMD-8, option 9 8 mm Clearance distance SMD-8, option 9 8 mm Insulation thickness DTI.4 mm Note As per IEC 6747--, 7.4.3.8.2, this optocoupler is suitable for safe electrical insulation only within the safety ratings. Compliance with the safety ratings shall be ensured by means of protective circuits. TYPICAL CHARACTERISTICS (T amb = 2 C, unless otherwise specified) 3 - Forward Current (ma) T = C T = 2 C T = -4 C - LED Current (ma) 2..2.4.6.8 V F - Forward Voltage (V) 2 4 6 8 Ambient Temperature ( C) Fig. 3 - LED Forward Current vs. Forward Voltage Fig. 4 - Permissible Forward LED Current vs. Temperature Rev. 2.2, 3-Aug- 4 Document Number: 8368 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9
Total Power (mw) 2 8 6 4 2 Detector Emitter 2 4 6 8 t p - Propagation Delay Time (ns) 9 8 7 6 V CC =. V = 6 ma, R L =.9 kω T PLH at 3 V T PLH at. V 4 3 2 T PHL at. V T PHL at 3 V -6-4 -2 2 4 6 8 Ambient Temperature ( C) T A - Temperature ( C) Fig. - Permissible Power Dissipation vs. Temperature Fig. 8 - Propagation Delay vs. Ambient Temperature I O - Output Current (ma) 2 2 = 3 ma = 3 ma = 2 ma = 2 ma = ma = ma = ma I OH - Collector Current, I C (na).. V CC = = V V CC = = V 2 2. -6-4 -2 2 4 6 8 - Output Voltage (V) T A - Temperature ( C) Fig. 6 - Output Current vs. Output Voltage Fig. 9 - Logic High Output Current vs. Temperature I O - Output Current (ma) 8 7 6 4 3 2 at =.4 V, V CC =. V = 2 ma IF = 6 ma = ma = 2 ma = ma Δ /ΔI O /Small Signal Current Transfer Ratio.6..4.3.2. (V CC =. V, R L = Ω) -6-4 -2 2 4 6 8 T A - Temperature ( C) 2 2 (ma) Fig. 7 - Output Current vs. Temperature Fig. - Small Signal Current Transfer Ratio vs. Input Current Rev. 2.2, 3-Aug- Document Number: 8368 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9
PACKAGE DIMENSIONS (in millimeters) DIP-6.6 max. 9.7 ±..9 ±.2.27 ±.. ±. 2.4 nom. 3 x 2.4 = 7.62.7 ±.2 3. ±.2 7 typ. 7.62 typ. 6.7 ±. 3. ±.2 6. ±.2.2 ±. 8 7 6 PIN ONE I.D. 2 3 4 DIP-6, Option 6.6 max. 9.7 ±..9 ±.2.6 typ. 7.62 typ. 6.7 ±. 3. ±.2.27 ±.. min.. ±. 2.4 nom.. ±.4.2 ±. 3 x 2.4 = 7.62 8 7 6 PIN ONE I.D. 2 3 4 Rev. 2.2, 3-Aug- 6 Document Number: 8368 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9
SMD-6, Option 7.6 max. 9.7 ±..9 ±.2. ±.2 7.62 typ. 6.7 ±..27 ±. 2.4 nom. 3 x 2.4 = 7.62 3. ±.2.7 ±.2.7 ±.2 8. min. 8.4 min..2 ±. Leads Coplanarity. max. 8 7 6.76 PIN ONE I.D. 2 3 4 2.4 R.2.78 8. min...2 SMD-6, Option 9.6 max. 9.7 ±..9 ±.2 9.78 ±.2 7.62 typ. 6.7 ±. 3. ±.2.8 ±.8.2 ±..27 ±. 2.4 nom..7 ±.2 8. min. Leads Coplanarity. max. 3 x 2.4 = 7.62 8 7 6.76 PIN ONE I.D. 2 3 4 2.4 R.2.78 8. min...2 Rev. 2.2, 3-Aug- 7 Document Number: 8368 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9
PACKAGE MARKING V YWW 68 Fig. - Notes The VDE logo is only marked on option parts. Tape and reel suffix (T) is not part of the package marking. PACKAGING INFORMATION (in millimeters) 2. ±.. + -.. 4. ±. Y.7 ±..343 ±.2 7. ±..2 ±. 6. ±. LC X X. +.2 -. 2. ±..4 ±. Y 3.8 ±. 4.7 ±. SECTION Y - Y LC SECTION X - X Note: Cumulative tolerance of sprocket holes is ±.2 Fig. 2 - Tape and Reel Packing for SMD-8, Option 7 ( pieces on reel) Rev. 2.2, 3-Aug- 8 Document Number: 8368 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9
2. ±.. +. -. 4. ±. Y.7 ±..3 ±. 7. ±..3 ±. 6. +.3 -. LC X X. +.2 -. 2. ±..2 ±. Y 3.8 ±. 4.7 ±. SECTION Y - Y LC SECTION X - X Note: Cumulative tolerance of sprocket holes is ±.2 Fig. 3 - Tape and Reel Packing for SMD-8, Option 9 ( pieces on reel) SOLDER PROFILES Temperature ( C) 3 2 2 23 C to 26 C first wave wave ca. 2 K/s C to 3 C s 2 K/s second wave ca. 2 K/s forced cooling Lead temperature full line: typical dotted line: process limits ca. K/s Temperature ( C) 3 2 2 2 C 24 C 27 C max. 2 s max. ramp up 3 C/s max. 26 C 24 C max. 3 s max. s max. ramp down 6 C/s 94 8626 2 2 Time (s) Fig. 4 - Wave Soldering Double Wave Profile According to J-STD-2 for DIP-8 Devices 984 2 2 3 Time (s) Fig. - Lead (Pb)-free Reflow Solder Profile According to J-STD-2 for SMD-8 Devices HANDLING AND STORAGE CONDITIONS ESD level: HBM class 2 Floor life: unlimited Conditions: T amb < 3 C, RH < 8 % Moisture sensitivity level, according to J-STD-2 Rev. 2.2, 3-Aug- 9 Document Number: 8368 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9
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