N-Channel Enhancement Mode MOSFET Features Pin Description 30V/5.1A, R DS(ON) =25mΩ(max.) @ V GS =10V R DS(ON) =35mΩ(max.) @ V GS =4.5V Reliable and Rugged Lead Free and Green Devices Available (RoHS Compliant) 100% UIS + R g Tested D S G Top View of SOT-23-3 D Applications Power Magangement in Notebook Computer, Portable Equipment and Battery Powered Systems. Load Switch G S N-Channel MOSFET Ordering and Marking Information SM2304NS Assembly Material Handling Code Temperature Range Package Code Package Code A : SOT-23-3 Operating Junction Temperature Range C : -55 to 150 o C Handling Code TR : Tape & Reel (3000ea/reel) Assembly Material G : Halogen and Lead Free Device SM2304NS A: A04XX XX - Lot Code Note : SINOPOWER lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. SINOPOWER lead-free products meet or exceed the leadfree requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. SINOPOWER defines Green to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). SINOPOWER reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. 1
Absolute Maximum Ratings (T A = 25 C unless otherwise noted) Symbol Parameter Rating Unit V DSS Drain-Source Voltage 30 V V GSS Gate-Source Voltage ±20 I D T A =25 C 5.1 Continuous Drain Current T A =70 C 4.1 A I DM Pulsed Drain Current V GS =10V 20 I S Diode Continuous Forward Current 1.5 A T J Maximum Junction Temperature 150 C T STG Storage Temperature Range -55 to 150 P D R θja * Maximum Power Dissipation T A =25 C 1 T A =70 C 0.64 W Thermal Resistance-Junction to Ambient t 10sec 90 Steady state 125 C/W I AS Avalanche Current, Single pulse L=0.5mH 7 A E AS Avalanche Energy, Single pulse L=0.5mH 12.25 mj Note *:Surface Mounted on 1in 2 pad area, t 10sec. 2
Electrical Characteristics (T A = 25 C unless otherwise noted) Symbol Parameter Test Conditions Min. Typ. Max. Unit Static Characteristics BV DSS Drain-Source Breakdown Voltage V GS =0V, I DS =250µA 30 - - V I DSS Zero Gate Voltage Drain Current V DS =24V, V GS =0V - - 1 T J =85 C - - 30 V GS(th) Gate Threshold Voltage V DS =V GS, I DS =250µA 1.3 1.8 2.5 V I GSS Gate Leakage Current V GS =±20V, V DS =0V - - ±100 na R DS(ON) a Drain-Source On-State Resistance Diode Characteristics V SD a V GS =10V, I DS =8A - 21 25 V GS =4.5V, I DS =5A - 27 35 Diode Forward Voltage I SD =1A, V GS =0V - 0.75 1.1 V t rr Reverse Recovery Time - 12.8 - ns I SD =8A, dl SD /dt=100a/µs Q rr Reverse Recovery Charge - 3.8 - nc Dynamic Characteristics b R g Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1.5 - Ω C iss Input Capacitance V GS =0V, - 410 - C oss Output Capacitance V DS =15V, - 70 - C rss Reverse Transfer Capacitance Frequency=1.0MHz - 41 - t d(on) Turn-on Delay Time - 6 10 T r Turn-on Rise Time V DD =15V, R L =15Ω, - 9 13 I DS =1A, V GEN =10V, t d(off) Turn-off Delay Time R G =6Ω - 14 20 T f Turn-off Fall Time - 3.2 5 Gate Charge Characteristics b Q g Total Gate Charge V DS =30V, I DS =8A V GS =4.5V, - 4 - V GS =10V - 8 - Q gs Gate-Source Charge - 1.5 - Q gd Gate-Drain Charge V DS =30V, V GS =10V, I DS =8A - 1.5 - Qgth Threshold Gate Charge - 0.75 - Note a:pulse test; pulse width 300µs, duty cycle 2%. Note b:guaranteed by design, not subject to production testing. µa mω pf ns nc 3
Typical Operating Characteristics Power Dissipation Drain Current 1.2 6 1.0 5 Ptot - Power (W) 0.8 0.6 0.4 ID - Drain Current (A) 4 3 2 0.2 1 T A =25 o C 0.0 0 20 40 60 80 100 120 140 160 T A =25 o C,V G =10V 0 0 20 40 60 80 100 120 140 160 Tj - Junction Temperature ( C) Tj - Junction Temperature ( C) Safe Operation Area Thermal Transient Impedance ID - Drain Current (A) 50 10 1 0.1 Rds(on) Limit 300µs 1ms 10ms 100ms 1s DC T A =25 o C 0.01 0.01 0.1 1 10 100 300 VDS - Drain - Source Voltage (V) Normalized Transient Thermal Resistance 2 1 0.1 0.01 0.01 0.02 0.05 0.1 Single Pulse 0.2 Duty = 0.5 Mounted on 1in 2 pad R θja : 90 o C/W 1E-3 1E-4 1E-3 0.01 0.1 1 10 60 Square Wave Pulse Duration (sec) 4
Typical Operating Characteristics (Cont.) 20 Output Characteristics V GS =4,5,6,7,8,9,10V 40 Drain-Source On Resistance ID - Drain Current (A) 16 12 8 4 3.5V 3V RDS(ON) - On - Resistance (mω) 35 30 25 20 15 V GS =4.5V V GS =10V 2.5V 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 10 0 4 8 12 16 20 VDS - Drain - Source Voltage (V) ID - Drain Current (A) Gate-Source On Resistance Gate Threshold Voltage 60 I DS =8A 1.6 I DS =250µA RDS(ON) - On - Resistance (mω) 50 40 30 20 Normalized Threshold Voltage 1.4 1.2 1.0 0.8 0.6 10 2 3 4 5 6 7 8 9 10 0.4-50 -25 0 25 50 75 100 125 150 VGS - Gate - Source Voltage (V) Tj - Junction Temperature ( C) 5
Typical Operating Characteristics (Cont.) 1.8 1.6 Drain-Source On Resistance V GS = 10V I DS = 8A 20 10 Source-Drain Diode Forward Normalized On Resistance 1.4 1.2 1.0 0.8 0.6 IS - Source Current (A) 1 T j =150 o C T j =25 o C 0.4 R ON @T j =25 o C: 21mΩ 0.2-50 -25 0 25 50 75 100 125 150 Tj - Junction Temperature ( C) 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 VSD - Source - Drain Voltage (V) C - Capacitance (pf) 550 500 450 400 350 300 250 200 150 100 50 Crss Capacitance Frequency=1MHz Ciss Coss VGS - Gate - source Voltage (V) 10 9 8 7 6 5 4 3 2 1 V DS =15V I DS =8A Gate Charge 0 0 5 10 15 20 25 30 VDS - Drain - Source Voltage (V) 0 0 2 4 6 8 QG - Gate Charge (nc) 6
Avalanche Test Circuit and Waveforms VDS L tp VDSX(SUS) DUT VDS RG VDD IAS tp IL 0.01W VDD EAS tav Switching Time Test Circuit and Waveforms VDS RD DUT VDS 90% RG VGS VDD tp 10% VGS td(on) tr td(off) tf 7
Disclaimer Sinopower Semiconductor, Inc. (hereinafter Sinopower ) has been making great efforts to development high quality and better performance products to satisfy all customers needs. However, a product may fail to meet customer s expectation or malfunction for various situations. All information which is shown in the datasheet is based on Sinopower s research and development result, therefore, Sinopower shall reserve the right to adjust the content and monitor the production. In order to unify the quality and performance, Sinopower has been following JEDEC while defines assembly rule. Notwithstanding all the suppliers basically follow the rule for each product, different processes may cause slightly different results. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the products. Sinopower does not grant customers explicitly or implicitly, any license to use or exercise intellectual property or other rights held by Sinopower and other parties. Sinopower shall bear no responsible whatsoever for any dispute arising from the use of such technical information. The products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability, such as the failure or malfunction of which any may result in a direct threat to human life or a risk of human injury. Sinopower shall bear no responsibility in any way for use of any of the products for the above special purposes. If a product is intended to use for any such special purpose, such as vehicle, military, or medical controller relevant applications, please contact Sinopower sales representative before purchasing. 8
Package Information SOT-23-3 D e -T- SEATING PLANE < 4 mils SEE VIEW A A2 A 0.25 E1 E b c e1 A1 L 0 GAUGE PLANE SEATING PLANE VIEW A S Y M B O L A A1 A2 b c D E E1 e e1 L 0.30 0 MIN. 0.00 0.90 0.30 0.08 2.60 1.40 MILLIMETERS 0.95 BSC 1.90 BSC MAX. 1.20 0.08 1.12 0.50 0.22 3.00 1.80 SOT-23-3 MIN. 0.000 0.035 0.012 0.003 0.60 0.012 INCHES 0.037 BSC 0.075 BSC MAX. 0.047 0.003 0.044 0.020 0.009 2.70 3.10 0.106 0.122 0.102 0.055 0.118 0.071 0.024 0 8 0 8 Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. RECOMMENDED LAND PATTERN 0.8 2.4 0.8 0.95 UNIT: mm 9
Carrier Tape & Reel Dimensions OD0 P0 P2 P1 A W F E1 K0 B A0 OD1 B A T B0 SECTION A-A SECTION B-B d H A T1 Application A H T1 C d D W E1 F SOT-23-3 178.0±2.00 50 MIN. 8.4+2.00-0.00 13.0+0.50-0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05 P0 P1 P2 D0 D1 T A0 B0 K0 4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10-0.00 1.0 MIN. 0.6+0.00-0.40 3.20±0.20 3.10±0.20 1.50±0.20 (mm) 10
Taping Direction Information SOT-23-3 USER DIRECTION OF FEED Classification Profile 11
Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Preheat & Soak Temperature min (T smin ) Temperature max (T smax ) Time (T smin to T smax ) (t s ) 100 C 150 C 60-120 seconds 150 C 200 C 60-120 seconds Average ramp-up rate (T smax to T P ) 3 C/second max. 3 C/second max. Liquidous temperature (T L ) Time at liquidous (t L ) Peak package body Temperature (T p )* Time (t P )** within 5 C of the specified classification temperature (T c ) 183 C 60-150 seconds 217 C 60-150 seconds See Classification Temp in table 1 See Classification Temp in table 2 20** seconds 30** seconds Average ramp-down rate (T p to T smax ) 6 C/second max. 6 C/second max. Time 25 C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile Temperature (T p ) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. Table 1. SnPb Eutectic Process Classification Temperatures (Tc) Package Thickness Volume mm 3 <350 Table 2. Pb-free Process Classification Temperatures (Tc) Volume mm 3 350 <2.5 mm 235 C 220 C 2.5 mm 220 C 220 C Package Thickness Volume mm 3 <350 Volume mm 3 350-2000 Volume mm 3 >2000 <1.6 mm 260 C 260 C 260 C 1.6 mm 2.5 mm 260 C 250 C 245 C 2.5 mm 250 C 245 C 245 C Reliability Test Program Test item Method Description SOLDERABILITY JESD-22, B102 5 Sec, 245 C HTRB JESD-22, A108 1000 Hrs, 80% of VDS max @ Tjmax HTGB JESD-22, A108 1000 Hrs, 100% of VGS max @ Tjmax PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121 C TCT JESD-22, A104 500 Cycles, -65 C~150 C Customer Service Sinopower Semiconductor, Inc. 5F, No. 6, Dusing 1St Rd., Hsinchu Science Park, Hsinchu, 30078, Taiwan TEL: 886-3-5635818 Fax: 886-3-5642050 12