Automotive ultrafast rectifier Datasheet - production data Features K K AEC-Q101 qualified Very low conduction losses Negligible switching losses Low forward and reverse recovery times High junction temperature ECOPACK 2 compliant component VRRM guaranteed from -40 to +175 C PPAP capable A SOD123Flat A Description The STTH1R02-Y is an ultrafast recovery rectifier used for energy recovery in automotive applications, housed in a SOD123Flat package for improved space saving. It is especially designed for reverse battery protection function in all automotive application. The compromise between forward voltage drop and recovery time offers optimized performances. Table 1: Device summary Symbol IF(AV) VRRM Value 1 A 200 V Tj (max.) 175 C VF (typ.) trr (typ.) 0.75 V 25 ns February 2017 DocID030248 Rev 1 1/8 This is information on a product in full production. www.st.com
Characteristics STTH1R02-Y 1 Characteristics Table 2: Absolute ratings (limiting values at 25 C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage Tj = -40 C 200 V IF(AV) Average forward current Tlead = 153 C, δ = 0.5 square wave 1 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 25 A Tstg Storage temperature range -65 to +175 C Tj Maximum operating junction temperature -40 to +175 C Table 3: Thermal parameter Symbol Parameter Maximum Unit Rth(j-l) Junction to lead 23 C/W Table 4: Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit IR (1) VF (2) Reverse leakage current Forward voltage drop Notes: (1) Pulse test: tp = 5 ms, δ < 2% (2) Pulse test: tp = 380 µs, δ < 2% Tj = 25 C - 0.5 µa VR = VRRM Tj = 125 C - 1 10 µa Tj = 25 C - 0.87 1.00 IF = 1 A V Tj = 125 C - 0.75 0.85 To evaluate the conduction losses, use the following equation: P = 0.75 x IF(AV) + 0.1 x IF 2 (RMS) Table 5: Dynamic electrical characteristics Symbol Parameters Test conditions Min. Typ. Max. Unit trr Reverse recovery time IF = 1 A dif/dt = 50 A/μs VR = 30 V Tj = 25 C - 25 32 IF = 1 A - 30 IRM Reverse recovery current dif/dt = 100 A/μs VR = 160 V - 2.2 A Qrr Reverse recovery charges Tj = 125 C - 34 nc ns 2/8 DocID030248 Rev 1
1.1 Characteristics (curves) 1.2 Figure 1: Average forward power dissipation versus average forward current P F(AV) (W) 10.00 Characteristics Figure 2: Forward voltage drop versus forward current (typical values) (A) 1.0 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 δ = 1 0.8 1.00 0.6 T j = 25 C 0.4 T 0.2 (AV) (A) δ= tp/t tp 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.10 V F (V) 0.01 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 10.00 Figure 3: Forward voltage drop versus forward current (maximum values) (A) 1.00 T j = 25 C 0.10 V F (V) 0.01 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 Figure 4: Relative variation of thermal impedance junction to lead versus pulse duration Z /R th(j-l) th(j-l) 1.0 0.9 Single pulse 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 t (s) P 0.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 6 5 4 Figure 5: Peak reverse recovery current versus dif / dt (typical values) I RM (A) = 1A V R = 160 V Figure 6: Reverse recovery charges versus dif / dt (typical values) 80 60 Q rr (nc) = 1A V R = 160 V 3 40 2 1 dl F /dt (A/µs) 0 0 100 200 300 400 500 20 dl F /dt (A/µs) 0 0 100 200 300 400 500 DocID030248 Rev 1 3/8
Characteristics 60 50 40 Figure 7: Reverse recovery time versus dif / dt (typical values) t rr (ns) = 1A V R = 160 V STTH1R02-Y Figure 8: Reverse recovery softness factor versus dif / dt (typical values) 0.8 0.6 S factor = 1A V R = 160 V 30 0.4 20 10 dl F /dt (A/µs) 0 0 100 200 300 400 500 0.2 dl F /dt (A/µs) 0.0 0 100 200 300 400 500 1.4 1.2 Figure 9: Dynamic parameters versus junction temperature (reference Tj = 125 C) S; Q RR ; I RM [T j ] / S; Q RR ; I RM [T j =125 C] S =1A V R =160V T=125 C 100 Figure 10: Junction capacitance versus reverse voltage applied (typical values) C(pF) F = 1 MHz V OSC = 30 mv RMS T j = 25 C 1.0 0.8 0.6 0.4 I RM Q RR 10 0.2 T j ( C) 0.0 25 50 75 100 125 V R (V) 1 1 10 100 1000 Figure 11: Thermal resistance junction to ambient total versus copper surface under each tab (typical values) R th(j-a) (C/W) 250 SOD123Flat 200 150 100 50 Epoxy printed board FR4, e Cu = 35 µm S Cu (cm²) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 4/8 DocID030248 Rev 1
Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Epoxy meets UL94, V0 Cooling method: by conduction (C) 2.1 SOD123Flat package information Figure 12: SOD123Flat package outline A C1 L HD D L b C E DocID030248 Rev 1 5/8
1.40 Package information STTH1R02-Y Table 6: SOD123Flat package mechanical data Dimensions Ref. Millimeters Min. Typ. Max. A 0.86 0.98 1.10 b 0.80 0.90 1.00 c 0.08 0.15 0.25 c1 0.00 0.10 D 2.50 2.60 2.70 E 1.50 1.60 1.80 HD 3.30 3.50 3.70 L 0.45 0.65 0.85 Figure 13: SOD123Flat footprint dimensions (mm) 1.30 1.60 6/8 DocID030248 Rev 1
Ordering information 3 Ordering information Table 7: Ordering information Order code Marking Package Weight Base qty. Delivery mode STTH1R02ZFY 1Y2 SOD123Flat 12.5 mg 3000 Tape and reel 4 Revision history Table 8: Document revision history Date Revision Changes 06-Feb-2017 1 First issue DocID030248 Rev 1 7/8
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