FGH40N60SFDTU-F V, 40 A Field Stop IGBT

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FGH40N60SFDTU-F085 600 V, 40 A Field Stop IGBT Features High Current Capability Low Saturation Voltage: V CE(sat) = 2.3 V @ I C = 40 A High Input Impedance Fast Switching RoHS Compliant Qualified to Automotive Requirements of AEC-Q101 Applications Automotive chargers, Converters, High Voltage Auxiliaries Inverters, PFC, UPS E C G General Description Using Novel Field Stop IGBT Technology, ON Semiconductor s new series of Field Stop IGBTs offer the optimum performance for Automo-tive Chargers, Inverter, and other applications where low con-duction and switching losses are essential. C COLLECTOR (FLANGE) G E Absolute Maximum Ratings Symbol Description Ratings Unit V CES Collector to Emitter Voltage 600 V V GES Transient Gate-to-Emitter Voltage 30 Gate to Emitter Voltage 20 I C Collector Current @ T C = 25 o C 80 A Collector Current @ T C = 100 o C 40 A I CM (1) Pulsed Collector Current @ TC = 25 o C 120 A P D Maximum Power Dissipation @ T C = 25 o C 290 W Maximum Power Dissipation @ T C = 100 o C 116 W T J Operating Junction Temperature -55 to +150 o C T stg Storage Temperature Range -55 to +150 o C T L Maximum Lead Temp. for soldering Purposes, 1/8 from case for 5 seconds Notes: 1: Repetitive rating: Pulse width limited by max. junction temperature Thermal Characteristics V 300 o C Symbol Parameter Typ. Unit R JC (IGBT) Thermal Resistance, Junction to Case 0.43 o C/W R JC (Diode) Thermal Resistance, Junction to Case 1.45 o C/W R JA Thermal Resistance, Junction to Ambient 40 o C/W 2015 Semiconductor Components Industries, LLC. August-2017,Rev.2 Publication Order Number: FGH40N60SFDTU-F085/D

Package Marking and Ordering Information Part Number Top Mark Package Packing Method Reel Size Tape Width Quantity FGH40N60SFDTU-F085 FGH40N60SFD TO-247 Tube N/A N/A 30 Electrical Characteristics of the IGBT T C = 25 C unless otherwise noted Symbol Parameter Test Conditions Min. Typ. Max. Unit Off Characteristics BV CES Collector to Emitter Breakdown Voltage V GE = 0 V, I C = 250 A 600 - - V BV CES T J Temperature Coefficient of Breakdown Voltage V GE = 0 V, I C = 250 A - 0.6 - V/ o C I CES Collector Cut-Off Current V CE = V CES, V GE = 0 V - - 250 A I GES G-E Leakage Current V GE = V GES, V CE = 0 V - - ±400 na On Characteristics V GE(th) G-E Threshold Voltage I C = 250 A, V CE = V GE 4.0 4.7 6.5 V I C = 40 A, V GE = 15 V - 2.3 2.9 V V CE(sat) Collector to Emitter Saturation Voltage I C = 40 A, V GE = 15 V, T C = 125 o C - 2.5 - V Dynamic Characteristics C ies Input Capacitance - 1920 - pf C oes Output Capacitance V CE = 30 V, V GE = 0 V, f = 1 MHz - 190 - pf C res Reverse Transfer Capacitance - 65 - pf Switching Characteristics t d(on) Turn-On Delay Time - 21 - ns t r Rise Time - 35 - ns t d(off) Turn-Off Delay Time V CC = 400 V, I C = 40 A, - 138 - ns t f Fall Time R G = 10, V GE = 15 V, - 18 54 ns E on Turn-On Switching Loss Inductive Load, T C = 25 o C - 1.23 - mj E off Turn-Off Switching Loss - 0.38 - mj E ts Total Switching Loss - 1.61 - mj t d(on) Turn-On Delay Time - 21 - ns t r Rise Time - 39 - ns t d(off) Turn-Off Delay Time V CC = 400 V, I C = 40 A, - 144 - ns t f Fall Time R G = 10, V GE = 15 V, - 48 - ns E on Turn-On Switching Loss Inductive Load, T C = 125 o C - 1.58 - mj E off Turn-Off Switching Loss - 0.58 - mj E ts Total Switching Loss - 2.16 - mj Q g Total Gate Charge - 121 - nc Q ge Gate to Emitter Charge V CE = 400 V, I C = 40 A, V GE = 15 V - 16 - nc Q gc Gate to Collector Charge - 68 - nc 2

Electrical Characteristics of the Diode T C = 25 C unless otherwise noted Symbol Parameter Test Conditions Min. Typ. Max Unit V FM Diode Forward Voltage I F = 20 A T C = 25 o C - 1.80 2.6 V T C = 125 o C - 1.70 - t rr Diode Reverse Recovery Time T C = 25 o C - 68 - ns I F =20 A, di F /dt = 200 A/ s T C = 125 o C - 240 - Q rr Diode Reverse Recovery Charge T C = 25 o C - 160 - nc T C = 125 o C - 840-3

Typical Performance Characteristics Figure 1. Typical Output Characteristics Figure 3. Typical Saturation Voltage Characteristics Figure 2. Typical Output Characteristics Figure 4. Transfer Characteristics Figure 5. Saturation Voltage vs. Case Temperature at Variant Current Level Figure 6. Saturation Voltage vs. V GE 4

Typical Performance Characteristics Figure 7. Saturation Voltage vs. V GE Figure 9. Capacitance Characteristics Figure 8. Saturation Voltage vs. V GE Figure 10. Gate charge Characteristics FGH40N60SFDTU-085 600 V, 40 A Field Stop IGBT Figure 11. SOA Characteristics Figure 12. Turn-on Characteristics vs. Gate Resistance 5

Typical Performance Characteristics Figure 13. Turn-off Characteristics vs. Gate Resistance Figure 14. Turn-on Characteristics vs. Collector Current Figure 15. Turn-off Characteristics vs. Figure 16. Switching Loss vs. Gate Resistance Collector Current Figure 17. Switching Loss vs. Collector Current Figure 18. Turn off Switching SOA Characteristics 6

Typical Performance Characteristics Figure 19. Forward Characteristics Figure 21. Stored Charge Figure 20. Reverse Current Figure 22. Reverse Recovery Time Figure 23.Transient Thermal Impedance of IGBT P DM t 1 t 2 7

Mechanical Dimensions Figure 24. TO-247 3L - TO-247,MOLDED,3 LEAD,JEDEC VARIATION AB Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a ON Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor s worldwide terms and conditions, specif-ically the warranty therein, which covers ON Semiconductor products. 8

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