Surface Mount PAR Transient Voltage Suppressors High Temperature Stability and High Reliability Conditions DESIGN SUPPORT TOOLS Models Available Top View Cathode esmp Series Bottom View PRIMARY CHARACTERISTICS Anode click logo to get started V BR 6.8 V to 5 V 5.8 V to 43.6 V P PPM ( x μs) 6 W P D at T M = 65 C 6 W T J max. 85 C Polarity Uni-directional Package FEATURES Very low profile - typical height of.95 mm Junction passivation optimized design passivated anisotropic rectifier technology T J = 85 C capability suitable for high reliability and automotive requirement Ideal for automated placement Uni-directional only Excellent clamping capability Peak pulse power: 6 W (/ μs) AEC-Q qualified ESD capability: IEC 6-4-2 level 4-5 kv (air) - 8 kv (contact) Meets MSL level, per J-STD-2, LF maximum peak of 26 C Material categorization: for definitions of compliance please see /doc?9992 TYPICAL APPLICATIONS Use in sensitive electronics protection against voltage transients induced by inductive load switching and lighting on ICs, MOSFET, signal lines of sensor units for consumer, computer, industrial, and telecommunication. MECHANICAL DATA Case: Molding compound meets UL 94 V- flammability rating Base P/NHM3_X - halogen-free, RoHS-compliant and AEC-Q qualified ( _X denotes revision code e.g. A, B,...) Terminals: matte tin plated leads, solderable per J-STD-2 and JESD22-B2 HM3 suffix meets JESD 2 class 2 whisker test Polarity: color band denotes cathode end RATINGS (T A = 25 C, unless otherwise noted) PARAMETER SYMBOL VALUE UNIT Peak pulse power dissipation with a / μs waveform P () PPM 6 W Peak pulse current with a / μs waveform I () PPM See next table A Power dissipation on infinite heat sink, T M = 65 C P (2) D 6 Power dissipation, T M = 25 C P (3) D. W Operating junction and storage temperature range T J, T STG -65 to +85 C () Non-repetitive current pulse, per fig. 3 and derated above T A = 25 C per fig. 2. (2) Power dissipation mounted on infinite heat sink (3) Power dissipation mounted on minimum recommended pad layout Revision: 7-Dec-28 Document Number: 89939 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9
ELECTRICAL CHARACTERISTICS (T A = 25 C unless otherwise noted) DEVICE TYPE DEVICE MARKING CODE BREAKDOWN V BR () AT I T NOM. MAX. TEST CURRENT I T (ma) STAND-OFF REVERSE LEAKAGE AT I R (μa) T J = 5 C REVERSE LEAKAGE AT I R (μa) PEAK PULSE SURGE CURRENT (A) () Pulse test: t p 5 ms (2) To calculate V BR vs. junction temperature, use the following formula: V BR at T J = V BR at 25 C x ( + T x (T J - 25)) CLAMPING AT V C TYPICAL TEMP. COEFFICIENT OF V BR (2) T (%/ C) TA6F6.8A AEP 6.45 6.8 7.4 5.8 5 57..5.47 TA6F7.5A AGP 7.3 7.5 7.88 6.4 25 5 53..3.52 TA6F8.2A AKP 7.79 8.2 8.6 7.2 2 49.6 2..56 TA6F9.A AMP 8.65 9. 9.55. 7.78 25 5 44.8 3.4.6 TA6FA APP 9.5..5. 8.55 5. 2 4.4 4.5.64 TA6FA ARP.5..6. 9.4 2. 5. 38.5 5.6.67 TA6F2A ATP.4 2. 2.6..2 2. 5. 35.9 6.7.7 TA6F3A AVP 2.4 3. 3.7.. 2. 5. 33. 8.2.72 TA6F5A AXP 4.3 5. 5.8. 2.8. 5. 28.3 2.2.76 TA6F6A AZP 5.2 6. 6.8. 3.6. 5. 26.7 22.5.78 TA6F8A BEP 7. 8. 8.9. 5.3. 5. 23.5 25.5.8 TA6F2A BGP 9. 2. 2.. 7.. 5. 2.7 27.7.82 TA6F22A BKP 2.9 22. 23.. 8.8. 5. 9.6 3.6.84 TA6F24A BMP 22.8 24. 25.2. 2.5. 5. 8. 33.2.85 TA6F27A BPP 25.7 27. 28.4. 23.. 5. 6. 37.5.87 TA6F3A BRP 28.5 3. 3.5. 25.6. 5. 4.5 4.4.88 TA6F33A BTP 3.4 33. 34.7. 28.2. 5. 3. 45.7.89 TA6F36A BVP 34.2 36. 37.8. 3.8. 5. 2. 49.9.9 TA6F39A BXP 37. 39. 4.. 33.3. 5.. 53.9.9 TA6F43A BZP 4.9 43. 45.2. 36.8... 59.3.92 TA6F47A CEP 44.7 47. 49.4. 4.2.. 9.3 64.8.92 TA6F5A CGP 48.5 5. 53.6. 43.6.. 8.6 7..93 THERMAL CHARACTERISTICS (T A = 25 C unless otherwise noted) PARAMETER SYMBOL VALUE UNIT Typical thermal resistance, junction to ambient R () JA 45 C/W Typical thermal resistance, junction to mount R JM (2) 2 C/W () Mounted on minimum recommended pad layout (2) Mounted on infinite heat sink IMMUNITY TO STATIC ELECTRICAL DISCHARGE TO THE FOLLOWING STANDARDS (T A = 25 C unless otherwise noted) STANDARD TEST TYPE TEST CONDITIONS SYMBOL CLASS VALUE IEC 6-4-2 Human body model (contact mode) Human body model (air discharge mode) C = 5 pf, R = 33 V C 4 > 8 kv > 5 kv ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE TA6F6.8AHM3_A/H ().32 H 35 7" diameter plastic tape and reel TA6F6.8AHM3_A/I ().32 I 4 3" diameter plastic tape and reel Note () AEC-Q qualified Revision: 7-Dec-28 2 Document Number: 89939 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9
- Peak Pulse Current (% I RSM ) RATINGS AND CHARACTERISTICS CURVES (T A = 25 C unless otherwise noted) P PPM - Peak Pulse Power (kw). C J - Junction Capacitance (pf) Measured at Stand-off Voltage, Measured at Zero Bias T J = 25 C f =. MHz V sig = 5 mv p-p t d - Pulse Width (μs) Fig. - Peak Pulse Power Rating Curve V BR - Break-down Voltage Fig. 4 - Typical Junction Capacitance Peak Pulse Power (P PP ) or Current (I PP ) Derating in Percentage, % 75 5 25 25 5 75 25 5 75 2 T J - Initial Temperature ( C) P D - Power Dissipation (W) 7 6 5 4 3 2 FR-4 Board, on Minimum Recommended Pad Layout T A =T M, mounted on inifinite heatsink 25 5 75 25 5 75 2 T A - Ambient Temperature ( C) Fig. 2 - Pulse Power or Current vs. Initial Junction Temperature Fig. 5 - Power Dissipation Derating Curve 5 5 t d t r = μs Peak Value Half Value - I PP 2 T J = 25 C Pulse Width (t d ) is defined as the Point Where the Peak Current decays to 5 % of t d = μs. 2. 3. 4. Transient Thermal Impedance ( C/W).. t - Time (ms) Fig. 3 - Pulse Waveform t p - Pulse Duration (s) Fig. 6 - Typical Transient Thermal Impedance Revision: 7-Dec-28 3 Document Number: 89939 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9
PACKAGE OUTLINE DIMENSIONS in inches (millimeters) Cathode Band.6 (2.7).98 (2.5).57 (.45).49 (.25).7 (4.35).63 (4.5).2 (5.35).99 (5.5).47 (.2).3 (.75) Mounting Pad Layout Typ.:.9 (.48).39 (.).35 (.9).2 (.3).6 (.5).6 (.52).47 (.2).23 (3.2) MAX..27 (5.52) REF..47 (.2) Revision: 7-Dec-28 4 Document Number: 89939 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9
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