HMC454ST89 / 454ST89E. Features. = +25 C, Vs= +5V [1]

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Typical Applications The HMC44ST8 / HMC44ST8E is ideal for applications requiring a high dynamic range amplifi er: GSM, GPRS & EDGE CDMA & W-CDMA CATV/Cable Modem Fixed Wireless & WLL Features Output IP3: +4 to +42 dbm Gain: 12. db @ 2 MHz % PAE @ +28 dbm Pout +17. dbm W-CDMA Channel Power@ -4 dbc ACP Single +V Supply Industry Standard SOT8 Package Included in the HMC-DK2 Designer s Kit Functional Diagram Electrical Specifications, T A = + C, Vs= +V [1] General Description The HMC44ST8 & HMC44ST8E are high dynamic range GaAs InGaP Heterojunction Bipolar Transistor (HBT) ½ watt MMIC amplifi ers operating between.4 and 2. GHz. Packaged in a low cost industry standard SOT8, the amplifi er gain is typically 17.8 db from.8 to 1. GHz and 12. db from 1.8 to 2.2 GHz. Utilizing a minimum number of external components and a single +V supply, the amplifi er output IP3 can be optimized to +4 dbm at. GHz or +42 dbm at 2. GHz. The high output IP3 and PAE makes the HMC44ST8 an ideal driver amplifi er for Cellular/PCS/3G, WLL, ISM and Fixed Wireless applications. Parameter Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Units Frequency Range 824-6 18 - - 2 MHz Gain 16 17.8 11 12. 11 12. db Gain Variation Over Temperature.8.16.8.16.8.16 db / C Input Return Loss 7 12 db Output Return Loss 13 21 1 db Output Power for 1dB Compression (P1dB) 22 24. 24 27 24 27. dbm Saturated Output Power (Psat). 28. 28. dbm Output Third Order Intercept (IP3) [2] 37 4 38 41 38 42 dbm Noise Figure 8 6..2 db Supply Current (Icq) 17 17 17 ma [1] Specifi cations and data refl ect HMC44ST8 measured using the respective application circuits for each designated frequency band found herein. Contact the HMC Applications Group for assistance in optimizing performance for your application. [2] Two-tone input power of dbm per tone, 1 MHz spacing. - Phone: 78--3343 Fax: 78--3373 Order On-line at www.hittite.com Application Support: Phone: 78--3343 or apps@hittite.com

Broadband Gain & Return Loss @ MHz RESPONSE (db) - - - - S21 S11 S22.4..6.7.8. 1 1.1 1.2 1.3 1.4 Input Return Loss vs. Temperature @ MHz RETURN LOSS (db) P1dB vs. Temperature @ MHz P1dB (dbm) - - - - - 3 2 28 27 26 24 23 22 21 + C +8 C -4 C.7.8. 1 1.1 1.2 + C +8 C -4 C.7.8. 1 1.1 1.2 Gain vs. Temperature @ MHz GAIN (db) 1 18 17 16 14 13 12 11 + C +8 C -4 C.7.8. 1 1.1 1.2 Output Return Loss vs. Temperature @ MHz RETURN LOSS (db) - - - - + C +8 C -4 C.7.8. 1 1.1 1.2 Psat vs. Temperature @ MHz PSAT (dbm) 3 2 28 27 26 24 23 22 21 + C +8 C -4 C.7.8. 1 1.1 1.2 Phone: 78--3343 Fax: 78--3373 Order On-line at www.hittite.com Application Support: Phone: 78--3343 or apps@hittite.com - 11

Output IP3 vs. Temperature @ MHz IP3 (dbm) 44 43 42 41 4 3 38 37 36 3 34 + C +8 C -4 C.7.8. 1 1.1 1.2 Reverse Isolation vs. Temperature @ MHz ISOLATION (db) - - - - - -3-3 -4 + C +8 C -4 C.7.8. 1 1.1 1.2 ACPR (dbc) ACPR vs. Supply Voltage @ 88 MHz CDMA IS, Channels Forward -3-3 -4-4 - - -6-6 -7 CDMA IS Frequency : 88 MHz Integration BW: 1.228 MHz Forward Link, Channels Noise Figure vs. Temperature @ MHz NOISE FIGURE (db) 14 13 12 11 8 7 6 + C +8 C -4 C.7.8. 1 1.1 1.2 Gain, Power & Output IP3 vs. Supply Voltage @ MHz GAIN (db), P1dB (dbm), PSAT (dbm), IP3 (dbm) 4 4 3 3 GAIN P1dB PSAT IP3 4. 4.7.. Vs (V) 4.V.V.V -7 Source ACPR -8 7 8 11 12 13 14 16 17 18 1 Channel Output Power (dbm) - 12 Phone: 78--3343 Fax: 78--3373 Order On-line at www.hittite.com Application Support: Phone: 78--3343 or apps@hittite.com

Broadband Gain & Return Loss @ 16 MHz RESPONSE (db) - - - - - S21 S11 S22 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3 Input Return Loss vs. Temperature @ 16 MHz RETURN LOSS (db) P1dB vs. Temperature @ 16 MHz P1dB (dbm) - - - - 32 31 3 2 28 27 26 24 23 22 + C +8 C -4 C 1.7 1.8 1. 2 2.1 2.2 + C +8 C -4 C 1.7 1.8 1. 2 2.1 2.2 Gain vs. Temperature @ 16 MHz GAIN (db) 14 13 12 11 8 7 6 + C +8 C -4 C 1.7 1.8 1. 2 2.1 2.2 Output Return Loss vs. Temperature @ 16 MHz RETURN LOSS (db) - - - - - + C +8 C -4 C 1.7 1.8 1. 2 2.1 2.2 Psat vs. Temperature @ 16 MHz PSAT (dbm) 32 31 3 2 28 27 26 24 23 22 + C +8 C -4 C 1.7 1.8 1. 2 2.1 2.2 Phone: 78--3343 Fax: 78--3373 Order On-line at www.hittite.com Application Support: Phone: 78--3343 or apps@hittite.com - 13

Output IP3 vs. Temperature @ 16 MHz IP3 (dbm) 44 43 42 41 4 3 38 37 36 3 34 + C +8 C -4 C 1.7 1.8 1. 2 2.1 2.2 Reverse Isolation vs. Temperature @ 16 MHz ISOLATION (db) - - - - - + C +8 C -4 C 1.7 1.8 1. 2 2.1 2.2 ACPR vs. Supply Voltage @ 1.6 GHz CDMA, Channels Forward ACPR (dbc) -4-4 - - -6-6 -7-7 CDMA Rev. 8 Frequency : 1.6 GHz Integration BW: 1.228 MHz Forward Link, SRI, CHANNELS 4.V.V.V -8 Source ACPR -8 2 4 6 8 12 14 16 18 22 Channel Output Power (dbm) Noise Figure vs. Temperature @ 16 MHz NOISE FIGURE (db) 8 7 6 4 3 2 1 + C +8 C -4 C 1.7 1.8 1. 2 2.1 2.2 Gain, Power & Output IP3 vs. Supply Voltage @ 16 MHz GAIN (db), P1dB (dbm), PSAT (dbm), IP3 (dbm) 4 4 3 3 GAIN P1dB PSAT IP3 4. 4.7.. Vs (V) ACPR vs. Supply Voltage @ 2.14 GHz W-CDMA, 64 DPCH ACPR (dbc) -3-3 -4-4 - - -6 WCDMA Frequency : 2.14 GHz Integration BW: 3.84 MHz 64 DPCH 4.V.V -6 Source ACPR -7 2 4 6 8 12 14 16 18 Channel Output Power (dbm).v - 14 Phone: 78--3343 Fax: 78--3373 Order On-line at www.hittite.com Application Support: Phone: 78--3343 or apps@hittite.com

Absolute Maximum Ratings Collector Bias Voltage (Vcc) +6. Vdc RF Input Power (RFIN)(Vs = +Vdc) + dbm Junction Temperature C Continuous Pdiss (T = 8 C) (derate 13.6 mw/ C above 8 C).8 W Thermal Resistance (junction to ground paddle) 73 C/W Storage Temperature -6 to + C Operating Temperature -4 to +8 C ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Outline Drawing NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF.mm PER SIDE. 4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF.mm PER SIDE.. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. Package Information Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] H44 HMC44ST8 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] H44 HMC44ST8E RoHS-compliant Low Stress Injection Molded Plastic % matte Sn MSL1 XXXX [1] Max peak refl ow temperature of 23 C [2] Max peak refl ow temperature of 26 C [3] 4-Digit lot number XXXX Phone: 78--3343 Fax: 78--3373 Order On-line at www.hittite.com Application Support: Phone: 78--3343 or apps@hittite.com -

Pin Descriptions Pin Number Function Description Interface Schematic 1 RFIN 3 RFOUT This pin is AC coupled. Off chip matching components are required. See Application Circuit herein. RF output and DC Bias input for the output amplifier stage. Off chip matching components are required. See Application Circuit herein. 2,4 GND These pins & package bottom must be connected to RF/DC ground. MHz Application Circuit, Compact Layout This circuit was used to specify the performance for 84-6 MHz operation. This circuit will satisfy many applications from 7 to MHz. Contact the HMC Applications Group for assistance in optimizing performance for your application. Impedance TL1 Ohm Physical Length. Electrical Length 2. PCB Material: mil Rogers 43, Er = 3.48 Recommended Component Values L1, L2 1 nh L3 36 nh R1.1 Ohms C1 8 pf C2 22 pf C3 2.7 pf C4, C6 pf C 2.2 μf - 16 Phone: 78--3343 Fax: 78--3373 Order On-line at www.hittite.com Application Support: Phone: 78--3343 or apps@hittite.com

MHz Evaluation PCB List of Materials for Evaluation PCB 77 [1] Item J1 - J2 J3 -J4 C1 C2 C3 Description PCB Mount SMA Connector DC Pins 8 pf Capacitor, 42 Pkg. 22 pf Capacitor, 42 Pkg. 2.7 pf Capacitor, 42 Pkg. C4, C6 pf Capacitor, 42 Pkg. C 2.2 μf Capacitor, Tantalum L1, L2 1 nh Inductor, 42 Pkg. L3 R1 U1 PCB [2] 36 nh Inductor, 42 Pkg..1 Ohms HMC44ST8 / HMC44ST8E Linear Amp 773 Evaluation PCB, mils [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 43, Er = 3.48 The circuit board used in this application should use RF circuit design techniques. Signal lines should have Ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation board should be mounted to an appropriate heat sink. The evaluation circuit board shown is available from Hittite upon request. Phone: 78--3343 Fax: 78--3373 Order On-line at www.hittite.com Application Support: Phone: 78--3343 or apps@hittite.com - 17

16 & 214 MHz Application Circuit This circuit was used to specify the performance for 18- and -2 MHz operation. This circuit will satisfy many applications from 17 to MHz. Contact the HMC Applications Group for assistance in optimizing performance for your application. TL1 TL2 T3 TL4 Impedance Ohm Ohm Ohm Ohm Physical Length.32..7.17 Electrical Length 34 11 8 18. PCB Material: mil Rogers 43, Er = 3.48 Recommended Component Values L1 8.2 nh C1 1 pf C2 1.2 pf C3 3 pf C4 pf C 2.2 μf - 18 Phone: 78--3343 Fax: 78--3373 Order On-line at www.hittite.com Application Support: Phone: 78--3343 or apps@hittite.com

16 & 214 MHz Evaluation PCB List of Materials for Evaluation PCB 774 [1] Item J1 - J2 J3 - J4 C1 C2 C3 C4 C L1 U1 PCB [2] Description PCB Mount SMA Connector DC Pins 1. pf Capacitor, 42 Pkg. 1.2 pf Capacitor, 42 Pkg. 3. pf Capacitor, 42 Pkg. pf Capacitor, 42 Pkg. 2.2 μf Capacitor, Tantalum 8.2 nh Inductor, 42 Pkg. HMC44ST8 / HMC44ST8E 7747 Evaluation PCB, mils [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 43, Er = 3.48 The circuit board used in this application should use RF circuit design techniques. Signal lines should have Ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation board should be mounted to an appropriate heat sink. The evaluation circuit board shown is available from Hittite upon request. Phone: 78--3343 Fax: 78--3373 Order On-line at www.hittite.com Application Support: Phone: 78--3343 or apps@hittite.com - 1

Alternative MHz Application Circuit, Optimal OIP3 Layout This alternate application circuit for MHz applications features a resonating I/O structure on the PCB that, while using more PCB area, will improve output IP3 from +4 dbm to +42 dbm. This circuit will satisfy many applications from 7 to MHz as the typical performance below demonstrates. Contact the HMC Applications Group for assistance in optimizing performance for your application. TL1 TL2 TL3 Impedance Ohm Ohm Ohm Physical Length.3..3 Electrical Length 18 2. 27 PCB Material: mil Rogers 43, Er = 3.48 Broadband Gain & Return Loss RESPONSE (db) - - S21 S11 S22 Recommended Component Values L1 C1 18 nh 4 pf C2, C6 pf C3 C4 C Output IP3 & P1dB IP3 (dbm), P1dB (dbm) 4 4 3 3 IP3 P1dB 3 pf pf 2.2 μf -.4..6.7.8. 1 1.1 1.2 1.3 1.4.7.8. 1 1.1 1.2 - Phone: 78--3343 Fax: 78--3373 Order On-line at www.hittite.com Application Support: Phone: 78--3343 or apps@hittite.com

Alternate MHz Evaluation PCB List of Materials Item Description J1 - J2 PCB Mount SMA Connector J3 - J4 DC Pins C1 4 pf Capacitor, 42 Pkg. C2, C6 pf Capacitor, 42 Pkg. C3 3. pf Capacitor, 42 Pkg. C4 pf Capacitor, 42 Pkg L1 18 nh Inductor, 42 Pkg. U1 HMC44ST8 / HMC44ST8E PCB* 77 Evaluation PCB, mils * Circuit Board Material: Rogers 43, Er = 3.48 The circuit board used in this application should use RF circuit design techniques. Signal lines should have Ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation board should be mounted to an appropriate heat sink. The evaluation circuit board shown is available from Hittite upon request. Phone: 78--3343 Fax: 78--3373 Order On-line at www.hittite.com Application Support: Phone: 78--3343 or apps@hittite.com - 1