Precision Chip esistors Precision Chip esistors :,, :,,,, :,,,,,, Features Small size and lightweight For PC size reduction and lightweight products High reliability Metal glaze thick film resistive element and three layered electrode results in high reliability. Matching with placement machines ulk, Taping and magazine packagings for automatic placement machines Solderability Suitable for both reflow soldering and flow soldering Four digit marking of resistance value on resistive element side (except,,, ) High power One rank up approval of power rating is available for,, type Low esistance Tolerance,,,,, Series... ±%,, Series... ±.% eference Standards IC -, IS C - xplanation of Part Numbers (,, Series, ±. % type) D Product Chip esistors Size, Power ating : inches Power. :. :. :. H T.C.. T.C.. ± Ð /ûc(ppm/ûc) No marking () ± Ð /ûc(ppm/ûc) (, ) ± Ð /ûc(ppm/ûc) No marking () ± Ð /ûc(ppm/ûc) (, ) esistance Tolerance Tolerance D ±. % Packaging (, ) mm pitch () esistance alue The first two digits are significant figures of resistance and the third one denotes number of zeros following.
xplanation of Part Numbers (,,,,, Series, ± % type) Precision Chip esistors F Product Chip esistors Size, Power ating : inches Power. :. No marking esistance Tolerance Tolerance F ± % Packaging mm pitch esistance alue The first three digits are significant figures of resistance and the third one denotes number of zeros following. N F Product Chip esistors Size, Power ating : inches Power. :. :. :. :. :. :. N S digit marking (,,, ) digit marking (( inches)only) No marking ( only) esistance Tolerance Tolerance F ± % Packaging U (,, only) mbossed Taping (, only) ulk case (, only) esistance alue The first three digits are significant figures of resistance and the th one denotes number of zeros following. Construction in mm (not to scale) Protective coating a L High purity alumina substrate Termination (Inner) t esistive element Termination (etween) Termination (Outer) () () () () N () N () N () N () S () b L a b t eight ( pcs.). ±.. +.. ±.. ±.. ±.. g. ±.. +.. ±.. ±.. ±. g. ±.. ±.. ±.. ±.. ±. g. ±.. +.. ±.. ±.. ±. g Ð.. ±.. ±.. ±.. ±.. ±. g. +.. +.. ±.. ±.. ±. g Ð. Ð. Ð.. ±.. ±.. ±.. ±.. ±. g. ±.. ±.. ±.. ±.. ±. g. ±.. ±.. ±.. ±.. ±. g
Precision Chip esistors atings Power ating Limiting lement Maximum Overload esistance esistance anges () T.C.. Standard oltage (Maximum - /ûc at C () C) () () oltage () () Tolerance (%) min. max. (ppm/ûc) esistance alues ±. ±. ± () M ± ±. ±. ± () M ± ±. ±. ± () M ± (). ± M ±. () (.) ± M ±, N. () (.) ±. M ±, N. () (.) ±. M ±, N (). ± M ±, N, S (), (). ± M ±, () ated Continuous orking oltage (C) shall be determined from C= ÖPower ating esistance alues, or Limiting lement oltage (max. C) listed above, whichever less. () Overload (Short-time Overload) Test oltage (SOT) shall be determined from SOT=. Power ating or max. Overload oltage listed above whichever less. Please ask us when resistors guaranteed high power are needed. Power Derating Curve For resistors operated in ambient temperatures above C, power rating shall be derated in accordance with the right figure. ated Load (%) Ð C C Ð C Ð Ð Ambient Temperature ( C)
Precision Chip esistors Standard Quantity () () () () () N () N () N () N,S (), () Taping eel Thickness ( mm pitch). pcs./reel( mm pitch). pcs./reel. pcs./reel. pcs./reel( mm pitch). pcs./reel pcs./case. pcs./reel pcs./case. pcs./reel mbossed Taping ( mm pitch). pcs./reel. pcs./reel ulk Case ulk Case T Slider fc Shutter f fa mbossed Taping fa f fc T,,,N,. ±... ±. Ð. min.. ±. N,N N, S. ±.. ±. t Sprocket hole Compartment fd A F fd Chip component P P P Tape running direction Sprocket hole Compartment pocket fd A F T Chip component P P P Tape running direction A F P N. ±.. ±.. ±.. ±. N. ±.. ±. S. ±.. ±..±...±.. ±. ±. P P fd t fd N N S. ±.. ±.. +.. ±. min.. min. A F P P P fd T. ±.. ±.. ±.. ±.,. ±.. ±.. ±.. ±.. ±.. ±.. ±.. ±.. ±.. +.,N. ±.. ±. N. ±.. ±.. ±.
ecommended Land Pattern (), (), N () N () N () N () S () Precision Chip esistors In the case of flow soldering, the land width must be smaller than the Chip esistor width to control the solder amount properly. Generally, the land width should be. to. times () of the width of chip resistor. In the case of reflow soldering, solder amount can be adjusted, therefor the land width should be set to. to. times chip resistor width (). a b Chip esistor ecommended Soldering Conditions ecommendations and precautions are described below. c a b c. to.. to.. to.. to. to.. to to.. to.. to. to.. to. to. to.. to. to.. to.. to.. to.. to. to. to. ecommended soldering conditions for reflow áeflow soldering shall be two times maximum. áplease contact us for additional information when you use in conditions other than those specified. áplease measure a temperature of terminations and study solderability every kind of solder and board, before actual use. For solder (xample : Sn/Pb) Temperature Time Preheating C to C s to s Main heating Above C s to s Peak ± C max. s Temperature Peak Preheating Heating For lead-free solder (xample : Sn/Ag/Cu) Temperature Time Preheating C to C s to s Main heating Above C s to s Peak max. C max. s Time ecommended soldering conditions for flow For solder For lead-free solder Temperature Time Temperature Time Preheating C to C s to s C to C s to s Soldering ± C s to s max. C max. s Cautions for Safety. If transient load (heavy load in a short time) like pulse is expected to be applied, carry out evaluation and confirmation test with the resistors actually mounted on your own board. hen the load of more than rated power is applied under the load condition at steady state, it may impair performance and/or reliability of resistor. Never exceed the rated power.. Chlorine type or other high-activity flux is not recommended as the residue may affect performance or reliability of resistors.. hen soldering with soldering iron, never touch the body of the chip resistor with a tip of the soldering iron. hen using a soldering iron with a tip at high temperature, solder for a time as short as possible (three seconds or less up to C).. Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as it may damage protective film or the body of resistor and may affect resistorõs performance.