Order this document by MC/D The MC is a monolithic quad line driver designed to interface data terminal equipment with data communications equipment in conformance with the specifications of EIA Standard No. EIAD. Features: Current Limited Output ± typical PowerOff Source Impedance Ω mininum Simple Slew Rate Control with External Capacitor Flexible Operating Supply Range Compatible with All Motorola and MTTL Logic Families Device MCP MCD ORDERING INFORMATION Operating Temperature Range TA =to+ C Package Plastic SO QUAD LINE DRIVER EIAD SEMICONDUCTOR TECHNICAL DATA P SUFFIX PLASTIC PACKAGE CASE D SUFFIX PLASTIC PACKAGE CASE A (SO) PIN CONNECTIONS Simplified Application V EE V CC Line Driver MC Interconnecting Cable Line Receiver MC A Output A D D B Output D B C Logic Interconnecting Cable Logic Output Output B Gnd C Output C Circuit Schematic (/ of Circuit Shown) V CC Pins,, or. k. k Pins,, Output Pins,, or. k GND k. k V EE MOTOROLA ANALOG IC DEVICE DATA Motorola, Inc. Rev
MC MAXIMUM RATINGS (TA = + C, unless otherwise noted.) Rating Symbol Value Unit Power Supply Voltage VCC + Vdc VEE Voltage Range VIR VIR. Output Signal Voltage VO ± Vdc Power Derating (Package Limitation, SO and Plastic DualInLine Package) Derate above TA = + C PD /RθJA. Vdc mw mw/ C Operating Ambient Temperature Range TA to + C Storage Temperature Range Tstg to + C ELECTRICAL CHARACTERISTICS (VCC = +. ± % Vdc, VEE =. ± % Vdc, TA = to C, unless otherwise noted.) Characteristic Symbol Min Typ Max Unit Current Low Logic State (VIL = ) IIL.. Current High Logic State (VIH =. V) IIH µa Output Voltage High Logic State (VIL =. Vdc, RL =. kω, VCC = +. Vdc, VEE =. Vdc) (VIL =. Vdc, RL =. kω, VCC = +. Vdc, VEE =. Vdc) Output Voltage Low Logic State (VIH =. Vdc, RL =. kω, VCC = +. Vdc, VEE =. Vdc) (VIH =. Vdc, RL =. kω, VCC = +. Vdc, VEE =. Vdc) VOH VOL +. +... +. +... Positive Output ShortCircuit Current, Note IOS+ +. + + Negative Output ShortCircuit Current, Note IOS. Output Resistance (VCC = VEE =, VO = ±. V) ro Ohms Positive Supply Current (RI = ) (VIH =. Vdc, VCC = +. Vdc) (VIL =. Vdc, VCC = +. Vdc) (VIH =. Vdc, VCC = + Vdc) (VIL =. Vdc, VCC = + Vdc) (VIH =. Vdc, VCC = + Vdc) (VIL =. Vdc, VCC = + Vdc) Negative Supply Current (RL = ) (VIH =. Vdc, VEE =. Vdc) (VIL =. Vdc, VEE =. Vdc) (VIH =. Vdc, VEE = Vdc) (VIL =. Vdc, VEE = Vdc) (VIH =. Vdc, VEE = Vdc) (VIL =. Vdc, VEE = Vdc) Power Consumption (VCC =. Vdc, VEE =. Vdc) (VCC = Vdc, VEE = Vdc) SWITCHING CHARACTERISTICS (VCC = +. ± % Vdc, VEE =. ± % Vdc, TA = + C.) Propagation Delay Time (zi =. k and pf) tplh ns ICC IEE + +. + +. + +. + +. + +. Fall Time (zi =. k and pf) tthl ns Propagation Delay Time (zi =. k and pf) tphl ns Rise Time (zi =. k and pf) ttlh ns NOTE:. Maximum Package Power Dissipation may be exceeded if all outputs are shorted simultaneously. PC Vdc Vdc µa µa mw MOTOROLA ANALOG IC DEVICE DATA
MC CHARACTERISTIC DEFINITIONS Figure. Current Figure. Output Voltage. V. V. V. V. V V OL. k V OH. V V OH V OL I IL I IH. V Figure. Output ShortCircuit Current Figure. Output Resistance (Power Off) V CC V EE I OS + I OS. V I OS ± V O ±. Vdc ±. Max. V Figure. Power Supply Currents Figure. Switching Response V CC e in V O. V I CC. k pf V IH V IL e in V O. V. V t PHL t PLH V. V I EE t THL % t TLH t THL and t TLH Measured % to % V EE MOTOROLA ANALOG IC DEVICE DATA
MC TYPICAL CHARACTERISTICS (TA = + C, unless otherwise noted.) V O, OUTPUT VOLTAGE (V)...... VI Figure. Transfer Characteristics versus Power Supply Voltage. k VO...... VCC = VEE = ± V VCC = VEE = ±. V VCC = VEE = ±. V.... I SC, SHORT CIRCUIT OUTPUT CURRENT ()...... Figure. Short Circuit Output Current versus Temperature. V VCC =. V VI. V VEE =. V IOS + IOS Vin, INPUT VOLTAGE (V) T, TEMPERATURE ( C) SLEW RATE (V/ µ s) VI Figure. Output Slew Rate versus Load Capacitance CL VO..,, CL, CAPACITANCE (pf) I O, OUTPUT CURRENT ().. Figure. Output Voltage and CurrentLimiting Characteristics. kω LOAD LINE.. V. VI IOS +. V VCC = VEE = ±. V VO.... VO, OUTPUT VOLTAGE (V) V CC, V EE, POWER SUPPLY VOLTAGE (V).... Figure. Maximum Operating Temperature versus Power Supply Voltage VCC. k. k. k. k VEE T, TEMPERATURE ( C) MOTOROLA ANALOG IC DEVICE DATA
MC APPLICATIONS INFORMATION The Electronic Industries Association EIAD specification details the requirements for the interface between data processing equipment and data communications equipment. This standard specifies not only the number and type of interface leads, but also the voltage levels to be used. The MC quad driver and its companion circuit, the MC quad receiver, provide a complete interface system between DTL or TTL logic levels and the EIAD defined levels. The EIAD requirements as applied to drivers are discussed herein. The required driver voltages are defined as between. and V in magnitude and are positive for a Logic and negative for a Logic. These voltages are so defined when the drivers are terminated with a to Ω resistor. The MC meets this voltage requirement by converting a DTL/TTL logic level into EIAD levels with one stage of inversion. The EIAD specification further requires that during transitions, the driver output slew rate must not exceed V per microsecond. The inherent slew rate of the MC is much too fast for this requirement. The current limited output of the device can be used to control this slew rate by connecting a capacitor to each driver output. The required capacitor can be easily determined by using the relationship C = IOS x T/ V from which Figure is derived. Accordingly, a pf capacitor on each output will guarantee a worst case slew rate of V per microsecond. should be placed in each power supply lead to prevent overheating in this fault condition. These two diodes, as shown in Figure, could be used to decouple all the driver packages in a system. (These same diodes will allow the MC to withstand momentary shorts to the ± V limits specified in the earlier Standard EIAB.) The addition of the diodes also permits the MC to withstand faults with power supplies of less than the. V stated above. V CC Figure. Power Supply Protection to Meet Power Off Fault Conditions MC MC MC Figure. Slew Rate versus Capacitance for ISC = V EE SLEW RATE (V/ µ s).. V/µs C, CAPACITANCE (pf) pf,, The interface driver is also required to withstand an accidental short to any other conductor in an interconnecting cable. The worst possible signal on any conductor would be another driver using a plus or minus V, source. The MC is designed to indefinitely withstand such a short to all four outputs in a package as long as the power supply voltages are greater than. V (i.e., VCC. V; VEE. V). In some power supply designs, a loss of system power causes a low impedance on the power supply outputs. When this occurs, a low impedance to ground would exist at the power inputs to the MC effectively shorting the Ω output resistors to ground. If all four outputs were then shorted to plus or minus V, the power dissipation in these resistors would be excessive. Therefore, if the system is designed to permit low impedances to ground at the power supplies of the drivers, a diode The maximum short circuit current allowable under fault conditions is more than guaranteed by the previously mentioned output current limiting. Other Applications The MC is an extremely versatile line driver with a myriad of possible applications. Several features of the drivers enhance this versatility:. Output Current Limiting this enables the circuit designer to define the output voltage levels independent of power supplies and can be accomplished by diode clamping of the output pins. Figure shows the MC used as a DTL to MOS translator where the high level voltage output is clamped one diode above ground. The resistor divider shown is used to reduce the output voltage below the mv above ground MOS input level limit.. Power Supply Range as can be seen from the schematic drawing of the drivers, the positive and negative driving elements of the device are essentially independent and do not require matching power supplies. In fact, the positive supply can vary from a minimum. V (required for driving the negative pulldown section) to the maximum specified V. The negative supply can vary from approximately. V to the minimum specified V. The MC will drive the output to within. V of the positive or negative supplies as long as the current output limits are not exceeded. The combination of the current limiting and supply voltage features allow a wide combination of possible outputs within the same quad package. Thus if only a portion of the four drivers are used for driving EIAD lines, the remainder could be used for DTL to MOS or even DTL to DTL translation. Figure shows one such combination. MOTOROLA ANALOG IC DEVICE DATA
MC Figure. /MTTLtoMOS Translator Figure. Logic Translator Applications MTTL V V / MC. k V k MOS Output (with V SS = GND) NAND Gate MHTL MMOS MC. V. V. k k MRTL Output. V to +. V Output. V to +. V MHTL Output. V to V MOS Output V to V V V MOTOROLA ANALOG IC DEVICE DATA
MC OUTLINE DIMENSIONS P SUFFIX PLASTIC PACKAGE CASE ISSUE L B NOTES:. LEADS WITHIN. (.) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION.. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.. DIMENSION B DOES NOT INCLUDE MOLD FLASH.. ROUNDED CORNERS OPTIONAL. A F H G D N SEATING PLANE C K L M J INCHES MILLIMETERS DIM MIN MAX MIN MAX A.... B.... C.... D.... F.... G. BSC. BSC H.... J.... K.... L. BSC. BSC M N.... A B P PL D SUFFIX PLASTIC PACKAGE CASE A (SO) ISSUE F. (.) M B M NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y.M,.. CONTROLLING DIMENSION: MILLIMETER.. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.. MAXIMUM MOLD PROTRUSION. (.) PER SIDE.. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE. (.) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. T SEATING PLANE G D PL K C. (.) M T B S A S R X M J F MILLIMETERS INCHES DIM MIN MAX MIN MAX A.... B.... C.... D.... F.... G. BSC. BSC J.... K.... M P.... R.... MOTOROLA ANALOG IC DEVICE DATA
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