H Infrared IrDA Compliant Transceiver Technical Data HSDL-1 Features Low Cost Infrared Data Link Guaranteed to Meet IrDA Physical Layer Specifications 1 cm to 1 Meter Operating Distance 3 Viewing Angle 2.4 KBd to 115.2 KBd Data Rate Daylight Cancellation Easily Implemented Direct Connection to Various I/O Chips Small Form Factor Several Lead and Shipping Configurations Available Excellent EMI Immunity (> 1 V/m) Applications Data Comm: Serial Data Transfer Between: Notebook Computers Subnotebooks Desktop PCs PDAs Printers Other Peripheral Devices Telecom: Modem, Fax, Pager, Phone Industrial: Data Collection Devices Medical: Patient and Pharmaceutical Data Collection Description: The HSDL-1 serial infrared module performs low cost, low power, point-to-point, through the air data transfer in a serial, halfduplex mode. The module has been designed to the IrDA (Infrared Data Association) Physical Layer Specifications. The module is designed to operate from to 1 meter at a data rate of 115.2 Kbd per second at a 3 viewing angle. The HSDL-1 contains a high speed, high efficiency TS AlGaAs 875 nm LED, a PIN Silicon photodiode and an integrated circuit. The IC contains an LED driver, amplifiers and a quantizer. The module is designed to interface directly with selected I/O chips that incorporate logic which performs pulse width modulation/ demodulation. V+ Schematic LED C R LED LED A LED BUTTRESS LEAD* TXD R I TXD V PIN PIN ONE RXD RXD CX1 PHOTODIODE COMPARATOR HP 1 YYWW PIN ONE INDICATOR PIN ONE V+ GND CX4 CX3 V CC CX2 CX2 GND + V PIN 5964-9641E * SIDE BUTTRESS LEADS ARE FOR MECHANICAL STABILITY AND SHOULD NOT BE CONNECTED TO ANY ELECTRICAL POTENTIAL. 4-33
Package Dimensions Option X1* 12.95 (.51) 13.45 (.53).43 (.17) MAX. 6.4 ±.25 (.25 ±.1) 3.4 ±.25 (.14 ±.1) 3.4 ±.25 (.14 ±.1) -B- 8.54 ±.15 (.336 ±.1) MAX..9 ±.25 (.4 ±.1) 6.9 ±.25 (.27 ±.1) 1 2 3 4 5 6 7 8.51 ±.8 (.2 ±.3) (8x) -C- 7 ±.15 (.5 ±.1) (7x) 1.9 ±.25 (.8 ±.1) 16.61 ±.15 (.654 ±.1) 6.2 ±.25 (.24 ±.1) 5.93 ±.25 (.23 ±.1) -A- 5. (1x).6 ±.25 (.2 ±.1) (1x) DIMENSIONS IN MILLIMETERS (INCHES)..13 ±.8 (.5 ±.3) Option X2*.43 (.17) MAX. 3.4 ±.25 (.14 ±.1) 13.2 ±.25 (.52 ±.1) 6.4 ±.25 (.25 ±.1) 8.5 ±.15 (.317 ±.1) MAX. 6.9 ±.25 (.27 ±.1) 3.4 ±.25 (.14 ±.1) 1 2 3 4 5 6 7 8 7 ±.15 (.5 ±.1) (7x) 15.39 ±.15 (.66 ±.1).51 ±.8 (.2 ±.3) (8x) 4.56 ±.15 (.18 ±.1) 8 ±.15 (.5 ±.1) -C- -B- 3.36 ±.15 (.132 ±.1).5 ±.13 (.2 ±.5) 15.13 ±.15 (.596 ±.1) 3.12 ±.15 (.123 ±.1) 3.28 ±.15 (.129 ±.1) 6.2 ±.25 (.24 ±.1) 5.93 ±.25 (.23 ±.1) -A- 5. (8x) 3.8 ±.15 (.15 ±.1) 8.88 ±.15 (.349 ±.1).6 ±.25 (.2 ±.1) COPLANARITY ±.5 mm (.2 INCHES). DIMENSIONS IN MILLIMETERS (INCHES). Note: The -B- datum is formed by the two highest points of the combined surface formed by this surface and the corresponding surface of the same lead on the opposite side of the package. *X position indicates packaging. = tape and reel, 1 = JEDEC standard tray. 4-34
Package Dimensions (continued) Option X3* 13.2 ±.25.43 (.2) MAX. 11. ±.13 (.43 ±.1) COPLANARITY OF SURFACE MOUNT LEADS TO BE WITHIN.3 mm. 7.11 ±.15 (.28 ±.1).6 ±.25 (.2 ±.1).76 ±.15 (.3 ±.1) 2.54 ±.15 (.1 ±.1) 1.39 ±.15 (.5 ±.1).3 S A B C 2.79 ±.15 (.11 ±.1).3 S A B C 3.4 ±.25 (.14 ±.1) 4.95 ±.15 (.195 ±.1) 3.43 ±.15 (.135 ±.1).51 ±.15 (.2 ±.1) 7 ±.15 (.5 ±.1) 14.73 ±.15 (.58 ±.1) (.52 ±.1) 6.4 ±.25 (.25 ±.1) 11.68 ±.15 (.46 ±.1) 6.9 ±.25 (.27 ±.1).3 S A B C 7.62 ±.15 (.3 ±.1) 5.9 ±.25 (.23 ±.1) DIMENSIONS IN MILLIMETERS (INCHES). 7.87 ±.15 (.31 ±.1) 6.2 ±.25 (.24 ±.1) 6.75 ±.15 (.266 ±.1) 3.81 ±.15 (.15 ±.1) 5.8 ±.15 (.2 ±.1) Option X4* 3.43 ±.25 (.14 ±.1).43 (.2) MAX. 13.21 ±.25 (.52 ±.1) 6.35 ±.25 (.25 ±.1) 8.75 ±.15 (.345 ±.1) MAX. 6.86 ±.25 (.27 ±.1) 3.43 ±.25 (.14 ±.1) -C- -B- 3.84 (.151) 7 ±.15 (.5 ±.1) (7x) -C- -A- -B- 1 2 3 4 5 6 7 8 5. ± 3.5.51 ±.8 (.2 ±.3) (8x).9 ±.25 (.4 ±.1) 15.89 ±.15 (.626 ±.1) 6.22 ±.25 (.24 ±.1) 6.79 ±.25 (.27 ±.1) APPROX. CG.61 ±.25 (.2 ±.1) 5.93 ±.25 (.23 ±.1) 4.12 ±.15 (.162 ±.6) COPLANARITY ±.76 mm (.3 INCHES). 5..76 ±.8 (.3 ±.3) (2x) DIMENSIONS IN MILLIMETERS (INCHES). Note: The -B- datum is formed by the two highest points of the combined surface formed by this surface and the corresponding surface of the same lead on the opposite side of the package. *X position indicates packaging. = tape and reel, 1 = JEDEC standard tray. 4-35
Truth Table Inputs Outputs TXD EI [1] LED LEDA RXD V IH X ON Low Low [2] V IL EI H OFF High Low [2] V IL EI L OFF High High X = Don t care. Notes: 1. EI received in band light intensity present at detector surface. 2. Logic Low is a pulsed response. A receiver output low state V OL (RXD) is not indefinitely maintained, but is instead a pulsed response. The output low state is maintained for a duration dependent on the incident bit pattern and the incident intensity (EI). Pinout Pin Description Symbol 1 Daylight Cancellation Capacitor CX1 2 PIN Bypass Capacitor CX2 3 Supply Voltage V CC 4 Receiver Data Output RXD 5 Ground Gnd 6 Transmitter Data Input TXD 7 LED Cathode LEDC 8 LED Anode LEDA Absolute Maximum Ratings Parameter Symbol Min. Max. Units Conditions Fig. Storage Temperature T S -2 85 C Operating Temperature T A 7 C Lead Solder Temperature 26 C For 1 s (1.6 mm Reflow below seating plane) Profile Average LED Current I LED (DC) 1 ma Repetitive Pulsed LED Current I LED (PK) 5 ma 9 µs Pulse Width, 2% Duty Cycle Peak LED Current I LED (RP) 1. A 2 µs Pulse Width, 1% Duty Cycle LED Anode Voltage V LEDA -.5 7. V LED Cathode Voltage V LEDC -.5 V LEDA V Supply Voltage V CC 7. V Transmitter Data Input Voltage V TXD -.5 5.5 V Receiver Data Output Voltage V RXD -.5 V CC +.5 V 4-36
Infrared Reflow Profile TEMPERATURE C (T) 3 25 2 15 1 5 185 C t2 = 11.5 ±.5 MINS. (SOLDER JOINT) T (MAX.) = 25 C OR 235 C (+5-) C ANY PART OF COMPONENT BODY t1 = 8 ± 1 MINS. (SOLDER JOINT) T > 12 C FOR t GREATER THAN 2.5 MINS. (SOLDER JOINT) 3.5 ±.5 MINS. (SOLDER JOINT) dt/dt < 3 C/SEC. 2 4 6 8 1 12 14 TIME (t) Recommended Operating Conditions Parameter Symbol Min. Max. Units Conditions Operating Temperature T A 7 C Supply Voltage V CC 4.5 5.5 V Logic High Transmitter Input Voltage V IH (TXD) 2.5 5.5 V Logic Low Transmitter Input Voltage V IL (TXD)..3 V Logic High Receiver Input Irradiance EI H.36 5 mw/cm 2 For in-band signals* (87 nm) Logic Low Receiver Input Irradiance EI L.3 µw/cm 2 For in-band signals* LED (Logic High) Current Pulse I LEDA 25 ma For one metre links with Amplitude daylight filters Receiver Set-up Time 1 ms For full sensitivity after transmitting Signal Rate 2.4 116 Kp/s Ambient Light See IrDA Serial Infrared Physical Layer Link Specification, Appendix A for ambient levels. See Rx TH+ section at the end of this data sheet also. *Note: An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 85 nm λp 9 nm, the pulse repetition rate, PRR, is defined as 2.4 Kp/s PRR 115.2 Kp/s and the pulse width, PW, is defined as 1.6 s PW (3/16)/PRR. 4-37
Electrical & Optical Specifications Specifications hold over the Recommended Operating Conditions unless otherwise noted. Test Conditions represent worse case values for the parameters under test. Unspecified test condition can be anywhere in their recommended operating range. All typicals are at 25 C and 5V unless otherwise noted. Parameter Symbol Min. Typ. Max. Unit Conditions Fig. Receiver Data Logic Low [2] V OL (RXD) [2,3].4 V I O =.3 ma Output Voltage For In-Band EI 3.6 µw/cm 2 ; θ 15 Logic High V OH (RXD) V CC -.5 V I O = -2 µa, For In-Band EI.3 µw/cm 2 Effective.2 cm 2 Detector Area Transmitter Logic Low IE L.3 µw/sr V I.3 V Radient Logic High IE H 44 25 mw/sr I LEDA = 25 ma, Intensity Intensity V I = 2.5 V, θ 3 4, 6 4 mw/sr I LEDA = 25 ma, V I = 2.5 V; θ > 6 Peak λp 875 nm 6 Wavelength Spectral Line λ 1 /2 35 nm 6 Half Width Transmitter Viewing Angle θ 3 6 7 Receiver φ 3 Transmitter Logic Low I IL (TXD) -1. 1. µa Gnd V I.3 V Data Input Current Logic High I IH (TXD) 4.5 ma V I = 2.5 V 1 LED Anode On V ON (LEDA) 2.5 V I LEDA = 25 ma, 1, 3 State Voltage T j = 25 C LED Anode Off I LK (LEDA) 1 µa V LEDA = V CC = 5.5 V, State Leakage V I =.3V Supply Current ICC1 1.1 ma V CC = 5.5, 11 TXD High V I (TXD) = V IH, I LED = 25 ma, EI = Supply Current ICC2 13 ma V CC = 5.5, 1 RXD Low [2] V I (TXD) = V IL, EI = 5 mw/cm 2 Receiver Peak λp 88 nm 9 Sensitivity Wavelength Notes: 1. EI received in band light intensity present at detector surface. 2. Pulsed Response Logic Low is a pulsed response. A receiver output low state V OL (RXD) is not indefinitely maintained but is instead a pulsed response. The output low state is maintained for a duration dependent on the incident bit pattern and incident intensity (EI). 3. The EI 3.6 µw/cm 2 condition guarantees the IrDA minimum receiver sensitivity of 4. µw/cm 2 while allowing for 1% light loss through a cosmetic window placed in front of the HSDL-1. (See the Rx TH+ section at the end of this data sheet for information on receiver sensitivity over temperature, and in the presence of ambient light.) 4-38
Switching Specifications Specifications hold over the Recommended Operating Conditions unless otherwise noted. Test Conditions represent worst case values for the parameters under test. Unspecified test conditions can be anywhere in their recommended operating range. All typicals are at 25 C and 5V unless otherwise noted. Parameter Symbol Min. Typ. Max. Units Conditions Fig. Transmitter Turn On Time.1 µs I LED = 25 ma, 1.6 µs PW 13, 14 Transmitter Turn Off Time.4 1. µs Transmitter Rise Time.6 µs Transmitter Fall Time.6 µs Receiver Turn On Time.4 µs EI = 3.6 µw/cm 2, 1.6 µs PW 15, 16 Receiver Turn Off Time 5.4 µs EI = 5 mw/cm 2, 1.6 µs PW Receiver Rise Time 1. µs Receiver Fall Time.2 µs EI = 3.6 µw/cm 2, 1.6 µs PW Receiver Recovery Time 1 ms Application Circuit Component Recommended Value R I 3 Ohms ± 5% R LED 8. Ohms maximum CX1.22 µf ± 1% CX2.4 µf minimum CX3.1 µf ± 22%. Low inductance is critical CX4 4.7 µf minimum. Larger value is recommended for noisy supplies or environments. 4-39
I LEDA LED PULSE CURRENT AMPLITUDE ma 1 5 25 1 5 1 1 2 3 4 V LEDA LEDA VOLTAGE V 5 V LEDA LEDA VOLTAGE V 2.5 2.4 2.3 2.2 2.1 2. I LEDA = 25 ma PULSED 1.6 µs PW, 3/16 DUTY CYCLE 2 4 6 8 1 V F LED FORWARD VOLTAGE V 2.2 2.1 2. 1.9 1.8 I LEDA = 25 ma PULSED 1.6 µs PW, 3/16 DUTY CYCLE 2 4 6 8 1 Figure 1. LED Pulse Current Amplitude vs. LEDA Voltage. Figure 2. LEDA Voltage vs. Temperature. Figure 3. LED Forward Voltage vs. Temperature. NORMALIZED TRANSMITTED INTENSITY IE 2. 1.5 1..5 NORMALIZED TO IE @ I LEDA = 25 ma PULSE WIDTH = 1.6 µs TO 9 µs. 1 2 3 4 5 I LEDA LED PULSE AMPLITUDE ma NORMALIZED TRANSMITTED INTENSITY IE 1.1 1..9.8.7 NORMALIZED TO IE @ I LEDA = 25 ma 2 4 6 8 1 NORMALIZED TRANSMITTED INTENSITY IE 1..8.6.4.2 NORMALIZED TO IE @ I LEDA = 25 ma 8 85 9 λ WAVELENGTH nm 95 Figure 4. Transmitted Intensity vs. LED Pulse Amplitude. Figure 5. Transmitted Intensity vs. Temperature. Figure 6. Transmitted Intensity vs. Wavelength. NORMALIZED TRANSMITTED INTENSITY IE 1..8.6.4.2 NORMALIZED TO IE @ I LEDA = 25 ma -1-5 5 1 θ HORIZONTAL TRANSMITTER VIEWING ANGLE NORMALIZED TRANSMITTED INTENSITY IE 1..8.6.4.2 NORMALIZED TO IE @ ILEDA = 25 ma -1-5 5 1 θ VERTICAL TRANSMITTER VIEWING ANGLE NORMALIZED RECEIVER RESPONSIVITY 1..8.6.4.2 NORMALIZED TO 88 nm 7 8 9 1 11 λ WAVELENGTH nm Figure 7. Transmitted Intensity vs. Horizontal Viewing Angle. Figure 8. Transmitted Intensity vs. Vertical Viewing Angle. Figure 9. Receiver Responsivity vs. Wavelength. 4-4
I NORMALIZED RECEIVER RESPONSIVITY 1..8.6.4.2-1 -5 5 1 ϕ RECEIVER VIEWING ANGLE SUPPLY CURRENT ma CC 1. ILEDA = 25 ma.9 V CC = 5.5 V.8 V CC = 4.5 V.7.6.5 2 4 6 8 1 I TXD TRANSMITTER DATA INPUT CURRENT ma 2 15 1 5 2 4 6 8 V TXD TRANSMITTER DATA INPUT VOLTAGE V Figure 1. Receiver Responsivity vs. Viewing Angle. Figure 11. Supply Current vs. Temperature. Figure 12. Data Input Current vs. Data Input Voltage. PW IE TRANSMITTED PULSE WIDTH µs 2. 1.9 1.8 1.7 INPUT PW = 1.6 µs R LED = 8 Ω R LED = 2 Ω 1.6 2 4 6 8 1 PW(RXD) RECEIVER OUTPUT PULSE WIDTH µs 3. 2.9 2.8 2.7 2.6 INPUT PW = 1.6 µs EI INTENSITY = 1 µw/cm2 EI DUTY CYCLE = 2% 2.5 2 4 6 8 1 PW(RXD) RECEIVER OUTPUT PULSE WIDTH µs 4.5 4. 3.5 3. 2.5 2. EI PULSE WIDTH = 1.6 µs EI INTENSITY = 1 µw/cm2 EI INTENSITY = 3.6 µw/cm2 1.5 5 1 15 2 25 DUTY CYCLE OF LIGHT PULSE EI % Figure 13. Transmitted Pulse Width vs. Temperature. Figure 14. Transmitted Pulse Width vs. Temperature. Figure 15. Receiver Output Pulse Width vs. Duty Cycle of Received Signal. PW(RXD) RECEIVER OUTPUT PULSE WIDTH µs 6 5 4 3 2 EI INTENSITY = 1 µw/cm 2 EI INTENSITY = 3.6 µw/cm 2 2% DUTY CYCLE 5 1 15 2 25 3 PW EI RECEIVED LIGHT PULSE WIDTH µs Figure 16. Receiver Output Pulse Width vs. Received Light Pulse Width. 4-41
Rx TH+ (Receiver On- Threshold) The maximum receiver onthreshold is equivalent to the minimum receiver sensitivity. Both are terms for the amount of light signal which must be present at the HSDL-1 detector in order to trigger a low pulse on the receiver output (RXD). The IrDA Physical Layer Specification requires a minimum receiver sensitivity of 4. µw/cm 2, at a Bit Error Rate of 1-9, and in the presence of the 1 klux of sunlight, -1 lux of fluorescent HSDL-1 Reliability Test Results light, or -1 lux of incandescent light. The fluorescent and incandescent specifications require minimum receiver sensitivity with 1 lux incident onto the horizontal surface of the IR link. The resulting amount of fluorescent or incandescent light actually reaching the detector surface may vary between and 5 lux depending upon the design of the housing around the HSDL-1 module. The HSDL-1 V OL (RXD) specification guarantees a maximum receiver on-threshold of EI = 3.6 µw/cm 2, at a BER 1-9, and T A = -7 C. The EI = 3.6 µw/cm 2 threshold guarantees the IrDA minimum receiver sensitivity of 4. µw/cm 2, while allowing for 1% light loss through a cosmetic window placed in front of the HSDL-1. The EI = 3.6 µw/cm 2 threshold also guarantees receiver sensitivity with 1 klux of sunlight, -5 lux fluorescent light, or -5 lux of incandescent light incident on the HSDL-1 detector surface. MIL-STD-883 Units Total Test Name Reference Test Conditions Tested Failed Solder Heat (IR Profile) See absolute profile 6 Solder Heat Resistance 3 times thru IR Profile + 2 Temp. Cycles 6 Solder Rework Cycle Solder iron tip temp. 37 C/7 F 17 Time per lead 1 second # of rework cycles = 4 Temperature Cycle 11-4 C to +1 C, Dwell = 15 Minutes Transfer = 5 Minutes 2 Cycles 12 1 Cycles 12 Power Temp. Cycle -4 C/+1 C, Dwell = 15 minutes, 6 Transfer = 5 Minutes, V CC = 5 Vdc, If = 1 madc, LED On/Off = 1 Second Total Cycles = 35 Mechanical Shock 22 2 Blows each X1, X2, Y1, Y2, Z1, Z2 1 Condition B 15 G s,.5 msec Pulse Vibration Variable 27 (4) 4 Minute Cycles, X, Y, Z 1 Frequency Condition A at 5 G s Min., 2 to 2, Hz Resistance to Solvents 215 3 one minute immersion 2 Brush after solvent High Temp. Operating T A = 7 C, If = 1 madc, V CC = 5 Vdc, 6 Life Time = 5 hours Low Temp. Opearting Life T A = C, If = 1 madc, V CC = 5 Vdc 6 Time = 5 hours Wet Operating Life T A = 35 C, R.H., = 85% If = 1 madc 6 V CC = 5 V CC, Time = 5 hours ESD - Human Body Model 315 RI = 15 Ohms, C = 1 µf 1 Level = 4 V ESD - Machine Model EIAJ Rload = Ohms, C = 2 µf 1 Level = 3 V Note: At the time of this publication, Light Emitting Diodes (LEDs) that are contained in this product are regulated for eye safety in Europe by the Commission for European Electrotechnical Standardization (CENELEC) EN6825-1. Please refer to Application Briefs I-8, I-9, I-15 for more information. 4-42
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