Patent Applied. Magnified image Film surface. The closer the X-ray tube is placed to the work, the higher the magnification power becomes.

Similar documents
SMX-1000 Plus SMX-1000L Plus

SATECH INC. The Solutions Provider!

!"#$"%&' ()#*+,-+.&/0(

MEASUREMENT CAMERA USER GUIDE

Melting Point Apparatus

To See is to Survive!

GlobiScope Analysis Software for the Globisens QX7 Digital Microscope. Quick Start Guide

X-ray Inspection Systems 2D AXI / 3D AXI / WAXI

Flip Chip Installation using AT-GDP Rework Station

μscope Microscopy Software

Bumping of Silicon Wafers using Enclosed Printhead

Planmeca Romexis. quick guide. Viewer EN _2

Standard Operating Procedure

The ideal K-12 science microscope solution. User Guide. for use with the Nova5000

!"#$%&'()'*"+,+$&#' ' '

Professional Photograph Restoration 50 Points

A Handheld Image Analysis System for Portable and Objective Print Quality Analysis

FLIP CHIP LED SOLDER ASSEMBLY

PUBLICLY AVAILABLE SPECIFICATION

ISO 7438 INTERNATIONAL STANDARD. Metallic materials Bend test. Matériaux métalliques Essai de pliage. Second edition

Advances in X-Ray Technology for Semicon Applications Keith Bryant and Thorsten Rother

Bringing Answers to the Surface

dlsoft Barcode Analyser By dlsoft

Glenbrook presents the RTXfamily: innovative, affordable, upgradable

DIGITAL-MICROSCOPY CAMERA SOLUTIONS USB 3.0

A guide to SalsaJ. This guide gives step-by-step instructions on how to use SalsaJ to carry out basic data analysis on astronomical data files.

Image Editing and Measurement Software. User Manual

Introduction of IMS Technology for Advanced Solder Bumping on Wafers / Laminates

IMPAX 6 DISPLAY TOOL LIST

SMT Troubleshooting. Typical SMT Problems For additional process solutions, please refer to the AIM website troubleshooting guide

USING SIGNATURE IDENTIFICATION FOR RAPID AND EFFECTIVE X-RAY INSPECTION OF BALL GRID ARRAYS

SCIENTIFIC INSTRUMENT NEWS. Introduction. Design of the FlexSEM 1000

Application Bulletin 240

Ryan - Using the PhotoStitch Wizard

PROFESSIONAL PHOTOGRAPH RESTORATION WORKFLOW

GE Healthcare. Senographe 2000D Full-field digital mammography system

ISO INTERNATIONAL STANDARD. Non-destructive testing of welds Radiographic testing of fusionwelded

Quintic Software Tutorial 3

PAINT BORER 518 MC PAINTXPLORER 548

Page 21 GRAPHING OBJECTIVES:

1. What is SENSE Batch

When asked this riddle, 80% of kindergarten kids got the answer compared to 17% of Stanford University seniors.

ISO/IEC TS TECHNICAL SPECIFICATION

Motic Live Imaging Module. Windows OS User Manual

MN-ISD-A100-E ISD-A100 VIDEO MEASURING MICROSCOPE OPERATION MANUAL

Kit for building your own THz Time-Domain Spectrometer

ColorCode 3-D Editor Version 1.2 Manual. Make ColorCode 3-D, Auto 3-D and Standard 3-D images on your PC by ColorCode 3-D, Denmark!!!

Installation & User Manual Micro-Image Capture 7

First English edition for Ulead COOL 360 version 1.0, February 1999.

Table of Contents 1. Image processing Measurements System Tools...10

Optical Inspection Systems

Basic Tutorials Series: Import A Photograph. RenoWorks Support Team Document #HWPRO0003

The Problems. Spheretek Wafer Bumping The Low Cost and Reliable Solution to Production Wafer Packaging

A True Innovation in Non-Destructive Testing System FUJIFILM COMPUTED RADIOGRAPHY. Series 4 CR

Y.MU 2000 Precise inspection results for sampling and 100% inspection

True 2 ½ D Solder Paste Inspection

Module No. # 07 Lecture No. # 35 Vapour phase soldering BGA soldering and De-soldering Repair SMT failures

Explore the Art of Detection

Reflow soldering guidelines for surface mounted power modules

Applications Note. Successfully using the Model 8000 NERO dental x-ray machine timer performance. max to evaluate

BGA (Ball Grid Array)

Application Note. Soldering Guidelines for Module PCB Mounting Rev 13

Toshiba HEK3 0.3 Mp VGA CMOS Image Sensor 0.13 µm Toshiba Process

1 Scarsdale Road, Don Mills, ON, M3B 2R2 Tel: , Fax:

Y N C R O S C O P Y A DIVISION OF THE SYNOPTICS GROUP

Lab 2 Assignment Part 2: (Due two weeks following the fluorescence lab) (10 points)

BGA inspection and rework with HR 600/2 Failure analysis and assembly repair

Version Number_1.8(English Version) Copyright 2011 by Aumed, All rights reserved. Aumed Group Corp.

Chip Assembly on MID (Molded Interconnect Device) A Path to Chip Modules with increased Functionality

ImagesPlus Basic Interface Operation

Mighty Scope 5M. Instruction Manual. aveninc.com

MSE 595T Transmission Electron Microscopy. Laboratory III TEM Imaging - I

AEC-Q REV A June 1, 2000

How to Create and use Manual Linearization Profiles in Matan PhotoPrint Server

XT V Series. X-ray and CT technology for electronics inspection. nikon metrology I vision beyond precision

QAQC LAB 589 Rappahannnock Drive White Stone Va TEL (866)

Laser Scanning for Surface Analysis of Transparent Samples - An Experimental Feasibility Study

X-ray technology for electronics inspection

HOTBAR REFLOW SOLDERING

Made Easy. Jason Pancoast Engineering Manager

Recitation 2 Introduction to Photoshop

Texas Instruments TXS0108EZXYR 8 Bit Bidirectional Voltage-Level Translator

EXC500p-- PATHOLOGY MICROSCOPE. EXC500hd -- HD DIGITAL PATHOLOGY MICROSCOPE. EXC500r -- RESEARCH MICROSCOPE EXC500-LABORATORY SCOPE

FPC CONNECTORS Y3FT (0.3 mm pitch) with FPC tabs

TECHNICAL SPECIFICATION 2D INSPECTION Description

SCANNING GUIDELINES Peter Thompson (rev. 9/21/02) OVERVIEW

Powder diffractometer operation instructions D8 Advance with a Cu Kα sealed tube and Lynxeye MARCH 30, 2016

Quick and simple installation and no maintenance needed. 3 Times More affordable Than a normal SEM. Obtaining results in less than 4 minutes

PC System Requirement For Dual Microscope

Three-Axis Magnetic Sensor HMC1043L

Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design

Selective Soldering for Interconnection Technology Used in Enterprise Communication Apparatuses

MXR7202G/M. Low Cost, Low Noise ±2 g Dual Axis Accelerometer with Ratiometric Analog Outputs

Pitch Reducing Optical Fiber Array Two-Dimensional (2D)

Flip Chip Bonding Using Sony Anisotropic Conductive Film (ACF) FP1526Y

USING LEICA AS LASER MICRODISSECTION (LMD6000) MICROSCOPE Written By Jungim Hur

See what you need to see, and see it anywhere.

General Construction & Operation of Oscilloscopes

4 Use the adjustable Focus meter tool to take the subjectivity out of focusing the image, to get the best possible image

Product Information PI

Transcription:

REFLOW SCOPE X-RAY

CORES has developed on its own a special reflow oven to make the observation of larger works in size; thus,pwbs in A4 size as well as small chips or BGAs can be directly observed as they are being surface-mounted under heated conditions. Patent Applied core9060a, installing an X-ray tube right inside the reflow oven, realizes a high magnification power which has never been achieved by now as the X-ray tube in any conventional X-ray observation equipment is separately placed away from the reflow. CORES has challenged and overthrown this common concept and successfully developed a special X-ray tube and a special reflow, so that the latter can accommodate the former inside its own to achieve the magnification of X200 for observation. Image intensifier tube Magnified image Film surface Geometric magnification = Y2 / Y1 Reflow oven Y2 BGA X-ray tube Y1 Reflow X-ray focus Substrate x-ray tube Heat resistance glass The closer the X-ray tube is placed to the work, the higher the magnification power becomes.

core9060a has made it possible for the first time in its class utilizing and combining X-ray with a reflow to provide a maximum geometric magnification of 200 and a maximum monitor magnification of 500. With core9060a, you can monitor the minutest change of BGAs solder balls more clearly under heated conditions and perform more precise analysis of how solder bridges and voids develop than with any conventional X-ray observation instruments. The noises and flickers on the X-ray pictures can be eliminated while they are being taken by way of averaging treatment for their better quality. This averaging treatment can be applied as well after the X-ray pictures are all taken. The brightness and contrast of X-ray images can be easily adjusted using the scroll bars on the Adjust brightness window Five different artificial colors can be freely set, selected and applied to the X-ray pictures on the Set colors window while they are being taken for the better distinction of the details of the pictures. [Adjust brightness window] [Set colors window] Brightness and contrast to be adjusted freely with the scroll bars Click the Apply(A) button to adjust the brightness and contrast while seeing the pictures Brightness Contrast Cancel Apply(A) Artificial colors can be freely selected from among the color dialogue of 5 different ones. The coloring is effective for such pictures that lack in shade distinction. Effect coloring Cancel Apply(A)

core9060a clearly captures the way the voids of chips or BGAs develop by taking and recording the animations of solderability at high temperatures at a rate of 30 frames per minute. Connector You can see how voids develop BGA You can see how self-alignments develop Connector You can see how voids develop at high temperatures BGA You can see how self-alignments develop at high temperatures Voids under development Before self-alignment After self-alignment The quality of pictures can be improved by applying the averaging treatment and brightness and contrast adjustment after the pictures are taken as well as while they are being taken. CORES unique filing format, COR enables the improvement of quality of pictures to be feasible even after the pictures are taken. The improvement of still pictures can only be possible when the pictures are being taken. Original animation Average treatment Brightness adjustment Artificial coloring

240 220 200 180 160 140 120 100 80 60 40 20 0 0 100 200 300 400 500 600 700 800 900 1000 1100 240 220 200 180 160 140 120 100 80 60 40 20 0 0 100 200 300 400 500 600 700 800 900 1000 1100 core9060a enables you to select and display on the screen necessary data(on temperature, scale, oxygen density, etc.) obtained in the observation irrespective of whether they are being collected or they have been already collected. Take the following case for instance when you wish to use the animation data of a sample taken under heated conditions (Original animation) for 2 different purposes. One purpose is for you to send this to your R & D division, and the other to use it for your own presentation. Your R & D division may want to see the animation data along with other information, such as controlled temperatures, times elapsed, logger temperatures and scales. (Animation A) You want to use only the animation data in the presentation.( Animation B) Original animation You can select necessary data to display on the screen in the Check box for data indication Check box for data indication Enter a check mark to display controlled temps, Times elapsed, Scales and Profile graph with Logger Channel numbers. Check here Control temp Time elapsed Scale Profile graph Logger 1CH Logger 2CH Logger 3CH Logger 4CH Logger 5CH Logger 6CH Logger 7CH Logger 8CH Animation for R & A division (Animation A) Animation for your presentation (Animation B) The data obtained in the observation can be saved in animations (AVI, COR*,MPG) and in still pictures (BMP, JPEG) with added information on temperatures and times, and be available for use in making reports. COR CORES own special filing format

Touch panel window Easy axis operation for fine adjustment The axis controller, similarly to the touch panel, provides much ease and confort in axis control. Axis controller box Handy and portable for rough adjustment of axes The illustrations below show how easy you can control the axes by using either the axis controller box or the touch panel on the monitor screen even if the target moves off the position. The moving speed and amount can be automatically adjusted according to a designated magnification power. Touch panel OR Controller box At high temperatures Work moving off the position due to heat Work moving back to original position manually

Pictures are taken automatically on the setting of Teaching mode.* It is very convenient and effective when it comes to observing as many pictures as you want on a particular target work. (* under normal temperature conditions) Data on a maximum of 99 points can be saved in required sequence on the teaching mode, and magnification ratio can be adjusted at each point. core9060a is equipped with various useful measurement tools, which are easily operated by the mouse. Each calculation result is shown on the screens at lower right. Area calculation Area calculation of circles, rectangles and free lines is possible on the screen. Electrolytic condenser Area calculation: Specify the area Wire sweep ratio calculation Wire sweep ratio calculation is possible through measurement of the ends of the wire and the center of the curved lines. Bonding wire Wire sweep ratio calculation: Specify the sweep amount / Present wire sweep ratio: 3.0 % Void ratio calculation Void ratio calculation is possible given the area of the solder ball being 100 % 100% 9% Void ratio calculation: Specify the void circle / Present void ratio: 9 %

The temperature can be kept uniform all through inside the reflow by controlling the flow of the heat air from the heaters as illustrated below. CORES own and unique convectional heating method has achieved the realization of thermal environmental conditions similar to those of real reflows which apply lead-free solders and the X-ray observation of target works at high temperature heat time. Reflow furnace Cooling air Heat air Heat resistant glass X-ray tube Sideway view (image) PWB (target work) Patent Applied You can easily create temperature profiles by setting relevant temperatures and times (in second). A temperature profile has a maximum of 16 points to designate each temperature and time. The heated temperature data can be saved in CSV(Exel format). Actual screen display to set a temperature profile Tem profile Camera input Start(S) Stop(T) Record Start(R) Stop(O) Heating Indicate(V) Start(H) Stop(P) Still pictures save(c) Settings Graph(G) Temp Profile(M) Option(I)

Voids in BGA solder balls A solder bridge on BGA Voids in connector lead Solderability on connector lead Electrolytic condenser VGA connector

Main unit Warning light Main unit door Control box Touch panel 19 monitor monitor (for observation) (for operation) Height 2150mm Printer Temperature regulator Reflow control unit Main switch Key board Mouse Width 2664mm (Depths : Main unit 1335mm Furnished table 800mm) Furnished table core9060a is furnished with a special table for the compact installation of operational tools and devices. Being independent of the main unit, the table can be freely moved to a location allowing you to operate the core9060a more comfortably. Table is freely mobile on casters

Please make sure on your own whether you have to get any license from or make any report to your governmental authorities as to your installation and use of any equipment like core9060a. The relevant laws in Japan require the users of core9060a to submit such a report of installation to Labor Standard Bureau in Japan. Any alterations or additions in the specifications that may be required by your applicable governmental rules and regulations will be at your cost. Cores provides Japanese users with statutory educational programs for safety operation of the equipment at the time of its delivery and installation.

CORES Corporation Head Office : 338-3 FurukawadoTsuru-shiYamanashi Pref402-0004 Japan TEL : +81-554-45-1027 FAX : +81-554-45-6200