Di/dt Mitigation Method in Power Delivery Design & Analysis

Similar documents
Chip Package - PC Board Co-Design: Applying a Chip Power Model in System Power Integrity Analysis

CIRCUITS. Raj Nair Donald Bennett PRENTICE HALL

Vishram S. Pandit, Intel Corporation (916) ]

Engineering the Power Delivery Network

SUBSTRATE NOISE FULL-CHIP LEVEL ANALYSIS FLOW FROM EARLY DESIGN STAGES TILL TAPEOUT. Hagay Guterman, CSR Jerome Toublanc, Ansys

Wideband On-die Power Supply Decoupling in High Performance DRAM

Simulation and Measurement of an On-Die Power-Gated Power Delivery System

Broadband Methodology for Power Distribution System Analysis of Chip, Package and Board for High Speed IO Design

SSO Noise, Eye Margin, and Jitter Characterization for I/O Power Integrity

Myoung Joon Choi, Vishram S. Pandit Intel Corp.

Target Impedance and Rogue Waves

ΕΠΛ 605: Προχωρημένη Αρχιτεκτονική

Relationship Between Signal Integrity and EMC

PDS Impact for DDR Low Cost Design

Effect of Aging on Power Integrity of Digital Integrated Circuits

Thank you for downloading one of our ANSYS whitepapers we hope you enjoy it.

Analysis and Reduction of On-Chip Inductance Effects in Power Supply Grids

A Switched Decoupling Capacitor Circuit for On-Chip Supply Resonance Damping

Basic Concepts C HAPTER 1

Microcontroller Systems. ELET 3232 Topic 13: Load Analysis

UNIT-III POWER ESTIMATION AND ANALYSIS

MEMS Timing Technology: Shattering the Constraints of Quartz Timing to Improve Smartphones and Mobile Devices

Digital Systems Power, Speed and Packages II CMPE 650

An Initial Case Study for BIRD95: Enhancing IBIS for SSO Power Integrity Simulation

This chapter discusses the design issues related to the CDR architectures. The

Debouncing Switches. The non-ideal behavior of the contacts that creates multiple electrical transitions for a single user input.

Active and Passive Techniques for Noise Sensitive Circuits in Integrated Voltage Regulator based Microprocessor Power Delivery

DesignCon On-Chip Power Supply Noise and Reliability Analysis for Multi-Gigabit I/O Interfaces

A Survey of the Low Power Design Techniques at the Circuit Level

A 4 µa-quiescent-current Dual- Mode Digitally-Controlled Buck Converter IC for Cellular Phone Applications

Dynamic Threshold for Advanced CMOS Logic

Low power SERDES transceiver for supply-induced jitter sensitivity methodology analysis

Design of the Power Delivery System for Next Generation Gigahertz Packages

ASICs Concept to Product

How to Design an R g Resistor for a Vishay Trench PT IGBT

Using IBIS Models for Timing Analysis

AN EFFICIENT APPROACH TO MINIMIZE POWER AND AREA IN CARRY SELECT ADDER USING BINARY TO EXCESS ONE CONVERTER

High and Low Speed Output Buffer Design with Reduced Switching Noise for USB Applications

CAPLESS REGULATORS DEALING WITH LOAD TRANSIENT

RTH GHz Bandwidth High Linearity Track-and-Hold REV-DATE PA FILE DS_0162PA2-3215

Low Power Design Methods: Design Flows and Kits

SSTVN bit 1:2 SSTL_2 registered buffer for DDR

SSTV V 13-bit to 26-bit SSTL_2 registered buffer for stacked DDR DIMM

An Active Decoupling Capacitance Circuit for Inductive Noise Suppression in Power Supply Networks

Supplementary Figures

Geared Oscillator Project Final Design Review. Nick Edwards Richard Wright

Transient Load Tester for Time Domain PDN Analysis. Ethan Koether (Oracle) Istvan Novak (Oracle)

Foundry WLSI Technology for Power Management System Integration

Performance Improvement by System Aware Substrate Noise Analysis for Mixed-signal IC

High Speed Design Issues and Jitter Estimation Techniques. Jai Narayan Tripathi

04/29/03 EE371 Power Delivery D. Ayers 1. VLSI Power Delivery. David Ayers

On Chip Active Decoupling Capacitors for Supply Noise Reduction for Power Gating and Dynamic Dual Vdd Circuits in Digital VLSI

Hello, and welcome to the Texas Instruments Precision overview of AC specifications for Precision DACs. In this presentation we will briefly cover

SY55859L. General Description. Features. Applications. 3.3V, 3.2Gbps Dual 2X2 Crosspoint Switch

USE GAL DEVICES FOR NEW DESIGNS

MDLL & Slave Delay Line performance analysis using novel delay modeling

Chapter 10: Compensation of Power Transmission Systems

How to Design a PDN for Worst Case?

3D IC-Package-Board Co-analysis using 3D EM Simulation for Mobile Applications

High Speed Digital Systems Require Advanced Probing Techniques for Logic Analyzer Debug

PART MAX2265 MAX2266 TOP VIEW. TDMA AT +30dBm. Maxim Integrated Products 1

Module 1. Power Semiconductor Devices. Version 2 EE IIT, Kharagpur 1

Dual-Rate Fibre Channel Repeaters

Power Supply Networks: Analysis and Synthesis. What is Power Supply Noise?

Research in Support of the Die / Package Interface

5. CMOS Gates: DC and Transient Behavior

PI5C3253. Dual 4:1 Mux/DeMux Bus Switch

MEMS Oscillators: Enabling Smaller, Lower Power IoT & Wearables

Microcircuit Electrical Issues

Power Distribution Network Design for Stratix IV GX and Arria II GX FPGAs

Low Power, Area Efficient FinFET Circuit Design

Rohde & Schwarz EMI/EMC debugging with modern oscilloscope. Ing. Leonardo Nanetti Rohde&Schwarz

Compensation for Simultaneous Switching Noise in VLSI Packaging Brock J. LaMeres University of Colorado September 15, 2005

A 2.4 GHZ RECEIVER IN SILICON-ON-SAPPHIRE MICHAEL PETERS. B.S., Kansas State University, 2009 A REPORT

Low Cost, Dual, High Current Output Line Driver with Shutdown ADA4311-1

SAMPLE/HOLD AMPLIFIER

QUICKSWITCH BASICS AND APPLICATIONS

An Analog Phase-Locked Loop

SURVEY AND EVALUATION OF LOW-POWER FULL-ADDER CELLS

BCD Smart Power Roadmap Trends and Challenges. Giuseppe Croce NEREID WORKSHOP Smart Energy Bertinoro, October 20 th

Digital Controller Chip Set for Isolated DC Power Supplies

Module -18 Flip flops

System Power Distribution Network Theory and Performance with Various Noise Current Stimuli Including Impacts on Chip Level Timing

Converter IC for Cellular Phone. Mode Digitally-Controlled Buck. A 4 µa-quiescent-current Dual- Applications. Jianhui Zhang Prof.

Low Power Design for Systems on a Chip. Tutorial Outline

An Efficent Real Time Analysis of Carry Select Adder

Timing analysis can be done right after synthesis. But it can only be accurately done when layout is available

MEMS Ultra-Low Power Oscillator, khz Quartz XTAL Replacement

The challenges of low power design Karen Yorav

Sensing Voltage Transients Using Built-in Voltage Sensor

Layout-Aware Pattern Generation for Maximizing Supply Noise Effects on Critical Paths

12-bit 140 MSPS IQ DAC

Voltage Transient Detection and Induction for Debug and Test

Power-Delivery Network in 3D ICs: Monolithic 3D vs. Skybridge 3D CMOS

Lecture 16: Design for Testability. MAH, AEN EE271 Lecture 16 1

UMAINE ECE Morse Code ROM and Transmitter at ISM Band Frequency

SPT BIT, 100 MWPS TTL D/A CONVERTER

Reliable World Class Insights Your Silicon Valley Partner in Simulation ANSYS Sales, Consulting, Training & Support

LSI Design Flow Development for Advanced Technology

Reduce Load Capacitance in Noise-Sensitive, High-Transient Applications, through Implementation of Active Filtering

Transcription:

Di/dt Mitigation Method in Power Delivery Design & Analysis Delino Julius Thao Pham Fattouh Farag DAC 2009, San Francisco July 27, 2009

Outlines Introduction Background di/dt Mitigation Modeling di/dt Mitigation Simulation Results Bench Measurements Conclusion 2

Abbreviations DVD Dynamic Voltage Drop EA Early Analysis Cdie, Rdie Effective pad to- pad die Cap & Res Icc(t) Equivalent Dynamic Die Current PD Power Delivery PDN Power Delivery Network PI Power Integrity VCD Value-Change-Dump (Vector-based) VLS Vectorless WC Worst Case 3

Introduction Extended On-Die VLS PI analysis for PD di/dt mitigation Developed Extended On-Die dynamic VLS PI simulation flow to enable PD analysis to mitigate di/dt issues Using Early Analysis method, enables the PD designers to influence architectural or micro-architectural direction/choices to improve system-level robustness and performance On-die noise can impact system-level voltage margin Mitigation concepts and techniques for di/dt can reduce ondie noise Result: improved system-level voltage margins 4

Background: Problem Statement Worst-case (WC) power delivery (PD) noise is not necessarily the result of high-power ops. High-power ops (i.e.., virus-like behavior) results in high % of cell activity for long duration of time WC power delivery noise results from events that occur on the time-scale of Power Delivery Network (PDN) resonance Examples: SCAN, power management (gating), performance or operating mode changes (hi<->low or change frequency of operation) Influencing architectural or micro-architectural design choices requires tools that architects find credible and flexible to use (represent arch performance at the proper level of abstraction with the what-if analysis capabilities) 5

Design info. Background: Stages for PD-EA --- Concept/VLS to design/vcd Engineering estimates of model Extracted models from layout VLS database available VCD vectors available We have implemented PD-EA Power Delivery Early Analysis, a way to use tools intended primarily for post-layout at early stages in the design cycle while limited design collaterals available Specific di/dt vectors are generally not available for PD designers until later stage of the design cycle Design collaterals and specific vectors (VCD) may not be compatible at early stages of the design. VLS based analysis can be made to closely represent the global conditions for the VCD-based when given the proper system level parameters (e.g. power, clocking schemes and refined partition level -floorplan- distribution) Time 6

di/dt Mitigation concept Sharp di/dt is a risk event associated with fast current transients. di/dt mitigation is a design concept to reduce the sharpness and the impact of those fast current transients Causes and ways to mitigate di/dt issue Clock gating & ungating Power gating & ungating Staggering logic activities So, di/dt mitigation is modifying the events and sequences, to lower the di/dt thus reducing the DVD (dynamic voltage drop) Di/dt mitigation concept Original Power event without di/dt mitigation enabled With di/dt mitigation 7

Modeling di/dt Mitigation method Extension of dynamic vectorless, allow the users to specify different power at different stages Default VLS assumes a constant power for clock-clock power analysis Enhanced VLS approach enable scaling power per time region to implement di/dt mitigation concepts at the PDN time scale. Beside the on-die clock-clock operation, the focus is on the Power Delivery larger time scale events (e.g. micro seconds scale for low and mid-frequency operations) Simple input text (or TCL) format allows the users to control: initial, final power and transition time Simple text file input to specify the power profile Clock cycle Power (W) 1 0.4 11 0.5 12 0.7 13 0.8 25 0.6 30 0.4 31 0.25 41 25 Icc(t) or Power with default VLS with constant power Icc(t)/Power with di/dt mitigation feature enabled 8

Usage Flow Layout, Libraries, Package/Board models Power / activity target #1 Power / activity target #2 Power / activity target #n Duration of Duration of Duration of mode mode mode Combined scenario Total duration ~ sum of all mode durations Time domain, multi-cycle analysis 9

Simulation Results This is an example of a large clock-clock di/dt (when pico-second time scale current variation is large compared to the nano-second current variation) applied di/dt mitigation method BEFORE: default vectorless Icc(t) with constant average power which can not reflect w/c DVD condition for some power management schemes BEFORE: DVD of the typical package and board PDN when excited by default vectorless Icc(t) AFTER: Icc(t) in the enhanced dynamic vectorless mode to present an example of power management scheme AFTER: DVD in the enhanced dynamic vectorless Icc(t) to reflect power management schemes Top) Supply current Icc(t) in default VLS mode with constant average power not reflecting w/c DVD Dynamic voltage droop (DVD) of the typical package and board PDN when (Bottom) Supply current Icc(t) in Dynamic VLS enhanced 10 07.27.2009 Di-Dt Mitigation Method in Power Delivery Design & excited Analysis by large time-scale current variation Icc(t) mode with power variation in larger time scale in certain power management scheme (Top) DVD stimulated by Icc(t) in default VLS mode with constant average power (peak to peak DVD is 48mV) which does not reflect the w/c DVD (Bottom) with di/dt mitigation mode, DVD shows significant larger noise

Simulation Results This is an example of small clock-clock scale di/dt (when pico-second time scale current variation is small compared to the nano-second current variation) while applying di/dt mitigation BEFORE: default vectorless Icc(t) with constant average power which can not reflect w/c DVD condition for some power management schemes BEFORE: DVD of the typical package and board PDN when excited by default vectorless Icc(t) AFTER: Icc(t) in the enhanced dynamic vectorless mode to present an example of power management scheme AFTER: DVD in the enhanced dynami vectorless Icc(t) to reflect power management schemes Enhance VSL mode to control power magnitude and slew rates in power management scenarios Worst case DVD in enhanced VSL reflecting different slew rate, power magnitudes 11

Simulation Results This is an example of a di/dt mitigation Large scale clock-clock di/dt Di/dt mitigation feature enables the analysis of different Power Architecture changes. Different Power Architecture modes would provide different power transitions resulting in different dynamic voltage drop impacts Dynamic voltage droop impact due to different Power Architecture changes. Dynamic VLS enables the analysis of the DVD impacts of such Power Architecture changes. 12

Bench Measurements of di/dt mitigation On-die measurements shows the impact of di/dt mitigation enabled design (significant reduction of on-die P-P noise) di/dt mitigation DISABLED on-die noise 349.4 mvpp di/dt mitigation ENABLED on-die noise 201.1 mvpp Silicon measurements show that di/dt mitigation improves the dynamic voltage droop significantly 13

Bench measurement of di/dt mitigation --2 On-die measurement with di/dt mitigation DISABLED (Zoom-in) Zoom-in view of dynamic voltage drop without di/dt mitigation 9.8ns 9.8ns 284.4mVpp 258.0mVpp 933MHz Dynamic voltage 1 st droop follows PDN resonant frequency of ~ 100Mhz (9.8nS) 33.5ns Similarly, dynamic voltage 1 st bounce follows PDN resonant frequency of ~ 100Mhz (9.8nS) 14

Bench measurement data of di/dt mitigation On-die measurement with di/dt mitigation ENABLED (Zoom-in) Zoom-in view of dynamic voltage drop with di/dt mitigation impact 933MHz 201mVpp 15 di/dt mitigation reduces the dynamic voltage 1 st droop/bounce.

Conclusion In enabling a power delivery design & analysis flow from pre-layout to post-layout, we found a need for a full-chip simulation that would have sufficient credibility to enable architectural what-if analysis and changes. In pre-layout phase, we use Vectorless PI-EA (Power Integrity Early Analysis). In post-layout phase, we use vector-driven VCD-based dynamic simulations. Between these two phases, dynamic vectorless is applied and we have enhanced this dynamic vectorless to simulate di/dt mitigation to meet the PDN needs. di/dt mitigation can effectively reduce on-die noise caused, for example, by clock gating, power gating and abrupt changes in activity. In future work we intend to combine this capability with timing or frequency impact so that accurate cost-benefit analysis can be associated with proposed architectural changes. 16