Technology in Balance

Similar documents
Seattle & Oregon Chapters "New X2Y Filter Technology Emerges as Single Component Solution For Noise Suppression

Internal Model of X2Y Chip Technology

Suppression Techniques using X2Y as a Broadband EMI Filter IEEE International Symposium on EMC, Boston, MA

Real World Application of Filtering

EMI Filter Connectors

X2Y Attenuators, LLC. X2Y Technology in DC Motors

Anthony A. Anthony X2Y Attenuators, LLC 2700 West 21 st. Street, Suite 11 Erie, PA , USA

X2Y versus CM Chokes and PI Filters. Content X2Y Attenuators, LLC

Antenna Matching Within an Enclosure Part II: Practical Techniques and Guidelines

Comparison of IC Conducted Emission Measurement Methods

IC Decoupling and EMI Suppression using X2Y Technology

Todd Hubing. Clemson University. Cabin Environment Communication System. Controls Airbag Entertainment Systems Deployment

The shunt capacitor is the critical element

Antenna Theory and Design

Signal and Noise Measurement Techniques Using Magnetic Field Probes

WHY YOU NEED A CURRENT BALUN

Presented by Joanna Hill

Texas Instruments DisplayPort Design Guide

A VIEW OF ELECTROMAGNETIC LIFE ABOVE 100 MHz

Effectively Using the EM 6992 Near Field Probe Kit to Troubleshoot EMI Issues

Categorized by the type of core on which inductors are wound:

Heat sink. Insulator. µp Package. Heatsink is shown with parasitic coupling.

Understanding and Optimizing Electromagnetic Compatibility in Switchmode Power Supplies

MICROWAVE MICROWAVE TRAINING BENCH COMPONENT SPECIFICATIONS:

Aries Kapton CSP socket

The Causes and Impact of EMI in Power Systems; Part 1. Chris Swartz

Technical Report Printed Circuit Board Decoupling Capacitor Performance For Optimum EMC Design

Intermediate Course (5) Antennas and Feeders

Transfer Functions in EMC Shielding Design

The Ground Myth IEEE. Bruce Archambeault, Ph.D. IBM Distinguished Engineer, IEEE Fellow 18 November 2008

The number of layers The number and types of planes (power and/or ground) The ordering or sequence of the layers The spacing between the layers

EMI Filters Demystified. By William R. Bill Limburg February 21, 2018 Phoenix Chapter, IEEE EMC Society

PART MAX2605EUT-T MAX2606EUT-T MAX2607EUT-T MAX2608EUT-T MAX2609EUT-T TOP VIEW IND GND. Maxim Integrated Products 1

Verifying Simulation Results with Measurements. Scott Piper General Motors

Practical Considerations for Radiated Immunities Measurement using ETS-Lindgren EMC Probes

Development of a noval Switched Beam Antenna for Communications

Objectives of transmission lines

Microwave Metrology -ECE 684 Spring Lab Exercise T: TRL Calibration and Probe-Based Measurement

LISN UP Application Note

ELECTROMAGNETIC COMPATIBILITY HANDBOOK 1. Chapter 8: Cable Modeling

Course Introduction Purpose Objectives Content Learning Time

7. EMV Fachtagung. EMV-gerechtes Filterdesign. 23. April 2009, TU-Graz. Dr. Gunter Winkler (TU Graz) Dr. Bernd Deutschmann (Infineon Technologies AG)

INTERNAL SHORTED PATCH ANTENNA INTEGRATED WITH A SHIELDING METAL CASE FOR UMTS OPER- ATION IN A PDA PHONE

SAW Filter PCB Layout

Surface Mount SOT-363 (SC-70) Package. Pin Connections and Package Marking GND. V dd. Note: Package marking provides orientation and identification.

Range Considerations for RF Networks

Todd H. Hubing Michelin Professor of Vehicular Electronics Clemson University

150Hz to 1MHz magnetic field coupling to a typical shielded cable above a ground plane configuration

Title : X2Y Integrated Passive Devices : A Breakthrough in High Speed Decoupling and Broadband Filtering.

1000BASE-T1 EMC Test Specification for Common Mode Chokes

Technical note - Planar Inverted-F Antennas (PIFA)

X2Y Capacitors for Instrumentation Amplifier RFI Suppression

Localization and Identifying EMC interference Sources of a Microwave Transmission Module

Introduction: Planar Transmission Lines

Experiment 5: Grounding and Shielding

Ileana-Diana Nicolae ICMET CRAIOVA UNIVERSITY OF CRAIOVA MAIN BUILDING FACULTY OF ELECTROTECHNICS

The Amazing MFJ 269 Author Jack Tiley AD7FO

Low Jitter, Low Emission Timing Solutions For High Speed Digital Systems. A Design Methodology

Improved Ionospheric Propagation With Polarization Diversity, Using A Dual Feedpoint Cubical Quad Loop

ELEC 0017: ELECTROMAGNETIC COMPATIBILITY LABORATORY SESSIONS

Design Fundamentals by A. Ciccomancini Scogna, PhD Suppression of Simultaneous Switching Noise in Power and Ground Plane Pairs

Class-D Audio Power Amplifiers: PCB Layout For Audio Quality, EMC & Thermal Success (Home Entertainment Devices)

Microwave and optical systems Introduction p. 1 Characteristics of waves p. 1 The electromagnetic spectrum p. 3 History and uses of microwaves and

APPLIED ELECTROMAGNETICS: EARLY TRANSMISSION LINES APPROACH

SPECIFICATION. Specification No : PA A-02. Description : 880~960Mhz, 1710~2170 MHz, 0dB Gain Size: 31mm *6 mm *3.

G019.A (4/99) UNDERSTANDING COMMON MODE NOISE

Experiment 4: Grounding and Shielding

Electromagnetic Compatibility ( EMC )

SMT Module RF Reference Design Guide. AN_ SMT Module RF Reference Design Guide _V1.01

A NEW COMMON-MODE VOLTAGE PROBE FOR PREDICTING EMI FROM UNSHIELDED DIFFERENTIAL-PAIR CABLES

Chapter 12 Digital Circuit Radiation. Electromagnetic Compatibility Engineering. by Henry W. Ott

Application Note AN-00502

Aries QFP microstrip socket

"Natural" Antennas. Mr. Robert Marcus, PE, NCE Dr. Bruce C. Gabrielson, NCE. Security Engineering Services, Inc. PO Box 550 Chesapeake Beach, MD 20732

Γ L = Γ S =

Bill Ham Martin Ogbuokiri. This clause specifies the electrical performance requirements for shielded and unshielded cables.

Characterization of Integrated Circuits Electromagnetic Emission with IEC

Shielding 4K2K Display Graphics Connector Solder Tails Mitigates EMI

INSTRUCTION MANUAL TRI-PLATE LINE MODEL EM-7310

CHAPTER 4. Practical Design

CHAPTER 8 ANTENNAS 1

L-strip Proximity Fed Broadband Circular Disk Patch Antenna

TECHNICAL REPORT: CVEL Parasitic Inductance Cancellation for Filtering to Chassis Ground Using Surface Mount Capacitors

VLSI is scaling faster than number of interface pins

EM Noise Mitigation in Electronic Circuit Boards and Enclosures

AN2972 Application note

Trees, vegetation, buildings etc.

Application of Generalized Scattering Matrix for Prediction of Power Supply Noise

14 Sept 2006 Page 1 of 11 TRF7960 RFID Reader & Antenna Circuits. 1.) Introduction

PCB Design Guidelines for GPS chipset designs. Section 1. Section 2. Section 3. Section 4. Section 5

Solutions for EMC Issues in Automotive System Transmission Lines

Design a U-sloted Microstrip Antenna for Indoor and Outdoor Wireless LAN

Custom Interconnects Fuzz Button with Hardhat Test Socket/Interposer 1.00 mm pitch

The below identified patent application is available for licensing. Requests for information should be addressed to:

Applications of 3D Electromagnetic Modeling in Magnetic Recording: ESD and Signal Integrity

Chapter 16 PCB Layout and Stackup

Technician License Course Chapter 4. Lesson Plan Module 9 Antenna Fundamentals, Feed Lines & SWR

87x. MGA GHz 3 V Low Current GaAs MMIC LNA. Data Sheet

Relationship Between Signal Integrity and EMC

Low Cost Mixer for the 10.7 to 12.8 GHz Direct Broadcast Satellite Market

Transcription:

Technology in Balance A G1 G2 B

Basic Structure Comparison Regular capacitors have two plates or electrodes surrounded by a dielectric material. There is capacitance between the two conductive plates within the component. Dielectric Termination

Basic Structure Comparison As we begin to build the X2Y structure, a ground electrode or shield is added between the two active electrodes within the component and terminated to opposite sides. After adding an additional plate, there is now capacitance between each conductive electrode (electrodes are colored for clarity ) and the central shield. Terminations

Basic Structure Comparison However, parasitic capacitance can couple outside the component from the outer unshielded electrodes.

Basic Structure Comparison By adding two additional shields or plates, top and bottom, Faraday cages surround the electrodes and parasitics are trapped within the component. X2Y uses capacitive coupling to charge the internal ground electrodes of the component with opposite charges. This gives a zero potential low impedance path to ground for noise which cancels on the internal image ground plane within the device. - + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + -------------------------- + ---------------------------

Basic Structure Comparison When the lines of flux are mapped on a regular capacitor, they protrude off the edges of the capacitor plates, which. makes placement to other PC board trace signals critical at high frequencies Regular Capacitor Flux Lines Top Plate Flux lines Dielectric Material Bottom Plate

Flux Containment The X2Y architecture utilizes internal ground planes (shields) to minimize the flux lines from protruding beyond the sides of the device. When the flux lines stay internal to the capacitor, the placement of the X2Y device near other PC board trace signals is not critical at high frequencies. X2Y Architecture Image Plane (shield) Dielectric Material Dielectric Material Dielectric Material Dielectric Material Plate A Plate B

Impedance When two regular capacitors are placed in parallel, the capacitance adds and the impedance of the PC board ground between the two capacitors will have an effect on their self-resonant frequency. Two Capacitors In Parallel C1 C2 PCB Board Ground

Impedance In the X2Y architecture, the ground plates are connected in parallel to each other on either side of the internal image plane to reduce the internal image plane impedance before the device is connected to the PC board ground. The impedance of the internal image plane is in parallel with the PC board ground. Therefore, the impedance of the image plane and the PC board ground is reduced by one half of the smallest value. By reducing the impedance between the two capacitors in parallel, the self-resonance frequency is improved. C1 X2Y Ground Layer C2 PCB Board Ground

Impedance Impedance models of two prior art capacitors in parallel vs. one X2Y circuit C1 C2 Zo Regular Cap PCB Board Ground MHz GHz X2Y C1 X2Y Ground Layer Zo C2 MHz GHz PCB Board Ground

Proper Component Grounding This test setup will be used to show a progression of component grounding which will highlight the need for proper grounding of the X2Y device. Circuit Test Procedure - (Parallel) 2-50 Ohm Resistors to Ground A Shield Split Lines Spectrum Analyzer X2Y Unit 2.5 2.5 Long B G Shield Power Divider Tracking Generator NOTE: Current Probe Measurements are made on A, B and A+B. Measurements are taken X2Y is Grounded to External GnD Plate. NOTE: Injected Noise Starts from Tracking Generator to Power Divider, than is split ½ to A, B to the 1 ohm Resistor. 1 ohm OR 50 ohm Resistor Can be used Power Divider Shown Below Test Fixture & Platform

Proper Component Grounding When X2Y is not grounded there is no effect to the circuit as shown below. -10 Common Mode Noise Pins "A+B" Normalized 1206 220pf -5 0 5 10 A G1 X2Y B dbm 15 20 G2 25 30 35 40 45 50 0 50 100 150 200 250 300 350 400 450 500 Frequency MHz G1&G2 NOT ATTACHED

Proper Component Grounding When only one of the ground terminals (G1) is connected, the X2Y component has a resonant frequency of 300 MHz. Ground electrodes within the component are in parallel, but are in series to the main circuit ground ( like a regular cap ). 10 Common Mode Noise Pins "A+B" Normalized 1206 220pf 5 1 Gnd 0 5 Via 10 A G1 X2Y B dbm 15 20 G2 25 30 35 40 45 50 0 50 100 150 200 250 300 350 400 450 500 Frequency MHz G1&G2 NOT ATTACHED G1 ATTACHED, G2 NOT

Proper Component Grounding When both G1 and G2 are connected, all the ground electrodes of the component are in parallel to each other and the main circuit ground. This effect moves the resonant frequency out approximately 80 MHz. This grounding shows optimum circuit performance on both sides of resonance. 10 Common Mode Noise Pins "A+B" Normalized 1206 220pf 1 Gnd 5 0 Via 5 A G1 X2Y G2 B dbm 10 15 20 Via 25 30 2nd Gnd 35 40 45 50 0 50 100 150 200 250 300 350 400 450 500 Frequency MHz G1&G2 NOT ATTACHED G1 ATTACHED, G2 NOT G1&G2 ATTACHED

Proper Component Grounding Proper placement of an unbroken ground pad under the device will provide even lower impedance and further reduce noise in the circuit. Solder Pad Recommendations for X2Y T T U U V V A Via G1 X2Y B Via Y W Via G1 X2Y AX2YB Via Y W G2 Via Via G2 Via Via Z X 1410 Orientation 1014 Orientation Z Board Surface Ground Plane Board Surface Ground Plane Side View Side View

High Frequency This graph shows that the X2Y component stays capacitive to the circuit well beyond what is normally expected compared to regular capacitors. Power is provided over a broad frequency range well into the microwave band ( this test setup was limited to 1200 MHz). Navy tests on a discoidal with X2Y architecture have shown the component to be effective out to 40GHz. 0 Comparison - Common Mode Measurements Lines A & B -5-10 -15-20 -25 X2Y Chip @ 0.44 uf dbuv -30-35 -40-45 -50-55 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 Frequency MHz

TEM Cell The Dual TEM Cell is a Three-Conductor System Which Supports a Pair of Degenerate TEM Modules * X2Y Expressed as Two Rectangular Coaxial Transmission Lines (RCTL) IMAGE PLANE *Reference to Theoretical and Experimental Analysis of Coupling Characteristics s of Dual TEM Cells by P.F. Wilson, D.C. Chang, Department of Electrical Engineering, University of Colorado & M.T.Ma, M.L. Crawford, Electromagnetic Fields Division, National Bureau of Standards, Boulder, CO 80303 1983 IEEE

TEM Cell Model of X2Y Using Two TEM Cells (Assume two TEM cells stacked one above the other with the common n ground as the image plane) 1 2 Common Mode Noise Coupling Note: Common mode noise cancels at image plane when capacitors go into self-resonant frequency Differential Mode Noise Coupling Note: Differential mode noise cancels at image plane when currents of IA and IB are 180 degrees out of phase X2Y 1 + 2 = Image Plane

TEM Cell X2Y modeled as a stacked, dual TEM cell. In this cross section of an X2Y component there are 30 capacitors in parallel within the component but only four terminals on the outside of the component. G1 and G2 are a short to ground when connected (very low inductance mount) and in parallel line to line with the board ground. X2Y.1uF X2Y 15 A Electrodes 15 B Electrodes 31 Gnd electrodes G1 shown here, G2 on other side

Cancellation of Fields The X2Y architecture uses image planes (shields), which create rectangular current loops that share a common image plane. The X2Y plates A and B charge the image plane with opposing skin currents. When the currents are common on the image plane and 180º out-of-phase or oppositely charged they will cancel. X2Y Architecture Image Plane (shield) I A Dielectric Material Dielectric Material Dielectric Material Dielectric Material I B Plate A Plate B

Noise Cancellation COMMON MODE NOISE DEFINITION: Common mode noise (longitudinal) (cable systems in power generating stations). The noise voltage which appears equally and in phase from each signal conductor to ground.common mode noise will be caused by one or of the following: (1) Electrostatic induction. With equal capacitance between the signal wires and the surroundings, the noise voltage developed will be the same on both wires. (2) Electromagnetic induction. With the magnetic field linking the signal wires equally, the noise voltage developed will be the same on both signal wires. * DIFFERENTIAL MODE NOISE DEFINITION: Interference, differential mode (signal transmission system). Interference that causes the potential of one side of the signal transmission path to be change relative to the other side. * * Ref: IEEE standard Dictionary of Electrical and Electronics Terms, ANSI/IEEE Std 100-1988, Fourth Edition

Common Mode Common Mode Noise with Regular Capacitors Two regular capacitors must be sorted for equal capacitance tolerance when manufactured (an extra cost). Two regular capacitors are mounted on the same side of a common ground, the inductance is in series and ground potential of each line can vary widely. Parasitic Capacitance B I com noise A I com noise

Differential Mode Differential Mode Noise with Regular Capacitors When a regular capacitor capacitor is used between lines A and B, filtering of differential mode noise is only effective to the resonant frequency of the capacitor used (narrow band). Additional capacitors of varying capacitance must be added to broaden effective resonant range. B A I diff noise I diff noise

Simultaneous Common & Differential Mode A structure with X2Y circuitry contains 1 X capacitor and two Y capacitors in a single component, thereby replacing three regular capacitors with one component that can simultaneously filter common mode and differential mode noise. Y cap X cap Y cap

Balanced Capacitance Both X2Y and regular capacitors can vary in capacitance between components by as much as 20% when components have a 1O% tolerance. However, only one X2Y is needed for two lines, saving a capacitor and capacitance between the Y capacitors within the single component have a very tight tolerance for exceptional balance in line to line applications X2Y Regular Capacitance between Internal Y caps varies, 1% - 2.9% Capacitance between Components varies 20%

Antenna Theory with Regular Capacitors *To better understand how a monopole antenna works, let us approach it from this angle. Since the field propagating from a monopole is contained in the capacitance between the monopole element and the counterpoise, let us apply our understanding of capacitance and review what is occurring inside a parallel-plate capacitor. Radiating Element * Ref: An Intuitive Approach to EM Coupling by Vincent Greb EMC Test & Design, December 1993 Counterpoise Coax Feed to AC Source

Antenna Theory with Regular Capacitors *How does a capacitor work? Energy is transferred through a capacitor via an alternating electric field. One plate of the capacitor is given a net positive charge and the molecules in the intervening medium align themselves such that a net negative charge is established on the other plate. The first plate is then driven to a negative potential and this information is relayed to the other plate through the dielectric medium. The other plate responds by changing its net polarity to positive. This process is repeated periodically and the result is an AC circuit operating at some frequency. A A * Ref: An Intuitive Approach to EM Coupling by Vincent Greb EMC Test & Design, December 1993 ---- ---- + - + - + - + + + + + + ---- + - + + + + - ---- + - + + + B B

Antenna Theory with X2Y In the X2Y the two opposite electrode plates A & B have shields around each side of both electrode plates, and are common between them. The counter-posed electrodes between and around the two hot plates act as the other plate of a capacitor, creating three capacitors within the X2Y. In this manner, E fields are contained within the part and not allowed to exit into the free space from within the part. A A G1 ----- ----- + + + + + + + + - + - + - + - + - + - + - G2 G1 + + + + + + + + + - + - + - + - + - + - ----- ----- G2 B B

Patent Portfolio (36+) International Patents & Applications on File US Patent 5,142,430 - Issued August 25, 1992 Japan Patent 2531557 B2 - Issued September 4, 1996 US Patent 5,909,350 - Issued June 1, 1999 US Patent 6,018,448 - Issued January 25, 2000 US Patent 6,097,581 - Issued August 1, 2000 Notice of Allowance received US Patent #5- To Issue with 3-43 4 Weeks EPO, USA, JP, SG filed for Electronic Circuit Conditioning Assembly Over 750 X2Y Claims allowed, in-process & filed, Internationally Additional Related IP Filed Internationally and Under Development ent