Model BD1722J50100A00

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Transcription:

Ultra Low Profile 85 Balun 5Ω to 1Ω Balanced Description The BD1722J51A is a low profile sub-miniature balanced to unbalanced transformer designed for differential inputs and output locations on next generation wireless chipsets in an easy to use surface mount package covering the DCS, PCS, UMTS and CDMA frequencies. The BD1722J51A is ideal for high volume manufacturing and is higher performance than traditional ceramic, and lumped element baluns. The BD1722J51A has an unbalanced port impedance of 5Ω and a 1Ω balanced port impedance. This transformation enables single ended signals to be applied to differential ports on modern semiconductors. The output ports have equal amplitude (db) with 18 degree phase differential. The BD1722J51A is available on tape and reel for pick and place high volume manufacturing. Detailed Electrical Specifications: Specifications subject to change without notice. Features: 17 22 MHz.7mm Height Profile 5 Ohm to 2 x 5 Ohm DCS/PCS/UMTS/CDMA Low Insertion Loss Input to Output DC Isolation Surface Mountable Tape & Reel Non-conductive Surface RoHS Compliant ROOM (25 C) Parameter Min. Typ. Max Unit Frequency 17 22 MHz Unbalanced Port Impedance 5 Ω Balanced Port Impedance 1 Ω Return Loss 9 13 db Insertion Loss*.9 1.2 db Amplitude Balance.4 1.2 db Phase Balance 4 6 Degrees CMRR 29 db Power Handling 2 Watts Operating Temperature -55 +85 ºC * Insertion Loss stated at room temperature (Insertion Loss is approximately.1 db higher at +85 ºC) Outline Drawing Top View (Near-side) Orientation Marker Denotes Pin Location.79±.4 [2.±.1].49±.4 [1.25±.1] Dimensions are in Inches [Millimeters] Mechanical Outline.27±.2 [.7±.5] Pin 1 2 3 4 5 6 Side View Designation Unbalanced Port GND / DC Feed + RF GND Balanced Port Balanced Port GND NC Bottom View (Far-side).39 [.98] Orientation Marker Denotes Pin Location 1 2 3 6 5 4 6X.12 [.3] Tolerances are Non-Cumulative.26 [.65] 6X.9 [.22] Available on Tape and Reel for Pick and Place Manufacturing.

Typical Broadband Performance: 5 MHz. to 8.5 GHz. 3 6 Return Loss - Input -.3 -.6 -.9-1.2-1.8-2.1-2.4-2.7.3.6 Insertion Loss 5 1 15 2 25 3 35 4 45 5 55 6 65 7 75 8 85 5 1 15 2 25 3 35 4 45 5 55 6 65 7 75 8 85 Amplitude Balance Phase Balance 2 2 1.5 15 1 1.5 5 deg -.5-5 -1-1 -2-2 5 1 15 2 25 3 35 4 45 5 55 6 65 7 75 8 85 5 1 15 2 25 3 35 4 45 5 55 6 65 7 75 8 85 CMRR 3 6 5 1 15 2 25 3 35 4 45 5 55 6 65 7 75 8 85 Available on Tape and Reel for Pick and Place Manufacturing.

Typical Performance: 16 MHz. to 23 MHz. 3 6 16 17 18 Return Loss - Input 19 2 21 22 23 -.3 -.6 -.9-1.2-1.8-2.1-2.4-2.7.3.6 16 17 18 Insertion Loss 19 2 21 22 23 2 Amplitude Balance 2 Phase Balance 1.5 15 1 1.5 5 deg -.5-5 -1-1 -2-2 16 17 18 19 2 21 22 23 16 17 18 19 2 21 22 23 CMRR 3 6 16 17 18 19 2 21 22 23 Available on Tape and Reel for Pick and Place Manufacturing.

Mounting Configuration: In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet published specifications. All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/ o C. An example of the PCB footprint used in the testing of these parts is shown below. An example of a DC-biased footprint is also shown below. In specific designs, the transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances. No Bias Footprint DC Bias Footprint 6X.14 [.35] 4X.12 [.3] 6X.16 [.35] DC Bias Part Orientation (Top View) Part Orientation (Top View) 6X.11 [.27].29 [.73] 6X.13 [.33].26 [.66] 6X.2 [.5] 6X.2 [.5] 3X Transmission Line Plated thru hole to ground 3X Transmission Line 4X.12 [.3] Circuit Pattern Footprint Pad (s) Solder Resist Dimensions are in Inches [Millimeters] 85 Standard Mounting Footprint Circuit Pattern Footprint Pad (s) Solder Resist Plated thru hole to ground Dimensions are in Inches [Millimeters] 85 DC Bias Mounting Footprint Available on Tape and Reel for Pick and Place Manufacturing.

Packaging and Ordering Information Parts are available in reel and are packaged per EIA 481-2. Parts are oriented in tape and reel as shown below. Minimum order quantities are 4 per reel. See Model Numbers below for further ordering information. ØA ØC ØD QUANTITY/REEL 4 TABLE 1 REEL DIMENSIONS (inches [mm]) ØA B ØC ØD 7. [177.8].32 [8.] 2. [5.8].512 [13.] B Available on Tape and Reel for Pick and Place Manufacturing.

Available on Tape and Reel for Pick and Place Manufacturing.