ROTECTION RODUCTS Descrition The SMDxx series of TS arrays are designed to rovide undirectional rotection for sensitive electronics from damage or latchu due to ESD, lightning, and other voltageinduced transient events. Each device will rotect four data or I/O lines. They are available with oerating voltages of 5,, 5 and. TS diodes are solidstate devices designed secifically for transient suression. They offer desirable characteristics for board level rotection including fast resonse time, low oerating and claming voltage and no device degradation. The low rofile SO ackage allows the user to rotect u to four indeendent lines with one ackage. The SMDxx series is suitable rotection for sensitive semiconductors comonents such as microrocessors, SICs, transceivers, transducers, and CMOS memory. The SMDxx series devices may be used to meet the ESD immunity requirements of IEC 60004, level 4 for air and contact discharge. SMD05 through SMD Unidirectional TS rray for rotection of Four Lines Features Transient rotection for data lines to IEC 60004 (ESD) ±5k (air), ±k (contact) IEC 600044 (EFT) 40 (5/50ns) IEC 600045 (Lightning) (/0µs) Undirectional rotection Small SO ackage rotects four I/O lines Working voltages: 5,, 5 and Low leakage current Low oerating and claming voltages Solidstate silicon avalanche technology Mechanical Characteristics JEDEC SO ackage Molding comound flammability rating: UL 940 Marking : art number, date code, logo ackaging : Tube or Tae and Reel er EI 4 lications RS data lines Microrocessor based equiment Notebooks, Desktos, and Servers Instrumentation LN/WN equiment eriherals Serial and arallel orts Schematic & IN Configuration 6 4 5 SO (To iew) Revision 0/5/06
SMD05 through SMD ROTECTION RODUCTS bsolute Rating Rating alue ulse ower (t = /0µs) k 00 Watts ESD (HM er IEC 60004) ESD 5 > k Lead Soldering Temerature T L 60 (0 sec. ) C Oerating Temerature T J 55 to +5 C Storage Temerature T STG 55 to +50 C Electrical Characteristics (T=5 o C) SMD05 arameter Tyical StandOff RWM 5 reakdown 6 R RWM = 5, T=5 C 0 µ Claming C =, t = /0µ s 9. Claming C = 5, t = /0µ s ulse Current t = /0µ s I Caacitance R = 0, f = MHz 400 F SMD arameter Tyical StandOff WM R reakdown. R RWM =, T=5 C µ Claming C =, t = /0µ s 9 Claming C = 5, t = /0µ s ulse Current t = /0µ s I Caacitance R = 0, f = MHz 50 F 005 Semtech Cor.
SMD05 through SMD ROTECTION RODUCTS Electrical Characteristics (Continued) SMD5 arameter Tyical StandOff WM R 5 reakdown 6. R RWM = 5, T=5 C µ Claming C =, t = /0µ s Claming C = 5, t = /0µ s 0 ulse Current t = /0µ s 0 I Caacitance R = 0, f = MHz 00 F SMD arameter Tyical StandOff WM R 4 reakdown 6. R RWM =, T=5 C µ Claming C =, t = /0µ s 4 Claming C = 5, t = /0µ s 55 ulse Current t = /0µ s 5 I Caacitance R = 0, f = MHz 60 F 005 Semtech Cor.
SMD05 through SMD ROTECTION RODUCTS Tyical Characteristics NonReetitive ulse ower vs. ulse Time ower Derating Curve ulse ower k (kw) 0 0. 0.0 0. 0 00 000 ulse Duration t (µs) % of Rated ower or 0 00 90 0 0 60 50 40 0 0 0 0 0 5 50 5 00 5 50 mbient Temerature T ( o C) ulse Waveform ercent of I 0 00 90 0 0 60 50 40 0 0 0 0 e t td = / W aveform arameters: tr = µs td = 0µs 0 5 0 5 0 5 0 Time (µs) ESD ulse Waveform (IEC 60004) IEC 60004 Discharge arameters Level First Current () Current at 0 ns () Current at 60 ns () Test (Contact Discharge) (k) Test (ir Discharge) (k). 5 4 5 4 4 4. 5 6 6 4 0 6 5 005 Semtech Cor. 4
SMD05 through SMD ROTECTION RODUCTS lications Information Device Connection for rotection of Four Data Lines The SMDxx series of devices are designed to rotect u to four data lines. The devices are connected as follows: The SMDxx are unidirectional devices and are designed for use on lines where the normal oerating voltage is above ground. ins,,, and 4 are connected to the rotected lines. ins 5, 6,, and are connected to ground. The ground connections should be made directly to the ground lane for best results. The ath length is ket as short as ossible to reduce the effects of arasitic inductance in the board traces. Circuit oard Layout Recommendations for Suression of ESD. Good circuit board layout is critical for the suression of ESD induced transients. The following guidelines are recommended: Circuit Diagram 6 4 5 I/O Line rotection lace the TS near the inut terminals or connectors to restrict transient couling. Minimize the ath length between the TS and the rotected line. Minimize all conductive loos including ower and ground loos. The ESD transient return ath to ground should be ket as short as ossible. Never run critical signals near board edges. Use ground lanes whenever ossible. Matte Tin Lead Finish Matte tin has become the industry standard leadfree relacement for lead finishes. matte tin finish is comosed of 00% tin solder with large grains. Since the solder volume on the leads is small comared to the solder aste volume that is laced on the land attern of the C, the reflow rofile will be determined by the requirements of the solder aste. Therefore, these devices are comatible with both leadfree and assembly techniques. In addition, unlike other leadfree comositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Tyical Connection To rotected Device 4 5 6 Ground From Connector 005 Semtech Cor. 5
SMD05 through SMD ROTECTION RODUCTS Outline Drawing SO X E/ ccc C X N/ TIS aaa C SETING LNE C N D e D E E e/ bxn bbb C D GGE LNE 0.5 H SIDE IEW h L (L) DETIL h c 0 SEE DETIL DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MX MIN NOM MX.05.069.5.5.004.049.00.065 0.0.5 0.5.65 b.0.00 0. 0.5 c.00.00 0. 0.5 D.9.9.9 4.0 4.90 5.00 E.50.54.5.0.90 4.00 E.6 SC 6.00 SC e.050 SC. SC h.00.00 0.5 0.50 L.06.0.04 0.40 0..04 L N 0 0 (.04) 0 (.04) aaa bbb.004.00 0.0 0.5 ccc.00 0.0 NOTES:. CONTROLLING DIMENSIONS RE IN MILLIMETERS (NGLES IN DEGREES).. DTUMS ND TO E DETERMINED T DTUM LNE H. DIMENSIONS "E" ND "D" DO NOT INCLUDE MOLD FLSH, ROTRUSIONS OR GTE URRS. 4. REFERENCE JEDEC STD MS0, RITION. Land attern SO X DIMENSIONS DIM INCHES MILLIMETERS C (.05) (5.0) (C) G Z G..00.050. X.0 0.60 Y Y.0.0 Z.9.40 NOTES:. THIS LND TTERN IS FOR REFERENCE UROSES ONLY. CONSULT YOUR MNUFCTURING GROU TO ENSURE YOUR COMNY'S MNUFCTURING GUIDELINES RE MET.. REFERENCE ICSM, RL NO. 00. 005 Semtech Cor. 6
SMD05 through SMD ROTECTION RODUCTS Ordering Information art Number Working Lead Finish Qty er Reel Reel Size SMD05.T 5 SMD.T SMD5.T 5 SMD.T SMD05.TT 5 b SMD.TT b SMD5.TT 5 b SMD.TT b SMD05 5 SMD SMD5 5 SMD SMD05.T 5 b SMD.T b SMD5.T 5 b SMD.T b Note: Leadfree devices are RoHS/WEEE Comliant Contact Information Semtech Cororation rotection roducts Division 00 Flynn Road, Camarillo, C 90 hone: (05)49 FX (05)4904 005 Semtech Cor.