Surface Mount Trench MOS Barrier Schottky Rectifier TMBS SMPA TM Top View Bottom View DO-22BC (SMPA) FEATURES Very low profile - typical height of 0.95 mm Ideal for automated placement Trench MOS Schottky technology Low power losses, high efficiency Low forward voltage drop Meets MSL level, per J-STD-020, LF maximum peak of 260 C AEC-Q qualified available - Automotive ordering code; base P/NHM3 Material categorization: for definitions of compliance please see www.vishay.com/doc?9992 PRIMARY CHARACTERISTICS I F(AV) 3.0 A V RRM 45 V I FSM 80 A V F at I F = 3.0 A (T A = 25 C) 0.37 V T J max. 50 C Package DO-22BC (SMPA) Diode variation Single die TYPICAL APPLICATIONS For use in low voltage, high frequency inverters, freewheeling, DC/DC converters, and polarity protection applications. MECHANICAL DATA Case: DO-22BC (SMPA) Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant, and commercial grade Base P/NHM3 - halogen-free, RoHS-compliant, and AEC-Q qualified Base P/NHM3_X - halogen-free, RoHS-compliant, and AEC-Q qualified ( _X denotes revision code e.g. A, B,...) Terminals: matte tin plated leads, solderable per J-STD-002 and JESD22-B2 M3 suffix meets JESD 20 class 2 whisker test, HM3 suffix meets JESD 20 class 2 whisker test Polarity: color band denotes cathode end MAXIMUM RATINGS ( unless otherwise noted) PARAMETER SYMBOL UNIT Device marking code 3L45 Maximum repetitive peak reverse voltage V RRM 45 V Maximum DC forward current I () F 3.0 A Peak forward surge current ms single half sine-wave superimposed on rated load I FSM 80 A Operating junction and storage temperature range T J, T STG -40 to +50 C () Free air, mounted on recommended copper pad area Revision: 20-Oct-6 Document Number: 87906 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?900
ELECTRICAL CHARACTERISTICS ( unless otherwise noted) PARAMETER TEST CONDITIONS SYMBOL TYP. MAX. UNIT I F =.5 A 0.4 - I F = 3.0 A Instantaneous forward voltage V () 0.46 0.54 F V I F =.5 A 0.30 - T A = 25 C I F = 3.0 A 0.37 0.46 Reverse current V R = 45 V I (2) - 450 μa R T A = 25 C 5 5 ma Typical junction capacitance 4.0 V, MHz C J 450 - pf s () Pulse test: 300 μs pulse width, % duty cycle (2) Pulse test: pulse width 5 ms THERMAL CHARACTERISTICS ( unless otherwise specified) PARAMETER SYMBOL UNIT Typical thermal resistance R JA () 0 R JM () 9 () Free air, mounted on recommended PCB, 2 oz. pad area; thermal resistance R JA - junction to ambient; R JM - junction to mount C/W ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE -M3/I 0.032 I 4 000 3" diameter plastic tape and reel HM3/I () 0.032 I 4 000 3" diameter plastic tape and reel HM3_A/I () 0.032 I 4 000 3" diameter plastic tape and reel () AEC-Q qualified RATINGS AND CHARACTERISTICS CURVES ( unless otherwise noted) Average Forward Rectified Current (A) 3.2 2.8 2.4 2.6.2 0.8 R thja = 0 C/W T M = 38 C, R thjm = 9 C/W 0.4 T M measured at cathode band terminal PCB mount 0 0 25 50 75 0 25 50 Mount Temperature ( C) Average Power Loss (W).6 D = 0.8.4 D = 0.5 D = 0.3.2 D = 0.2 D =.0 D = 0. 0.8 0.6 T 0.4 0.2 D = t p /T t p 0 0 0.4 0.8.2.6 2 2.4 2.8 3.2 3.6 Average Forward Current (A) Fig. - Maximum Forward Current Derating Curve Fig. 2 - Forward Power Loss Characteristics Revision: 20-Oct-6 2 Document Number: 87906 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?900
Instantaneous Forward Current (A) 50 T A = 50 C T A = 25 C T A = 0 0. 0 0. 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 Instantaneous Forward Voltage (V) Fig. 3 - Typical Instantaneous Forward Characteristics Transient Thermal Impedance ( C/W) 00 Junction to Ambient 0 0.0 0. 0 t - Pulse Duration (s) Fig. 6 - Typical Transient Thermal Impedance Instantaneous Reverse Current (ma) 0 T A = 50 C T A = 25 C T A = 0 C 0. 0.0 0.00 20 30 40 50 60 70 80 90 0 Percent of Rated Peak Reverse Voltage (%) Thermal Resistance ( C/W) 0 90 80 70 60 50 40 30 20 Epoxy printed circiut board FR4 copper thickness = 70 μm 0 2 3 4 5 6 7 8 9 Copper Pad Areas (cm 2 ) S (cm 2 ) Fig. 4 - Typical Reverse Leakage Characteristics Fig. 7 - Thermal Resistance Junction to Ambient vs. Copper Pad Areas Junction Capacitance (pf) 00 0 T J = 25 C f =.0 MHz V sig = 50 mv p-p 0. 0 Reverse Voltage (V) Fig. 5 - Typical Junction Capacitance Revision: 20-Oct-6 3 Document Number: 87906 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?900
PACKAGE OUTLINE DIMENSIONS in inches (millimeters) DO-22BC (SMPA) Cathode Band 0.22 (3.) 0.098 (2.50) 0.059 (.50) 0.030 (0.75) 0.6 (2.70) 0.098 (2.50) 0.057 (.45) 0.049 (.25) 0.087 (2.20) 0.063 (.6) 0.7 (4.35) 0.63 (4.5) 0.2 (5.35) 0.99 (5.05) 0.059 (.50) 0.030 (0.75) Typ.: 0.09 (0.48) Mounting Pad Layout MAX. 0.037 (0.92) 0.039 (.00) 0.035 (0.90) 0.02 (0.30) 0.006 (0.5) 0.087 (2.20) 0.060 (.52) 0.22 (3.) 0.059 (.50) 0.27 (5.52) Revision: 20-Oct-6 4 Document Number: 87906 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?900
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