Product specification November 7, 218 V. ATA SHEET ELECTROSTATIC ISCHARGE PROTECTION EVICES INUSTRIAL / CONSUMER series RoHS compliant & Halogen free
2 escription Electrostatic ischarged Protection evices (ES) ata Sheet Brightking s is designed to protect low voltage sensitive components from ES and transient voltage events. Excellent clamping capability, low leakage, and fast response time, make these parts ideal for ES protection on designs where board space is at a premium. Because of its small size, it is suited for use in cellular phones, portable devices, digital cameras, power supplies and many other portable applications. It is designed to protect sensitive semiconductor components from damage or upset due to electrostatic discharge(es), electrical fast transients(eft), and cable discharge events(ce). Features IEC6-4-2 ES 1KV Air, 8KV contact compliance SO-323 surface mount package Protects one I/O line Peak power dissipation of 32W under 8/2μs waveform Working voltage: V Low leakage current Low clamping voltage Solid-state silicon avalanche technology Lead Free/RoHS compliant Solder reflow temperature: Pure Tin-Sn, 26~27 Flammability rating UL 94V- Meets MSL level 1, per J-ST-2 Marking: W Pin Configuration Applications Cellular handsets & Accessories Cordless phones Personal digital assistants (PAs) Notebooks & Handhelds Portable instrumentation igital cameras Peripherals MP3 players Maximum Ratings Rating Symbol Value Unit Peak pulse power (tp=8/2μs waveform) P PP 32 W ES voltage (Contact discharge) V ES ES voltage (Air discharge) ±1 Storage & operating temperature range T STG,T J -~+ ±8 kv
3 Electrical Characteristics (T J =2 ) Parameter Symbol Condition Min. Typ. Max. Unit Reverse stand-off voltage V RWM V Reverse breakdown voltage V BR I BR =1mA 6 V Reverse leakage current I R V R =V μa Clamping voltage (tp=8/2μs) V C I PP =1A 9.8 V Off state junction capacitance C J Vdc,f=1MHz 3 pf Typical Characteristics Curves Figure 1. Power erating Curve Figure 2. Pulse Waveform Peak Power issipation (%) 9 8 7 6 4 3 2 % of Peak Power Current 1 9 8 7 6 4 3 2 t r Peak value Ipp Waveform Parameters: t r =8µs t d =2µs t d =t PP /2 2 7 12 17 2 1 2 2 3 T A -Ambient Temperature ( ) t-time (μs) Figure 3. Capacitance vs. Reverse Voltage F=1MHz Junction Capacitance (pf) 4 3 2 1 2 3 4 Reverse Voltage (V)
4 Recommended Soldering Conditions Reflow Soldering T P Ramp-up t P Critical Zone T L to T P T L T S max t L Temperature T S min t S Preheat Ramp-down 2 Recommended Condition t 2 to Peak Time Profile Feature Average ramp-up rate (T L to T P ) Preheat -Temperature Min (T S min ) -Temperature Max (T S max ) -Time (min to max) (ts) Pb-Free Assembly 3 /second max. 2 6-18 seconds T S max to T L -Ramp-up Rate Time maintained above: -Temperature (T L ) -Time (t L ) 3 /second max. 217 6- seconds Peak Temperature (T P ) 26 Time within of actual Peak Temperature (t P ) Ramp-down Rate Time 2 to Peak Temperature 2-4 seconds 6 /second max. 8 minutes max.
imensions (SO-323) G E imension Symbol Millimeters Inches H X Min. Max. Min. Max. A.8 1..31.43 1 2.6 (2X). (2X) F A B detail X C B -. -.4 C.2 -.8 -.11.2.4.8 E 1.1 1.3.4.3 F -.3 -.14 2.3 Recommended Soldering Pad Layout G 1.6 1.8.63.71 H 2.4 2.6.94.2 Packaging Tape Symbol imension (mm) W 8.±.3 P 4.±. ø P P1 P2 K P1 4.±. P2 2.±. E Φ1.±. 1 Φ1.±. B B A A ø1 F W t E 1.7±. F 3.±. A 1.48±. A.8±. B 3.±. B 1.8±. K 1.±. t.2±. Reel Φ178.±2. 2 2 Φ13. W1 9. W1 Quantity: 3PCS