FSUSB63 3:1 High-Speed USB 2.0 Switch / Multiplexer

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FSUSB63 3:1 High-Speed USB 2.0 Swich / Muliplexer Feaures Sw ich Type 3:1 USB Sw ich USB USB 2.0 High-Speed & Full-Speed Complian Break-Before-Make Time 126µs RON 6Ω Typical C ON 6pF Typical Bandw idh 830MHz V CC 2.7 o 4.4V V CNTRL 0 o V CC Operaing Temperaure -40 C o 85 C ICCSLP <1µA ICCACT 7.5µA Typical Package 12- Lead UMLP 1.80 x 1.80 x 0.55mm, 0.40mm pich Top Mark KG Ordering Informaion FSUSB63UMX Descripion The FSUSB63 is a bi-direcional, low -pow er, High-Speed (HS) USB 2.0 3:1 Muliplexer (MUX). I is opimized for sw iching among hree high-speed (480Mbps) sources or any combinaion of high-speed and full-speed (12Mbps) USB sources, such as an applicaion processor, o one USB 2.0 connecor. The FSUSB63 has a break-before-make ime o force reenumeraion by he hos w hen sw iching bew een differen HS USB 2.0 conrollers and hus requires minimal sofw are changes. The FSUSB63 is complian w ih he requiremens of USB 2.0 and feaures exremely low on capaciance (C ON). The w ide bandw idh exceeds he requiremen o pass he hird harmonic, resuling in signals w ih minimum edge and phase disorion. Superior channel-o-channel crossalk also minimizes inerference. Applicaions Cell Phone, Digial Camera, Noebook LCD Monior, TV, and Se-Top Box Nebook, Mobile Inerne Device (MID) Typical Applicaion Figure 1. Analog Symbol 2010 Semiconducor Componens Indusries, LLC. Publicaion Order Number: December-2017, Rev. 2 FSUSB63/D

Pin Configuraion Pin Descripions D D+ 3 2 1 12 SEL[0] 4 11 HSD1 5 10 HSD1+ 6 9 7 8 HSD2+ HSD2 V CC SEL[1] HSD3+ HSD3 Figure 2. Pin Assignmens (Top Through View ) Pin # Name Descripion 1 D+ USB 2.0 High Speed or Full Speed Daa Bus D+ 2 D- USB 2.0 High Speed or Full Speed Daa Bus D- 3 Ground 4 SEL[0] Pah Selecion Conrol Inpus (see funcional able below) 5 HSD1- Muliplexed Firs Source Pah for D- 6 HSD1+ Muliplexed Firs Source Pah for D+ 7 HSD2- Muliplexed Second Source Pah for D- 8 HSD2+ Muliplexed Second Source Pah for D+ 9 HSD3- Muliplexed Third Source Pah for D- 10 HSD3+ Muliplexed Third Source Pah for D+ 11 SEL[1] Pah Selecion Conrol Inpus (see funcional able below) 12 V CC Supply Volage Funcional Table Mode SEL[1] SEL[0] Funcion Sleep Mode 0 0 D+, D- Swich Pahs Open USB Por 1 0 1 D+=HSD1+, D-=HSD1- USB Por 2 1 0 D+=HSD2+, D-=HSD2- USB Por 3 1 1 D+=HSD3+, D-=HSD3-2

Eye Compliance Figure 3. USB 2.0 HS-USB Eye Compliance Pass Through (w ihou Sw ich) Figure 4. USB 2.0 HS-USB Eye Compliance w ih Sw ich Noes: 1. Figure 3 indicaes he HS-USB eye compliance of he source across a characerizaion board proir o he implemenaion of he sw ich. 2. Figure 4 show s he oal impac he sw ich has on HS-USB eye compliance w hen compared o Figure 3 3

Absolue Maximum Raings Sresses exceeding he absolue maximum raings may damage he device. The device may no funcion or be operable above he recommended operaing condiions and sressing he pars o hese levels is no recommended. In addiion, exended exposure o sresses above he recommended operaing condiions may affec device reliabiliy. The absolue maximum raings are sress raings only. Symbol Parameer Min. Max. Uni V CC Supply Volage -0.50 5.25 V VCNTRL DC Inpu Volage (SEL[1:0]) (3) -0.5 VCC V VSW DC Sw ich I/O Volage (3) -0.50 5.25 V I IK DC Inpu Diode Curren -50 ma I OUT DC Sw ich Curren 50 ma TSTG Sorage Temperaure -65 +150 C MSL Moisure Sensiiviy Level (JEDEC J-STD-020A) 1 Level ESD IEC61000-4-2 Sysem on USB Connecor Pins D+ & D- Human Body Model, JEDEC: JESD22-A114 Air Gap 15.0 Conac 8.0 Pow er o 16.0 I/O o 5.0 All Pins 5.0 Charged Device Model, JEDEC: JESD22-C101 1.5 Noe: 3. The inpu and oupu negaive raings may be exceeded if he inpu and oupu diode curren raings are observed. kv Recommended Operaing Condiions The Recommended Operaing Condiions able defines he condiions for acual device operaion. Recommended operaing condiions are specified o ensure opimal performance o he daashee specificaions. ON Semiconducor does no recommend exceeding hem or designing o Absolue Maximum Raings. Symbol Parameer Min. Max. Uni V CC Supply Volage 2.7 4.4 V V CNTRL (4) Conrol Inpu Volage (SEL[1:0]) 0 V CC V V SW Sw ich I/O Volage -0.5 4.3 V TA Operaing Temperaure -40 +85 C Noe: 4. The conrol inpu mus be held HIGH or LOW and i mus no floa. 4

DC Elecrical Characerisics All ypical values are for VCC=3.3V a TA=25 C unless oherw ise specified. Symbol Parameer Condiions VCC (V) TA=- 40ºC o +85ºC Min. Typ. Max. V IK Clamp Diode Volage I IN=-18mA 2.7-1.2 V V IH Inpu Volage High SEL[1], SEL[0] Inpus 2.7 o 4.3 1.0 V V IL Inpu Volage Low SEL[1], SEL[0] Inpus 2.7 o 4.3 0.35 V I IN I OZ I OFF R ON (5) Conrol Inpu Leakage Off-Sae Leakage Power-Off Leakage Curren (All I/O Pors) All Combinaions of SEL[1] & SEL[0] in he Truh Table (LOW=0V & HIGH=V CC) 0 n, HSD1 n, HSD2 n, HSD3 n V SW=0V o 4.3V, V CC=0V, Figure 7 Unis 4.3 1 µa 4.3-2 2 µa 0-2 2 µa HS Swich On Resisance V SW=0.4V, I ON=-8mA, Figure 6 3.0 6.0 7.8 ΔR ON HS Dela R ON (6) V SW=0.4V, I ON=-8mA 3.0 0.50 I CCSLP Sleep Mode Supply Curren SEL[1]=SEL[0]=0 3.6 1 µa I CCACT I CCT Acive Mode Supply Curren Increase in I CC Curren per Conrol Inpu and V CC V CNTRL=0 or V CC, I OUT=0 2.7 7.5 15.0 µa 3.6 8.5 16.0 µa V CNTRL=1.8V 3.6 1.5 4.0 µa V CNTRL=1.2V 3.6 3.0 5.0 µa Noes: 5. Measured by he volage drop bew een HSDn and Dn pins a he indicaed curren hrough he sw ich. On resisance is deermined by he low er of he volage on he w o ( or D n pors). 6. Guaraneed by characerizaion. AC Elecrical Characerisics All ypical values are for V CC=3.3V a T A=25 C unless oherw ise specified. Symbol Parameer Condiions VCC (V) ON OFF Turn-On Time when Swiching from One USB Pah (or Disabled i.e. SEL=00) o Anoher USB Pah Turn-Off Time SEL 00 (Any of he Three USB Pahs Acive) o SEL=00 (Disabled) R L=50Ω, C L=35pF V SW=0.8V Figure 8, Figure 9 R L=50Ω, C L=35pF V SW= 0.8V Figure 8, Figure 9 (7) CL=5pF, RL=50Ω PD Propagaion Delay Figure 8, Figure 10 BBM Break-Before-Make Time R L=50Ω, C L=35pF V SW1=V SW2= 0.8V, Figure 12 (7) RL=50Ω, f=240mhz O IRR Off Isolaion Figure 14 T A=- 40ºC o +85ºC Min. Typ. Max. Unis 3.0 o 3.6 126 400 µs 3.0 o 3.6 45 ns 3.3 0.25 ns 3.0 o 3.6 126 400 µs 3.0 o 3.6-42 db (7) RL=50Ω, f=240mhz Xalk Non-Adjacen Channel Crossalk Figure 15 3.0 o 3.6-33 db BW -3db Bandwidh (7) Noe: 7. Guaraneed by characerizaion. R L=50Ω, C L=0pF Figure 13 R L=50Ω, C L=5pF Figure 13 3.0 o 3.6 830 MHz 3.0 o 3.6 510 MHz 5

USB High-Speed Relaed AC Elecrical Characerisics Symbol Parameer Condiions Vcc (V) (8) VSW=0.2Vdiff SK(P) Pulse Skew PP, Figure 11, CL=5pF SK(I) Capaciance Skew Bew een Differenial Signals w ihin a Pair (8) V SW=0.2Vdiff PP, Figure 11, C L=5pF Symbol Parameer Condiions TA=- 40ºC o +85ºC Min. Typ. Max. Unis 3.0 o 3.6 10 ps 3.0 o 3.6 10 ps T A =- 40ºC o +85ºC Min. Typ. Max. C in SEL[1:0] Inpu Capaciance (8) V CC=0V 3 CON D+/D- On Capaciance (8) Pahs Enabled, f=1mhz, Figure 17 V CC=3.3V, Any of he Three Sw ich C OFF HSD1 n, HSD2 n, HSD3 n Off Capaciance (8) Noes: 8. Guaraneed by characerizaion. 9. Effecive capaciance measured on a new ork analyzer. V CC=3.3V, Any of he Three Sw ich Pahs Enabled, f=240mhz (9) 5 V CC=0V or (V CC=3.3V and SEL[1]=SEL[0]=0V) Figure 16 6 2 Unis pf 6

Reference Schemaic V DDIO (1.7-4.3) EL * EL * * *Pull-up Pull-up resisor resisor values values for SEL0 for SEL0 and and SEL1 SEL1 are are applicaion specific. Please conac Fairchild ON for Semiconducor bes recommendaions for bes for recommendaions exac applicaion. for exac applicaion. V CC 10~100Ω 1000pF SEL0 SEL1 HSD1+ HSD1- HSD2+ HSD2- HSD3+ HSD3- V CC FSUSB63 D+ D- 2.2Ω 2.2Ω 1pF TVS 1pF TVS Figure 5. Reference Schemaic 7

Tes Diagrams V SW V Sel V SW V ON R ON = V ON / I ON Dn Selec V Sel = 0 orvcc Figure 6. On Resisance Dn C L I ON R L,, and C L are funcions of he applicaion environmen (see AC Tables for specific values) C L includes es fixure and sray capaciance. R L NC I Dn(OFF) A Selec V Sel = 0 orvcc **Each swich por is esed separaely Figure 7. Off Leakage RISE = 2.5ns V CC Inpu V /OE, V Sel 90% 90% V CC /2 V CC /2 10% V OH 10% V SW FALL = 2.5ns 90% 90% Oupu- V OL ON OFF Figure 8. AC Tes Circui Load Figure 9. Turn-On / Turn-Off Waveforms RISE = 750ps FALL = 750ps 0.4V Inpu V D+/D - 10% + V OH 90% 90% 50% 50% 10% Oupu - V OUT - V OL plh - 50% 50% phl + phl - plh + Figure 10. Propagaion Delay (RF 500ps) Figure 11. Skew Tes Waveforms SK(P)= PLH- PHL- or PLH+ PHL+ SK(I)= PLH- PHL+ or PLH+ PHL- 8

Tes Diagrams (Coninued) V Sel V SW1 V Sel and R T are funcions of he applicaion environmen (see AC Tables for specific values). Figure 13. Bandw idh V SW2 Dn C L R L R L,, and C L are funcions of he applicaion environmen (see AC Tables for specific values) C L includes es fixure and sray capaciance. Figure 12. Break-Before-Make Inerval Timing Nework Analyzer V IN R T V S V Sel V cc Inpu - V Sel 0V RISE = 2.5ns 10% 0.9*V ou 90% V cc /2 BBM and R T are funcions of he applicaion environmen (see AC Tables for specific values). R T 0.9*V ou Nework Analyzer V IN R T V S Off isolaion = 20 Log ( / V IN ) Figure 14. Channel Off Isolaion NC Nework Analyzer V IN V S V Sel R T and R T are funcions of he applicaion environmen (see AC Tables for specific values). Crossalk = 20 Log ( / V IN ) Figure 15. Non-Adjacen Channel-o-Channel Crossalk R T Capaciance Meer S V Sel = 0 or V cc Capaciance Meer S V Sel = 0 or V cc Figure 16. Channel Off Capaciance Figure 17. Channel On Capaciance 9

Physical Dimensions 2X PIN#1 IDENT 0.10 C 0.08 C 0.10 C 0.05 0.00 DETAIL A PIN#1 IDENT 1 TOP VIEW 0.55 MAX. SEATING PLANE SIDE VIEW 0.35 (11X) 0.45 3 6 12 1.80 BOTTOM VIEW 9 0.152 C A 2X B 1.80 0.40 0.10 C 0.25 0.15 (12X) 0.10 C A B 0.05 C NOTES: 0.588 1 0.40 (12X)0.20 RECOMMENDED LAND PATTERN 0.45 0.35 2.10 0.10 0.10 0.10 DETAIL A SCALE : 2X (11X) 0.563 2.10 A. PACKAGE DOES NOT FULLY CONFORM TO JEDEC STANDARD. B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. D. LAND PATTERN RECOMMENDATION IS BASED ON FSC DESIGN ONLY. E. DRAWING FILENAME: MKT-UMLP12Arev4. Ordering Informaion LEAD OPTION 1 SCALE : 2X PACKAGE EDGE LEAD OPTION 2 SCALE : 2X Figure 18. 12-Lead, Ulrahin Molded Leadless Package (UMLP) Par Number Top Mark Operaing Temperaure Range FSUSB63UMX KG -40 o +85 C Package 12-Lead, Quad, Ulrahin Molded Leadless Package (UMLP), 1.8mm x 1.8mm x 0.55mm, 0.4mm pich Package drawings are provided as a service o cusomers considering ON Semiconducor componens. Drawings may change in any manner wihou noice. Please noe he revision and/or dae on he drawing and conac a ON Semiconducor represenaive o verify or obain he mos recen revision. Package specificaions do no expand he erms of ON Semiconducor s worldwide erms and condiions, specifically he warrany herein, which covers ON Semiconducor producs. 10

ON Semiconducor and he ON Semiconducor logo are rademarks of Semiconducor Componens Indusries, LLC dba ON Semiconducor or is subsidiaries in he Unied Saes and/or oher counries. ON Semiconducor owns he righs o a number of paens, rademarks, copyrighs, rade secres, and oher inellecual propery. A lising of ON Semiconducor s produc/paen coverage may be accessed a /sie/pdf/paen-marking.pdf. ON Semiconducor reserves he righ o make changes wihou furher noice o any producs herein. ON Semiconducor makes no warrany, represenaion or guaranee regarding he suiabiliy of is producs for any paricular purpose, nor does ON Semiconducor assume any liabiliy arising ou of he applicaion or use of any produc or circui, and specifically disclaims any and all liabiliy, including wihou limiaion special, consequenial or incidenal damages. Buyer is responsible for is producs and applicaions using ON Semiconducor producs, including compliance wih all laws, regulaions and safey requiremens or sandards, regardless of any suppor or applicaions informaion provided by ON Semiconducor. Typical parameers which may be provided in ON Semiconducor daa shees and/or specificaions can and do vary in differen applicaions and acual performance may vary over ime. All operaing parameers, including Typicals mus be validaed for each cusomer applicaion by cusomer s echnical expers. ON Semiconducor does no convey any license under is paen righs nor he righs of ohers. ON Semiconducor producs are no designed, inended, or auhorized for use as a criical componen in life suppor sysems or any FDA Class 3 medical devices or medical devices wih a same or similar classificaion in a foreign jurisdicion or any devices inended for implanaion in he human body. Should Buyer purchase or use ON Semiconducor producs for any such uninended or unauhorized applicaion, Buyer shall indemnify and hold ON Semiconducor and is officers, employees, subsidiaries, affiliaes, and disribuors harmless agains all claims, coss, damages, and expenses, and reasonable aorney fees arising ou of, direcly or indirecly, any claim of personal injury or deah associaed wih such uninended or unauhorized use, even if such claim alleges ha ON Semiconducor was negligen regarding he design or manufacure of he par. ON Semiconducor is an Equal Opporuniy/Affirmaive Acion Employer. This lieraure is subjec o all applicable copyrigh laws and is no for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Lieraure Disribuion Cener for ON Semiconducor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax : 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderli@onsemi.com N. Amer ic an Technical Suppor: 800-282-9855 Toll Free USA/Canada. Eur ope, Middle Eas and Afr ica Technical Suppor: Phone: 421 33 790 2910 Japan Cusomer Focus Cener Phone: 81-3-5817-1050 ON Semic onducor Websie: Or der Lieraure: hp:///orderli For addiional informaion, please conac your local Sales Represenaive 11