SN75150 DUAL LINE DRIVER

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SN75150 DUAL LINE DRIVER Meets or Exceeds the Requirement of TIA/EIA-232-F and ITU Recommendation V.28 Withstands Sustained Output Short Circuit to Any Low-Impedance Voltage Between 25 V and 25 V 2-µs Maximum Transition Time Through the 3-V to 3-V Transition Region Under Full 2500-pF Load Inputs Compatible With Most TTL Families Common Strobe Input Inverting Output Slew Rate Can Be Controlled With an External Capacitor at the Output Standard Supply Voltages... ±12 V SLLS081C JANUARY 1971 REVISED JUNE 1999 S 1A 2A GND D OR P PACKAGE (TOP VIEW) 1 2 3 4 8 7 6 5 V CC+ 1Y 2Y V CC description The SN75150 is a monolithic dual line driver designed to satisfy the requirements of the standard interface between data-terminal equipment and data-communication equipment as defined by TIA/EIA-232-F. A rate of 20 kbits/s can be transmitted with a full 2500-pF load. Other applications are in data-transmission systems using relatively short single lines, in level translators, and for driving MOS devices. The logic input is compatible with most TTL families. Operation is from 12-V and 12-V power supplies. The SN75150 is characterized for operation from 0 C to 70 C. logic symbol logic diagram (positive logic) S 1A 1 2 EN 7 1Y S 1A 1 2 Î ÎÎ 7 1Y 2A 3 6 2Y 2A 3 ÎÎ 6 2Y This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 1999, Texas Instruments Incorporated POST OFFICE BOX 655303 DALLAS, TEXAS 75265 1

SN75150 DUAL LINE DRIVER SLLS081C JANUARY 1971 REVISED JUNE 1999 schematic (each line driver) VCC + Input A To Other Line Driver 11 kω 15 kω 10 kω 15 kω 5 kω Strobe S To Other Line Driver 7 kω 47 Ω 15 kω Output Y 4.5 kω GND To Other Line Driver 5 kω 10 kω 1 kω 47 Ω To Other Line Driver VCC Resistor values shown are nominal. 2 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

SN75150 DUAL LINE DRIVER SLLS081C JANUARY 1971 REVISED JUNE 1999 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, V CC+ (see Note 1)........................................................... 15 V Supply voltage, V CC..................................................................... 15 V Input voltage, V I........................................................................... 15 V Applied output voltage..................................................................... ± 25 V Package thermal impedance, θ JA (see Notes 2 and 3): D package........................... 197 C/W P package............................ 104 C/W Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds............................... 260 C Storage temperature range, T stg................................................... 65 C to 150 C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. Voltage values are with respect to network ground terminal. 2. Maximum power dissipation is a function of TJ(max), θ JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) TA)/θ JA. Operating at the absolute maximum TJ of 150 C can impact reliability. 3. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace length of zero. recommended operating conditions Supply voltage MIN NOM MAX UNIT VCC+ 10.8 12 13.2 V VCC 10.8 12 13.2 High-level input voltage, VIH 2 5.5 V Low-level input voltage, VIL 0 0.8 V Driver output voltage, VO ±15 V Operating free-air temperature, TA 0 70 C POST OFFICE BOX 655303 DALLAS, TEXAS 75265 3

SN75150 DUAL LINE DRIVER SLLS081C JANUARY 1971 REVISED JUNE 1999 electrical characteristics over recommended operating free-air temperature range, V CC± = ±13.2 V (unless otherwise noted) VOH High-level output voltage PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOL Low-level output voltage (see Note 4) IIH IIL IOS High-level input current Low-level input current Short-circuit output current Data input Strobe input Data input Strobe input VCC + = 10.8 V, VIL = 0.8 V, VCC + = 10.8 V, VIH = 2 V, VI =24V 2.4 VI =04V 0.4 VCC = 10.8 V, RL = 3 kω to 7 kω VCC = 10.8 V, RL = 3 kω to 7 kω 5 8 V 8 5 V 1 10 2 20 1 1.6 2 3.2 VO = 25 V 2 8 VO = 25 V 3 8 VO = 0, VI = 3 V 10 15 30 VO = 0, VI = 0 10 15 30 ICCH+ Supply current from VCC+, high-level output VI I = 0, RL L = 3 kω, 10 22 ma ICCH Supply current from VCC, high-level output TA = 25 C 1 10 ma ICCL+ Supply current from VCC+, low-level output VI I = 3 V, RL L = 3 kω, 8 17 ma ICCL Supply current from VCC, low-level output TA = 25 C 9 20 ma All typical values are at VCC + = 12 V, VCC = 12 V, TA = 25 C. Not more than one output should be shorted at a time. NOTE 4: The algebraic convention, in which the less positive (more negative) limit is designated as minimum, is used in this data sheet for logic levels only, e.g., when 5 V is the maximum, the typical value is a more negative voltage. switching characteristics, V CC+ = 12 V, V CC = 12 V, T A = 25 C (see Figure 1) µa ma ma ttlh tthl ttlh tthl tplh tphl PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Transition time, low-to-high-level output 0.2 1.4 2 µs CL = 2500 pf, RL =3kΩto 7kΩ Transition time, high-to-low-level output 0.2 1.5 2 µs Transition time, low-to-high-level output 40 ns CL =15 pf, RL =7kΩ Transition time, high-to-low-level output 20 ns Propagation delay time, low-to-high-level output 60 ns CL =15 pf, RL =7kΩ Propagation delay time, high-to-low-level output 45 ns 4 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

SN75150 DUAL LINE DRIVER PARAMETER MEASUREMENT INFORMATION 3 V VCC + VCC SLLS081C JANUARY 1971 REVISED JUNE 1999 Pulse Generator (see Note A) RL Output CL (see Note B) TEST CIRCUIT 10 ns 10 ns Input 10% 90% 50% tphl 50 µs 90% 50% 10% tplh 3 V 0 V Output 3 V tthl 3 V 3 V ttlh 3 V VOH VOL NOTES: A. The pulse generator has the following characteristics: duty cycle 50%, ZO 50 Ω. B. CL includes probe and jig capacitance. Figure 1. Test Circuit and Voltage Waveforms POST OFFICE BOX 655303 DALLAS, TEXAS 75265 5

SN75150 DUAL LINE DRIVER SLLS081C JANUARY 1971 REVISED JUNE 1999 TYPICAL CHARACTERISTICS OUTPUT CURRENT vs APPLIED OUTPUT VOLTAGE 20 15 VCC + = 12 V VCC = 12 V TA = 25 C VI = 2.4 V I IO O Output Current ma 10 5 0 5 10 RL = 7 kω RL = 3 kω 15 20 25 VI = 0.4 V 20 15 10 5 0 5 10 15 20 VO Applied Output Voltage V Figure 2 25 6 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan SN75150D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) SN75150DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) SN75150DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN75150DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN75150P ACTIVE PDIP P 8 50 Pb-Free (RoHS) (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp ( C) Device Marking (4/5) CU NIPDAU Level-1-260C-UNLIM 0 to 70 75150 CU NIPDAU Level-1-260C-UNLIM 0 to 70 75150 CU NIPDAU Level-1-260C-UNLIM 0 to 70 75150 CU NIPDAU Level-1-260C-UNLIM 0 to 70 75150 CU NIPDAU N / A for Pkg Type 0 to 70 SN75150P Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant SN75150DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN75150DR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2

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