Photodiode arrays with amplifiers

Similar documents
Photodiode arrays with amplifiers

Photodiode arrays with amplifier

Photodiode arrays with amplifiers

Photodiode arrays with amplifiers

Photodiode arrays with ampli er

CMOS linear image sensor

Photo IC diode. Wide operating temperature: -40 to +105 C. S MT. Absolute maximum ratings

CMOS linear image sensor

Energy saving sensors for TV brightness controls, etc.

CMOS linear image sensors

CMOS linear image sensor

CMOS linear image sensors

CMOS linear image sensors

Compact SMD type high output LED

InGaAs PIN photodiodes

High power LED, peak emission wavelength: 1.45 µm

InGaAs PIN photodiodes

InGaAs PIN photodiodes

InGaAs PIN photodiodes

InAs photovoltaic detectors

Photo IC diodes S SB S CT. Spectral response close to human eye sensitivity. Absolute maximum ratings (Ta=25 C)

Si photodiodes with preamp

InAs photovoltaic detectors

Si photodiodes with preamp

01 12-bit digital output

Applications S S S S 1024

CCD linear image sensor

MEMS-FPI spectrum sensor

Radiation detection modules

CCD linear image sensor

TDI-CCD area image sensor

Applications KMPDC0019EA. S3923 series: a=25 µm, b=20 µm Absolute maximum ratings Parameter Symbol Value

CCD image sensors. Improved etaloning characteristics, High-speed type and low noise type available. S11071/S series

5 W XENON FLASH LAMP MODULES

Mini-spectrometers. TM series. High sensitivity type (integrated with backthinned type CCD image sensor) C10082CA/C10083CA series

S3922/S3923 series. NMOS linear image sensor. Voltage output type with current-integration readout circuit and impedance conversion circuit.

CCD image sensors. Improved etaloning characteristics, High-speed type and low noise type available. S11071/S series

XENON FLASH LAMP MODULES

Applications. active pixels [mm (H) mm(v)] S9979 Non-cooled

Enhanced near infrared sensitivity: QE=40% (λ=1000 nm)

LCOS-SLM (Liquid Crystal on Silicon - Spatial Light Modulator)

CCD area image sensor

Near infrared/proximity type sensor

Photosensor with front-end IC

CCD area image sensors

CCD area image sensors

Digital Cameras for Microscopy

Photodiode Detector with Signal Amplification XB8816R Series

CCD image sensor. High-speed operation, back-thinned FFT-CCD. S9037/S9038 series. Structure

CCD linear image sensors

CMOS linear image sensor

Linear X-Ray Photodiode Detector Array with Signal Amplification

Applications. Number of total pixels. Number of active pixels

Applications. General ratings Parameter S S S

CCD image sensors. Enhanced near infrared sensitivity, Constant element temperature control. S11511 series. Applications.

PHOTOMULTIPLIER TUBE MODULES, NEW RELEASED PAMPHLET

CCD linear image sensors

CCD area image sensor

CCD area image sensor

CCD area image sensor

GATED MICROCHANNEL PLATE PHOTOMULTIPLIER TUBES (MCP-PMT) R5916U-50 SERIES

TECHNICAL INFORMATION. How to Use UVTRON

Technical note EM-CCD CAMERA. 1. Introduction

TDI-CCD image sensors

ILX pixel CCD Linear Image Sensor (B/W)

MIRROR QE=0.1 % MIRROR

PMA-12. Photonic multichannel analyzer. Scientific applications. Industrial applications. UV to visible spectroscopy. Fluorescence spectroscopy

ILX526A pixel CCD Linear Image Sensor (B/W)

ILX pixel CCD Linear Image Sensor (B/W)

7926-pixel CCD Linear Image Sensor (B/W) For the availability of this product, please contact the sales office.

CMOS linear image sensor

TSL LINEAR SENSOR ARRAY

Preliminary TCD2704D. Features. Pin Connections (top view) Maximum Ratings (Note 1)

Photo IC for optical link

TSL1406R, TSL1406RS LINEAR SENSOR ARRAY WITH HOLD

Wide range of applications from Real time imaging of low light fluorescence to Ultra low light detection

ILX554B pixel CCD Linear Sensor (B/W) for Single 5V Power Supply Bar-code Reader

Electron Multiplying CCD Camera. series

Pixel. Pixel 3. The LUMENOLOGY Company Texas Advanced Optoelectronic Solutions Inc. 800 Jupiter Road, Suite 205 Plano, TX (972)

functional block diagram (each section pin numbers apply to section 1)

Quantum Cascade Laser

Multiply faster R. 70 frames/s frames/s. Electron Multiplying CCD Camera

ams AG TAOS Inc. is now The technical content of this TAOS datasheet is still valid. Contact information:

Input aperture size (mm) Supply voltage Features Conversion dynode ± 1.

GP1U26X/GP1U27X Series GP1U28X/GP1U28Y Series

TOSHIBA CCD Linear Image Sensor CCD (charge coupled device) TCD2561D

Block Diagram GND. amplifier 5 GND G R B

S-8604BWI LINEAR IMAGE SENSOR IC FOR CONTACT IMAGE SENSOR. Rev.1.1_10

CCD47-10 NIMO Back Illuminated Compact Pack High Performance CCD Sensor

S-8604BWI LINEAR IMAGE SENSOR IC FOR CONTACT IMAGE SENSOR

TSL201R LF 64 1 LINEAR SENSOR ARRAY

Contact Image Sensor (CIS) Module

Cadmium-free sensor with spectral response The Through-hole Type for easy implementation as a CdS cell replacement

TECHNICAL INFORMATION. Characteristics and use of back-thinned TDI-CCD

TOSHIBA CCD LINEAR IMAGE SENSOR CCD(Charge Coupled Device) TCD1208AP

TOSHIBA CCD LINEAR IMAGE SENSOR CCD(Charge Coupled Device) TCD1205DG

S-8603 AWI. Rev.1.0_20 LINEAR IMAGE SENCER IC FOR CONTACT IMAGE SENSOR. Circuit diagram

TSL1401R LF LINEAR SENSOR ARRAY WITH HOLD

TSL1401R LF LINEAR SENSOR ARRAY WITH HOLD

CCD42-10 Back Illuminated High Performance AIMO CCD Sensor

Transcription:

S865-64/-28/-256 S866-64-02/-28-02 Photodiode arrays combined with signal processing IC The S865/S866 series are Si photodiode arrays combined with a signal processing IC chip. X-ray tolerance has been improved compared to the previous products (S8865/S8866 series). The signal processing IC chip is formed by CMOS process and incorporates a timing generator, shift register, charge amplifier array, clamp circuit and hold circuit, making the external circuit configuration simple. A long, narrow image sensor can also be configured by arranging multiple arrays in a row. For X- ray detection applications, types with phosphor sheet affixed on the photosensitive area are also available. As the dedicated driver circuit, the C98 series (sold separately) is provided (this circuit does not support the S865-256). Features Data rate: MHz max. Element pitch: 5 types available S865-64: 0.8 mm pitch 64 ch S865-28: 0.4 mm pitch 28 ch S865-256: 0.2 mm pitch 256 ch S866-64-02:.6 mm pitch 64 ch S866-28-02: 0.8 mm pitch 28 ch 5 V power supply operation Simultaneous integration by using a charge amplifier array Sequential readout with a shift register Low dark current due to zero-bias photodiode operation Integrated clamp circuit allows low noise and wide dynamic range Integrated timing generator allows operation at two different pulse timings Types with phosphor sheet affixed on the photosensitive area are available for X-ray detection (S865-64G/-28G/-256G, S866-64G-02/-28G-02) Applications Long and narrow line sensors Line sensors for X-ray detection Structure Parameter Symbol* S865-64 S865-28 S865-256 S866-64-02 S866-28-02 Unit Element pitch P 0.8 0.4 0.2.6 0.8 mm Element width W 0.7 0.3 0..5 0.7 mm Element height H 0.8 0.6 0.3.6 0.8 mm Number of elements - 64 28 256 64 28 - Effective photosensitive area length - 5.2 5.2 5.2 02.4 02.4 mm Board material - Glass epoxy - *: Refer to following figure. Enlarged drawing of photosensitive area H W Photodiode P KMPDC0072EA www.hamamatsu.com

S865-64/-28/-256, S866-64-02/-28-02 Absolute maximum ratings (Ta=25 C, unless otherwise noted) Parameter Symbol Value Unit Supply voltage -0.3 to +6 V Reference voltage -0.3 to +6 V Photodiode voltage -0.3 to +6 V Gain selection terminal voltage -0.3 to +6 V Master/slave selection voltage Vms -0.3 to +6 V Clock pulse voltage V() -0.3 to +6 V Reset pulse voltage V() -0.3 to +6 V External start pulse voltage V(EXTSP) -0.3 to +6 V Operating temperature* 2 Topr -5 to +60 C Storage temperature* 2 Tstg -0 to +70 C *2: No dew condensation When there is a temperature difference between a product and the surrounding area in high humidity environment, dew condensation may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and reliability. Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings. Recommended terminal voltage (Ta=25 C) Parameter Symbol Min. Typ. Max. Unit Supply voltage 4.75 5 5.25 V Reference voltage 4 4.5 4.6 V Photodiode voltage - - V High gain - 0.25 + 0.25 V Gain selection terminal voltage Low gain 0-0.4 V Master/slave selection voltage High level*3-0.25 + 0.25 V Vms Low level* 4 0-0.4 V Clock pulse voltage High level 3.3 + 0.25 V V() Low level 0-0.4 V Reset pulse voltage High level 3.3 + 0.25 V V() Low level 0-0.4 V External start pulse voltage High level - 0.25 + 0.25 V V(EXTSP) Low level 0-0.4 V *3: Parallel *4: Serial at 2nd or later stages Electrical characteristics [Ta=25 C, =5 V, V()=V()=5 V] Parameter Symbol Min. Typ. Max. Unit Clock pulse frequency* 5 f() 40-4000 khz S865-64, S866-64-02 - - 4678 Line rate* 6 S865-28, S866-28-02 LR - - 7568 lines/s S865-256 - - 3844 Output impedance Zo - 3 - kω S865-64, S866-64-02-6 - Current consumption S865-28, S866-28-02 I - 30 - ma S865-256 - 60 - High gain - 0.5 - Charge amp feedback capacitance Cf Low gain - - pf *5: Video data rate is /4 of clock pulse frequency f(). *6: The values depend on the clock pulse frequency. 2

S865-64/-28/-256, S866-64-02/-28-02 Electrical and optical characteristics [Ta=25 C, =5 V, V()=V()=5 V, =5 V (High gain), 0 V (Low gain)] S865-64/-28/-256 Parameter Symbol S865-64 S865-28 S865-256 Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit Spectral response range λ 200 to 000 200 to 000 200 to 000 nm Peak sensitivity wavelength λp - 720 - - 720 - - 720 - nm Dark output voltage* 7 High gain - 0.0 0.2-0.0 0.2-0.0 0.2 Vd Low gain - 0.005 0. - 0.005 0. - 0.005 0. mv Saturation output voltage Vsat 3.0 3.5-3.0 3.5-3.0 3.5 - V Saturation exposure* 8 High gain - 0.8.0-2.4 3.0-5 9 Esat Low gain -.6 2.0-4.8 6.0-30 37.5 mlx s Photosensitivity High gain 3520 4400-200 500-200 250 - S Low gain 760 2200-600 750-00 25 - V/lx s Photoresponse nonuniformity* 9 PRNU - - ±0 - - ±0 - - ±0 % Noise* 0 High gain -.3 2.0 -.0.5-0.8.2 N Low gain - 0.7. - 0.6 0.9-0.5 0.75 mv rms Output offset voltage* Vo - - - - - - V S866-64-02/-28-02 Parameter Symbol S866-64-02 S866-28-02 Min. Typ. Max. Min. Typ. Max. Unit Spectral response range λ 200 to 000 200 to 000 nm Peak sensitivity wavelength λp - 720 - - 720 - nm Dark output voltage* 7 High gain - 0.0 0.2-0.0 0.2 Vd Low gain - 0.005 0. - 0.005 0. mv Saturation output voltage Vsat 3 3.5-3 3.5 - V Saturation exposure* 8 High gain - 0.2 0.25-0.8.0 Esat Low gain - 0.4 0.5 -.6 2.0 mlx s Photosensitivity High gain 4400 8000-3520 4400 - S Low gain 7200 9000-760 2200 - V/lx s Photoresponse nonuniformity* 9 PRNU - - ±0 - - ±0 % Noise* 0 High gain - 2.0 3.0 -.3 2.0 N Low gain -..7-0.7. mv rms Output offset voltage* Vo - - - - V *7: Integration time Ts= ms *8: Measured with a 2856 K tungsten lamp. *9: Photoresponse nonuniformity (PRNU) is the output nonuniformity that occurs when the photosensitive area is uniformly illuminated by light which is approx. 50% of the saturation level. PRNU is defined as follows: PRNU = X/X 00 [%] X: average output of all elements, X: difference between X and the maximum or minimum output, whichever is larger. *0: Measured with a video data rate of 50 khz and Ts= ms in dark state. *: Video output is negative-going output with respect to the output offset voltage. 3

S865-64/-28/-256, S866-64-02/-28-02 Output waveform of one element Dark state Saturation output voltage Vsat=3.5 V typ. Output offset voltage =4.5 V typ. Trigger V/div. 0 V/div. V typ. Saturation state 00 ns/div. Spectral response (typical example) Silicone resin coating 0.5 (Ta=25 C) 0.5 (Ta=25 C) 0.4 0.4 Photosensitivity (A/W) 0.3 0.2 Photosensitivity (A/W) 0.3 0.2 0. 0. 0 200 300 400 500 600 700 800 900 000 00 200 0 200 300 400 500 600 700 800 900 000 00 200 Wavelength (nm) Wavelength (nm) KMPDB0220EB KMPDB042EA When the fluorescent screen is attached, the spectral response becomes smooth due to the effects of the adhesive resin. 4

S865-64/-28/-256, S866-64-02/-28-02 Output offset voltage vs. ambient temperature (measurement example) 4.505 Dark output voltage vs. ambient temperature (typical example) (Ts= ms) 4.504 4.503 Output offset voltage (V) 4.502 4.50 4.500 4.499 4.498 4.497 Dark output voltage (mv) 0. 0.0 4.496 4.495 0 0 20 30 40 50 60 0.00 0 0 20 30 40 50 60 Ambient temperature ( C) Ambient temperature ( C) KMPDB0288EA KMPDB0289EB 5

S865-64/-28/-256, S866-64-02/-28-02 Block diagram S865-64/-28, S866-64-02/-28-02 EXTSP Vms 4 5 6 7 Timing generator 3 TRIG 2 Shift register 8 EOS 0 Hold circuit 9 Video Charge amp array 2 2 3 4 5 N- N Photodiode array KMPDC053EA S865-256 EXTSP Vms 5, 8 6, 9 7, 20 8, 2 2, 5 Timing generator 4, 7 Trig 3, 6 Shift register 9, 22 EOS, 24 Hold circuit 0, 23 Video 2, 25 Charge amp array, 3 4, 26 2 3 4 5 255 256 Photodiode array KMPDC0506EA 6

S865-64/-28/-256, S866-64-02/-28-02 Timing chart 2 3 6 7 8 9 20 2 22 23 24 25 26 27 28 29 30 2 3 tpw() 8 clocks tpw(2) 8 clocks Integration time Video output period Video 2 3 n- n Trig EOS tf() tr() tpw() t2 t tpw() tpw(2) KMPD tf() tr() KMPDC0289EC Parameter Symbol Min. Typ. Max. Unit Clock pulse width tpw() 250-25000 ns Clock pulse rise/fall times tr(), tf() 0 20 30 ns Reset pulse width tpw() 2 - - Reset pulse width 2 tpw(2) 20 - - Reset pulse rise/fall times tr(), tf() 0 20 30 ns Clock pulse-reset pulse timing t -20 0 20 ns Clock pulse-reset pulse timing 2 t2-20 0 20 ns. The internal timing circuit starts operation at the falling edge of immediately after a pulse goes Low. 2. When the falling edge of each is counted as clock, the video signal of the st channel appears between 8.5 clocks and 20.5 clocks. Subsequent video signals appear every 4 clocks. 3. The trigger pulse for the st channel rises at a timing of 9.5 clocks and then rises every 4 clocks. The rising edge of each trigger pulse is the recommended timing for data acquisition. 4. Signal charge integration time equals the High period of a pulse. However, the charge integration does not start at the rise of a pulse but starts at the 8th clock after the rise of the pulse and ends at the 8th clock after the fall of the pulse. After the pulse next changes from High to Low, signals integrated within this period are sequentially read out as time-series signals by the shift register operation. The rise and fall of a pulse must be synchronized with the rise of a pulse, but the rise of a pulse must be set outside the video output period. One cycle of pulses cannot be set shorter than the time equal to 6.5 + 4 N (number of elements) clocks. 5. The video signal after an EOS signal output becomes a high impedance state, and the video output will be indefinite. 7

S865-64/-28/-256, S866-64-02/-28-02 Dimensional outlines (unit: mm) S865-64/-28 5.2 +0.2-0 P2.54 = 27.94 ( 2) ɸ0.76.27.6 25.0 ± 0. 2 Signal processing IC chip Photosensitive area 2.0 8.0* 2.95 5.0 2.54 5.0 5.6 40.0 Photodiode ch 3.0 ( 4) ɸ2.2.6 Direction of scan Tolerance unless otherwise noted: ±0.2 * Distance from board bottom to photosensitive area center Board: G0 glass epoxy Connector: PRECI-DIP DURTAL 800-0-02-20-000 KMPDA064EG S865-256 5.2-0 +0.2 34.02 P2.54 2 = 30.48 ( 26) 0.64 0.64 2.54 2.28 40.0 ± 0.5 0.0 2.54 2 CMOS CMOS2 25 26 7.0 ( 4) ϕ2.2 Photosensitive area 6.9 6.0 6.6 8.0* 40.0 3.0.6 Photodiode ch Signal processing IC chip Direction of scan Tolerance unless otherwise noted: ±0.2 * Length from board bottom to photosensitive area center Board: G0 glass epoxy Connector: JAE (Japan Aviation Electronics lndustry, Limited) PS-26PE-D4LT-PN KMPDA09EE 8

S865-64/-28/-256, S866-64-02/-28-02 S866-64-02/-28-02 +0.3 02.4-0.27 P2.54 = 27.94 ( 2) ɸ0.76.6 25.0 ± 0. 2 Signal processing IC chip 2.0 2.95 A* 5.0 2.54 5.0.2 80.0 3.0.6 Photodiode ch Photosensitive area (4 ) ɸ2.2 Direction of scan Type no. A S866-64-02 8.2 S866-28-02 8.0 Tolerance unless otherwise noted: ±0.2 * Distance from board bottom to photosensitive area center Board: G0 glass epoxy Connector: PRECI-DIP DURTAL 800-0-02-20-000 KMPDA029EB Pin connections S865-64/-28, S866-64-02/-28-02 Pin no. Symbol Name Note Reset pulse Pulse input 2 Clock pulse Pulse input 3 Trig Trigger pulse Positive-going pulse output 4 EXTSP External start pulse Pulse input 5 Vms Master/slave selection supply voltage Voltage input 6 Supply voltage Voltage input 7 Ground 8 EOS End of scan Negative-going pulse output 9 Video Video output Negative-going output with respect to 0 Reference voltage Voltage input Gain selection terminal voltage Voltage input 2 Photodiode voltage Voltage input S865-256 Pin no. CMOS Pin no. CMOS2 Name Note 4 Photodiode voltage Voltage input 2 5 Reset pulse Pulse input 3 6 Clock pulse Pulse input 4 Trig 7 Trig Trigger pulse Positive-going pulse output 5 EXTSP 8 EXTSP External start pulse Pulse input 6 Vms 9 Vms Master/slave selection voltage Voltage input 7 20 Supply voltage Voltage input 8 2 Ground 9 EOS 22 EOS End of scan Negative-going pulse output 0 Video 23 Video Video output Negative-going output from 24 Reference voltage Voltage input 2 25 Gain selection voltage Voltage input 3 26 Photodiode voltage Voltage input 9

S865-64/-28/-256, S866-64-02/-28-02 Gain selection terminal voltage setting : High gain (Cf=0.5 pf) : Low gain (Cf= pf) Setting for each readout method S865-64/-28, S866-64-02/-28-02 Set to A in the table below in most cases. To serially read out signals from two or more sensors linearly connected, set the st sensor to A and the 2nd or later sensors to B. The and pulses should be shared with each sensor and the video output terminal of each sensor connected together. Connection example (parallel readout) 2 +4.5 V 0 9 Video EOS 8 EOS +5 V 0 µf 0. µf 7 6 5 Vms 4 EXTSP Trig 3 Trig 2 - + Video High impedance amplifier KMPDC0288EB Setting Readout method Vms EXTSP A All stages of parallel readout, serial readout at st sensor B Serial readout at 2nd and later sensors Preceding sensor EOS should be input 0

S865-64/-28/-256, S866-64-02/-28-02 S865-256 Signals of channels through 26 are output from CMOS, while signals of channels 29 through 256 are output from CMOS2. The following two readout methods are available. () Serial readout method CMOS and CMOS2 are connected in serial and the signals of channels through 256 are sequentially read out from one output line. Set CMOS as in A in the table below, and set CMOS2 as in B. CMOS and CMOS2 should be connected to the same and lines, and their video output terminals to one line. (2) Parallel readout method 28 channel signals are output in parallel respectively from the output lines of CMOS and CMOS2. Set both CMOS and CMOS2 as in A in the table below. Connection examples Serial readout method Parallel readout method CMOS CMOS 2 () 2 () 3 () 3 () 4 Trig () Trig () 4 Trig () 5 EXTSP () 5 EXTSP () 6 Vms () 6 Vms () 7 7 8 8 9 EOS () EOS () 9 EOS () 0 Video () Video () 0 Video () 2 2 3 3 CMOS2 4 CMOS2 Trig 5 (2) 4 6 (2) 5 (2) OR Logic IC 74HC32 7 8 Trig (2) EXTSP (2) Trig (2) 6 7 (2) Trig (2) 9 Vms (2) 8 EXTSP (2) 20 9 Vms (2) 2 20 EOS 22 EOS (2) 2 Video 23 Video (2) EOS (2) 22 EOS (2) 24 Video (2) 23 Video (2) 25 24 26 25 KMPDC0222EA 26 KMPDC0223EB Setting Vms EXTSP A B Preceding sensor EOS should be input

S865-64/-28/-256, S866-64-02/-28-02 Readout circuit Check that pulse signals meet the required pulse conditions before supplying them to the input terminals. Video output should be amplified by an operational amplifier that is connected close to the sensor. Precantions () The signal processing IC chip is protected against static electricity. However, in order to prevent possible damage to the IC chip, take electrostatic countermeasures such as grounding yourself, as well as workbench and tools. Also protect the IC chip from surge voltages from peripheral equipment. (2) Gold wires for wire bonding are very thin, so they easily break if subjected to mechanical stress. The signal processing IC chip and wire bonding section are covered with resin for protection. However, never touch these portions. Excessive force, if applied, may break the wires or cause malfunction. Blow air to remove dust or debris if it gets on the protective resin. Never wash them with solvent. Signals may not be obtained if dust or debris is left or a scratch is made on the protective resin, or the signal processing IC chip or photodiode array chip is nicked. (3) The photodiode array characteristics may deteriorate when operated at high humidity, so put it in a hermetically sealed enclosure or case. When installing the photodiode array on a board, be careful not to cause the board to warp. Related information www.hamamatsu.com/sp/ssd/doc_en.html Precautions Disclaimer Image sensors 2

S865-64/-28/-256, S866-64-02/-28-02 Driver circuit C98 series (sold separately) The CMOS driver circuit is designed for S865/S866 series photodiode arrays with amplifier. The C98 series operates a photodiode by just inputting two signals (M- and M-) and a signal +5 V supply. The C98 is intended for single use or parallel connections, while the C98-0 is suitable for cascade connections. Features Single power supply (+5 V) operation Operation with two input signals (M- and M-) Compact: 46 56 5.2 t mm Block diagram S865/ S866 series Trig EOS EXTSP Vms Vg Video Vp CN +Vcc +Vp +Vcc SW - + Controller +Vp VR SW2 - + +Vcc 2 : TOP 2: END - + +Vcc - + +Vcc REF +Vcc CN2 CN3 M- M- TRIGGER L-EOS IN-START GAIN +5 V VIDEO M- M- TRIGGER L-EOS EXTSP2 GAIN +5 V VIDEO C98-0 only KACCC0643EA 3

S865-64/-28/-256, S866-64-02/-28-02 Connection examples Single or parallel readout example (C98) Simultaneous integration/output (effective for high-speed processing) Cascade readout example (C98-0) Simultaneous integration/serial output (Simplifies external processing circuit) S865/ S866 series C98 S865/ S866 series C98-0 CN2 External controller CN2 External controller Scan direction CN3 S865/ S866 series C98 CN2 External controller S865/ S866 series C98-0 CN2 Accessory cable Scan direction CN3 Scan direction S865/ S866 series C98 CN2 External controller KACCC0644EA Scan direction S865/ S866 series C98-0 CN2 CN3 KACCC0645EA Information described in this material is current as of August 206. Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the information contained is believed to be accurate. In rare cases, however, there may be inaccuracies such as text errors. Before using these products, always contact us for the delivery specification sheet to check the latest specifications. The product warranty is valid for one year after delivery and is limited to product repair or replacement for defects discovered and reported to us within that one year period. However, even if within the warranty period we accept absolutely no liability for any loss caused by natural disasters or improper product use. Copying or reprinting the contents described in this material in whole or in part is prohibited without our prior permission. www.hamamatsu.com HAMAMATSU PHOTONICS K.K., Solid State Division 26- Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (8) 53-434-33, Fax: (8) 53-434-584 U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater, N.J. 08807, U.S.A., Telephone: () 908-23-0960, Fax: () 908-23-28 Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 0, D-822 Herrsching am Ammersee, Germany, Telephone: (49) 852-375-0, Fax: (49) 852-265-8 France: Hamamatsu Photonics France S.A.R.L.: 9, Rue du Saule Trapu, Parc du Moulin de Massy, 9882 Massy Cedex, France, Telephone: 33-() 69 53 7 00, Fax: 33-() 69 53 7 0 United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 0 Tewin Road, Welwyn Garden City, Hertfordshire AL7 BW, United Kingdom, Telephone: (44) 707-294888, Fax: (44) 707-325777 North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 6440 Kista, Sweden, Telephone: (46) 8-509-03-00, Fax: (46) 8-509-03-0 Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, int. 6, 20020 Arese (Milano), Italy, Telephone: (39) 02-9358733, Fax: (39) 02-935874 China: Hamamatsu Photonics (China) Co., Ltd.: B20, Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 00020, China, Telephone: (86) 0-6586-6006, Fax: (86) 0-6586-2866 Cat. No. KMPD34E04 Aug. 206 DN 4