DATASHEET 80V,.5A Peak Current H-Bridge FET Driver The is a medium frequency, medium voltage H-Bridge N-Channel MOSFET driver IC, available in 6 lead plastic SOIC (N) and DIP packages. Specifically targeted for PWM motor control and UPS applications, bridge based designs are made simple and flexible with the H-bridge driver. With operation up to 80V, the device is best suited to applications of moderate power levels. Similar to the HIP408, it has a flexible input protocol for driving every possible switch combination except those which would cause a shoot-through condition. The s reduced drive current allows smaller packaging and it has a much wider range of programmable dead times (0. to 4.5 s) making it ideal for switching frequencies up to 00kHz. The does not contain an internal charge pump, but does incorporate non-latching level-shift translation control of the upper drive circuits. This set of features and specifications is optimized for applications where size and cost are important. For applications needing higher drive capability the HIP4080A and HIP408A are recommended. Features FN3676 Rev 5.00 Independently Drives 4 N-Channel FET in Half Bridge or Full Bridge Configurations Bootstrap Supply Max Voltage to 95VDC Drives 000pF Load in Free Air at 50 C with Rise and Fall Times of Typically 5ns User-Programmable Dead Time (0. to 4.5 s) DIS (Disable) Overrides Input Control and Refreshes Bootstrap Capacitor when Pulled Low Input Logic Thresholds Compatible with 5V to 5V Logic Levels Shoot-Through Protection Undervoltage Protection Pb-Free Plus Anneal Available (RoHS Compliant) Applications UPS Systems DC Motor Controls Full Bridge Power Supplies Switching Power Amplifiers Noise Cancellation Systems Battery Powered Vehicles Peripherals Medium/Large Voice Coil Motors Related Literature - TB363, Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs) FN3676 Rev 5.00 Page of 4
Ordering Information PART NUMBER PART MARKING TEMP. RANGE ( C) PACKAGE PKG. DWG. # IB* IB -55 to +5 6 Ld SOIC (N) M6.5 IBZ* (Note) IP (No longer available, recommended replacement: IPZ) 408IBZ -55 to +5 6 Ld SOIC (N) (Pb-free) M6.5 IP -55 to +5 6 Ld PDIP E6.3 IPZ (Note) IPZ -55 to +5 6 Ld PDIP** (Pb-free) E6.3 *Add T suffix for tape and reel. NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 00% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-00. **Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. Pinout (PDIP, SOIC) TOP VIEW BHB 6 BHO BHI 5 BHS BLI 3 4 BLO ALI 4 3 ALO DEL 5 V DD V SS 6 AHS AHI 7 0 AHO DIS 8 9 AHB FN3676 Rev 5.00 Page of 4
Application Block Diagram 80V V BHO BHS BHI BLO BLI LOAD ALI AHI ALO AHS AHO GND GND Functional Block Diagram U/V LEVEL SHIFT DRIVER 9 0 AHB AHO BHB BHO 6 DRIVER LEVEL SHIFT U/V BHI AHS BHS 5 AHI 7 TURN-ON DELAY TURN-ON DELAY DIS 8 V DD V DD DETECTOR UNDERVOLTAGE TURN-ON DELAY DRIVER 3 ALO BLO 4 DRIVER TURN-ON DELAY ALI 4 DEL 5 BLI 3 V SS 6 FN3676 Rev 5.00 Page 3 of 4
Typical Application (PWM Mode Switching) 80V BHB BHO 6 PWM INPUT DELAY RESISTOR V 3 4 5 6 BHI BLI ALI DEL V SS BHS 5 BLO 4 ALO 3 V DD AHS V LOAD 7 AHI AHO 0 DIS 8 DIS AHB 9 FROM OPTIONAL OVERCURRENT LATCH GND R DIS TO OPTIONAL CURRENT CONTROLLER OR OVERCURRENT LATCH + - R SH GND FN3676 Rev 5.00 Page 4 of 4
Absolute Maximum Ratings Supply Voltage, V DD........................... -0.3V to 6V Logic I/O Voltages....................... -0.3V to V DD +0.3V Voltage on AHS, BHS..... -6V (Transient) to 80V (5 C to 50 C) Voltage on AHS, BHS..... -6V (Transient) to 70V (-55 C to50 C) Voltage on AHB, BHB........ V AHS, BHS -0.3V to V AHS, BHS +V DD Voltage on ALO, BLO.................. V SS -0.3V to V DD +0.3V Voltage on AHO, BHO... V AHS, BHS -0.3V to V AHB, BHB +0.3V Input Current, DEL................................ -5mA to 0mA Phase Slew Rate.................................. 0V/ns NOTE: All voltages are relative V SS unless otherwise specified. Operating Conditions Supply Voltage, V DD......................... +8.5V to +5V Voltage on V SS.............................. -.0V to +.0V Voltage on AHB, BHB........V AHS, BHS +7.5V to V AHS, BHS +V DD Input Current, DEL......................... -4mA to -00 A Thermal Information Thermal Resistance JA ( C/W) SOIC Package............................. 5 DIP Package.............................. 90 Maximum Power Dissipation........................ See Curve Storage Temperature Range..................-65 C to +50 C Operating Max. Junction Temperature.................. +50 C Lead Temperature (Soldering 0s).................... +300 C (For SOIC - Lead Tips Only)) CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Specifications V DD = V AHB = V BHB = V, V SS = V AHS = V BHS = 0V, R DEL = 00K T J = +5 C T J = -55 C TO +50 C PARAMETER SYMBOL TEST CONDITIONS SUPPLY CURRENTS & UNDER VOLTAGE PROTECTION MIN TYP MAX MIN MAX UNITS V DD Quiescent Current I DD All inputs = 0V, R DEL = 00K..3 3.5 0.85 4 ma All inputs = 0V, R DEL = 0K. 4.0 5.5.9 6.0 ma V DD Operating Current I DDO f = 50kHz, no load.5.6 4.0. 4. ma 50kHz, no load, R DEL = 0k.5 4.0 6.4. 6.6 ma AHB, BHB Off Quiescent Current I AHBL, I BHBL AHI = BHI = 0V 0.5.0.5 0.4.6 ma AHB, BHB On Quiescent Current I AHBH, I BHBH AHI = BHI = V DD 65 45 40 40 50 A AHB, BHB Operating Current I AHBO, I BHBO f = 50kHz, CL = 000pF.65..8.45.0 ma AHS, BHS Leakage Current I HLK V AHS = V BHS = 80V V AHB = V BHB = 96 V DD = Not Connected - -.0 - - A V DD Rising Undervoltage Threshold V DDUV+ 6.8 7.6 8.5 6.5 8.5 V V DD Falling Undervoltage Threshold V DDUV- 6.5 7. 7.8 6.5 8. V Undervoltage Hysteresis UVHYS 0.7 0.4 0.75 0.5 0.90 V AHB, BHB Undervoltage Threshold VHBUV Referenced to AHS & BHS 5 6.0 7 4.5 7.5 V INPUT PINS: ALI, BLI, AHI, BHI, & DIS Low Level Input Voltage V IL Full Operating Conditions - -.0-0.8 V High Level Input Voltage V IH Full Operating Conditions.5 - -.7 V Input Voltage Hysteresis - 35 - - - mv Low Level Input Current I IL V IN = 0V, Full Operating Conditions -45-00 -60-50 -50 A High Level Input Current I IH V IN = 5V, Full Operating Conditions - - + -0 +0 A TURN-ON DELAY PIN DEL Dead Time T DEAD R DEL = 00K.5 4.5 8.0.0 8.5 s R DEL = 0K 0.7 0.5 0.75 0. 0.85 s FN3676 Rev 5.00 Page 5 of 4
Electrical Specifications V DD = V AHB = V BHB = V, V SS = V AHS = V BHS = 0V, R DEL = 00K (Continued) T J = +5 C T J = -55 C TO +50 C PARAMETER SYMBOL TEST CONDITIONS GATE DRIVER OUTPUT PINS: ALO, BLO, AHO, & BHO MIN TYP MAX MIN MAX UNITS Low Level Output Voltage V OL I OUT = 50mA 0.65. 0.5. V High Level Output Voltage V DD -V OH I OUT = -50mA 0.7. 0.5.3 V Peak Pullup Current I O + V OUT = 0V..4.5 0.85.75 A Peak Pulldown Current I O - V OUT = V.0.3.3 0.75.5 A Switching Specifications V DD = V AHB = V BHB = V, V SS = V AHS = V BHS = 0V, R DEL = 00K, C L = 000pF. T J = +5 C T J = -55 C TO +50 C PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX MIN MAX UNITS Lower Turn-off Propagation Delay (ALI-ALO, BLI-BLO) Upper Turn-off Propagation Delay (AHI-AHO, BHI-BHO) Lower Turn-on Propagation Delay (ALI-ALO, BLI-BLO) Upper Turn-on Propagation Delay (AHI-AHO, BHI-BHO) T LPHL - 5 50-70 ns T HPHL - 55 80-00 ns T LPLH - 40 85-00 ns T HPLH - 75 0-50 ns Rise Time T R - 9 0-5 ns Fall Time T F - 9 0-5 ns Minimum Input Pulse Width T PWIN-ON/OFF 50 - - 50 - ns Output Pulse Response to 50 ns Input Pulse T PWOUT 63 80 ns Disable Turn-off Propagation Delay (DIS - Lower Outputs) Disable Turn-off Propagation Delay (DIS - Upper Outputs) Disable Turn-on Propagation Delay (DIS - ALO & BLO) Disable Turn-on Propagation Delay (DIS- AHO & BHO) T DISLOW - 50 80-90 ns T DISHIGH - 75 00-5 ns T DLPLH - 40 70-00 ns T DHPLH R DEL = 0K -. - 3 s Refresh Pulse Width (ALO & BLO) T REF-PW 375 580 900 350 950 ns TRUTH TABLE INPUT OUTPUT ALI, BLI AHI, BHI VDDUV VHBUV DIS ALO, BLO AHO, BHO X X X X 0 0 X X X X 0 0 0 X 0 0 0 0 X 0 X 0 0 0 0 0 0 0 0 0 0 0 0 0 0 NOTE: X signifies that input can be either a or 0. FN3676 Rev 5.00 Page 6 of 4
Pin Descriptions PIN NUMBER SYMBOL DESCRIPTION BHB B High-side Bootstrap supply. External bootstrap diode and capacitor are required. Connect cathode of bootstrap diode and positive side of bootstrap capacitor to this pin. BHI B High-side Input. Logic level input that controls BHO driver (Pin 6). BLI (Pin 3) high level input overrides BHI high level input to prevent half-bridge shoot-through, see Truth Table. DIS (Pin 8) high level input overrides BHI high level input. The pin can be driven by signal levels of 0V to 5V (no greater than V DD ). 3 BLI B Low-side Input. Logic level input that controls BLO driver (Pin 4). If BHI (Pin ) is driven high or not connected externally then BLI controls both BLO and BHO drivers, with dead time set by delay currents at DEL (Pin 5). DIS (Pin 8) high level input overrides BLI high level input. The pin can be driven by signal levels of 0V to 5V (no greater than V DD ). 4 ALI A Low-side Input. Logic level input that controls ALO driver (Pin 3). If AHI (Pin 7) is driven high or not connected externally then ALI controls both ALO and AHO drivers, with dead time set by delay currents at DEL (Pin 5). DIS (Pin 8) high level input overrides ALI high level input. The pin can be driven by signal levels of 0V to 5V (no greater than V DD ). 5 DEL Turn-on DELay. Connect resistor from this pin to V SS to set timing current that defines the dead time between drivers. All drivers turn-off with no adjustable delay, so the DEL resistor guarantees no shoot-through by delaying the turn-on of all drivers. The voltage across the DEL resistor is approximately Vdd -V. 6 V SS Chip negative supply, generally will be ground. 7 AHI A High-side Input. Logic level input that controls AHO driver (Pin 0). ALI (Pin 4) high level input overrides AHI high level input to prevent half-bridge shoot-through, see Truth Table. DIS (Pin 8) high level input overrides AHI high level input. The pin can be driven by signal levels of 0V to 5V (no greater than V DD ). 8 DIS DISable input. Logic level input that when taken high sets all four outputs low. DIS high overrides all other inputs. When DIS is taken low the outputs are controlled by the other inputs. The pin can be driven by signal levels of 0V to 5V (no greater than V DD ). 9 AHB A High-side Bootstrap supply. External bootstrap diode and capacitor are required. Connect cathode of bootstrap diode and positive side of bootstrap capacitor to this pin. 0 AHO A High-side Output. Connect to gate of A High-side power MOSFET. AHS A High-side Source connection. Connect to source of A High-side power MOSFET. Connect negative side of bootstrap capacitor to this pin. V DD Positive supply to control logic and lower gate drivers. De-couple this pin to V SS (Pin 6). 3 ALO A Low-side Output. Connect to gate of A Low-side power MOSFET. 4 BLO B Low-side Output. Connect to gate of B Low-side power MOSFET. 5 BHS B High-side Source connection. Connect to source of B High-side power MOSFET. Connect negative side of bootstrap capacitor to this pin. 6 BHO B High-side Output. Connect to gate of B High-side power MOSFET. FN3676 Rev 5.00 Page 7 of 4
Timing Diagrams X = A OR B, A AND B HALVES OF BRIDGE CONTROLLER ARE INDEPENDENT T LPHL T HPHL DIS=0 and UV XLI XHI XLO XHO T HPLH T LPLH T R (0% - 90%) T F (0% - 90%) FIGURE. INDEPENDENT MODE DIS=0 and UV XLI XHI = HI OR NOT CONNECTED XLO XHO FIGURE. BISTATE MODE T DLPLH T DIS DIS or UV T REF-PW XLI XHI XLO XHO T DHPLH FIGURE 3. DISABLE FUNCTION FN3676 Rev 5.00 Page 8 of 4
Performance Curves I DD SUPPLY CURRENT (ma) 3.5 3.5 3.75.5.5.75 V DD = 6V V DD = V V DD = 0V V DD = 8V V DD = 5V.5-60 -40-0 0 0 40 60 80 00 0 40 JUNCTION TEMPERATURE ( C) FIGURE 4. I DD SUPPLY CURRENT vs TEMPERATURE AND V DD SUPPLY VOLTAGE I DD SUPPLY CURRENT (ma) 6 5 4 3 0 9 8 7 6 5 00kHz 00kHz 50kHz 0kHz 4-60 -40-0 0 0 40 60 80 00 0 40 JUNCTION TEMPERATURE ( C) FIGURE 5. V DD SUPPLY CURRENT vs TEMPERATURE AND SWITCHING FREQUENCY (000pF LOAD) 8.95 LOADED, NL BIAS CURRENTS (ma) 7 6 5 4 3 000pF LOAD NO LOAD 0 0 50 00 50 00 FREQUENCY (khz) FIGURE 6. FLOATING (IXHB) BIAS CURRENT vs FREQUENCY AND LOAD PEAK GATE CURRENT (A).75.5 I SRC (BIAS ).5 I SNK (BIAS) 0.75 SOURCE SINK 0.85 0.5 8 9 0 3 4 5 8 BIAS 5 BIAS SUPPLY VOLTAGE (V) AT 5 C FIGURE 7. GATE SOURCE/SINK PEAK CURRENT vs BIAS SUPPLY VOLTAGE AT 5 C..4 NORMALIZED GATE SINK/SOURCE CURRENT (A). 0.9 0.8-75 -50-5 0 5 50 75 00 5 50 JUNCTION TEMPERATURE ( C) FIGURE 8. GATE CURRENT vs TEMPERATURE, NORMALIZED TO 5 C V DD -V OH (V) -40 C 0 C. -55 C 5 C 5 C 50 C 0.8 0.6 8 9 0 3 4 5 V DD SUPPLY VOLTAGE (V) FIGURE 9. V DD -V OH vs BIAS VOLTAGE TEMPERATURE FN3676 Rev 5.00 Page 9 of 4
Performance Curves (Continued) V OL (V).4. -40 C 0 C -55 C 5 C 0.8 5 C 50 C 0.6 8 9 0 3 4 V DD SUPPLY VOLTAGE (V) FIGURE 0. V OL vs BIAS VOLTAGE AND TEMPERATURE 5 V DD, BIAS SUPPLY VOLTAGE (V) 8 7.5 7 6.5 6 5.5 LOWER U/V RESET LOWER U/V SET UPPER U/V SET/RESET 5-60 -40-0 0 0 40 60 80 00 0 40 60 JUNCTION TEMPERATURE ( C) FIGURE. UNDERVOLTAGE TRIP VOLTAGES vs TEMPERATURE 00 0 4 PROPAGATION DELAYS (ns) 90 80 70 60 50 40 30 UPPER t ON UPPER t OFF LOWER t ON LOWER t OFF 0-60 -40-0 0 0 40 60 80 00 0 40 60 JUNCTION TEMPERATURE ( C) FIGURE. UPPER LOWER TURN-ON/TURN-OFF PROPAGATION DELAY vs TEMPERATURE DIS TO TURN-ON/OFF TIME (ns) 000 00 DISHTON DISHTOFF DISLOFF DISLTON 0-60 -40-0 0 0 40 60 80 00 0 40 60 JUNCTION TEMPERATURE ( C) FIGURE 3. UPPER/LOWER DIS(ABLE) TO TURN-ON/OFF vs TEMPERATURE ( C).5 LEVEL-SHIFT CURRENT (ma).5 TOTAL POWER DISSIPATION (W).5 0.5 SOIC 6 PIN DIP QUIESCENT BIAS COMPONENT 0.5 0 0 40 60 80 00 SWITCHING FREQUENCY (khz) FIGURE 4. FULL BRIDGE LEVEL-SHIFT CURRENT vs FREQUENCY (khz) 0-60 -30 0 30 60 90 0 50 AMBIENT TEMPERATURE ( C) FIGURE 5. MAXIMUM POWER DISSIPATION vs AMBIENT TEMPERATURE FN3676 Rev 5.00 Page 0 of 4
Performance Curves (Continued) 0 4 90 V DD = 5V 85 DEAD TIME (ns) 000 V DD = 9V V DD = V V XHS -V SS 80 75 00 0 0 0 30 40 50 60 70 80 90 00 DEAD TIME RESISTANCE (k ) 70 00 50 0 50 00 50 TEMPERATURE ( C) FIGURE 6. DEAD-TIME vs DEL RESISTANCE AND BIAS SUPPLY (V DD ) VOLTAGE FIGURE 7. MAXIMUM OPERATING PEAK AHS/BHS VOLTAGE vs TEMPERATURE FN3676 Rev 5.00 Page of 4
Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that you have the latest revision. DATE REVISION CHANGE FN3676.5 Updated the Ordering Information Table on page. Added Revision History and About Intersil sections. About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets. For the most updated datasheet, application notes, related documentation and related parts, please see the respective product information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support. FN3676 Rev 5.00 Page of 4
Dual-In-Line Plastic Packages (PDIP) INDEX AREA N 3 N/ -B- -A- D E BASE PLANE A -C- A SEATING PLANE L C L D A e D A B e e C C B e B 0.00 (0.5) M C A B S NOTES:. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control.. Dimensioning and tolerancing per ANSI Y4.5M-98. 3. Symbols are defined in the MO Series Symbol List in Section. of Publication No. 95. 4. Dimensions A, A and L are measured with the package seated in JE- DEC seating plane gauge GS-3. 5. D, D, and E dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.00 inch (0.5mm). 6. E and e A are measured with the leads constrained to be perpendicular to datum -C-. 7. e B and e C are measured at the lead tips with the leads unconstrained. e C must be zero or greater. 8. B maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.00 inch (0.5mm). 9. N is the maximum number of terminal positions. 0. Corner leads (, N, N/ and N/ + ) for E8.3, E6.3, E8.3, E8.3, E4.6 will have a B dimension of 0.030-0.045 inch (0.76 -.4mm). E E6.3 (JEDEC MS-00-BB ISSUE D) 6 LEAD DUAL-IN-LINE PLASTIC PACKAGE INCHES MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A - 0.0-5.33 4 A 0.05-0.39-4 A 0.5 0.95.93 4.95 - B 0.04 0.0 0.356 0.558 - B 0.045 0.070.5.77 8, 0 C 0.008 0.04 0.04 0.355 - D 0.735 0.775 8.66 9.68 5 D 0.005-0.3-5 E 0.300 0.35 7.6 8.5 6 E 0.40 0.80 6.0 7. 5 e 0.00 BSC.54 BSC - e A 0.300 BSC 7.6 BSC 6 e B - 0.430-0.9 7 L 0.5 0.50.93 3.8 4 N 6 6 9 Rev. 0 /93 FN3676 Rev 5.00 Page 3 of 4
Small Outline Plastic Packages (SOIC) N INDEX AREA 3 e D B 0.5(0.00) M C A M E -B- -A- -C- SEATING PLANE A B S H 0.5(0.00) M B A 0.0(0.004) NOTES:. Symbols are defined in the MO Series Symbol List in Section. of Publication Number 95.. Dimensioning and tolerancing per ANSI Y4.5M-98. 3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.5mm (0.006 inch) per side. 4. Dimension E does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.5mm (0.00 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. L is the length of terminal for soldering to a substrate. 7. N is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width B, as measured 0.36mm (0.04 inch) or greater above the seating plane, shall not exceed a maximum value of 0.6mm (0.04 inch). 0. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. L M h x 45 C M6.5 (JEDEC MS-0-AC ISSUE C) 6 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.053 0.0688.35.75 - A 0.0040 0.0098 0.0 0.5 - B 0.03 0.00 0.33 0.5 9 C 0.0075 0.0098 0.9 0.5 - D 0.3859 0.3937 9.80 0.00 3 E 0.497 0.574 3.80 4.00 4 e 0.050 BSC.7 BSC - H 0.84 0.440 5.80 6.0 - h 0.0099 0.096 0.5 0.50 5 L 0.06 0.050 0.40.7 6 N 6 6 7 0 8 0 8 - Rev. 6/05 Copyright Intersil Americas LLC 003-05. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO900 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN3676 Rev 5.00 Page 4 of 4