Ultra High Precision Z-Foil Flip Chip Resistor with TCR of ± 0.05 ppm/ C, 35 % Space Saving vs. Wraparound Design and PCR of 5 ppm at Rated Power Bottom View INTRODUCTION One of the most important parameters influencing stability is the temperature coefficient of resistance (TCR). Although the TCR of Bulk Metal Foil resistors is considered extremely low, this characteristic has been further refined over the years. The VFCP Series utilizes ultra precision Bulk Metal Z-Foil. The Z-Foil technology provides a significant reduction to the resistive element s sensitivity to ambient temperature variations (TCR) and to self heating when power is applied (power coefficient). Along with the inherently low PCR and TCR, Z-Foil technology also provides remarkably improved load life stablility, low noise and availability of tight tolerance. The flip chip configuration provides a substantial PCB space saving of more than 35 % vs. a surface mount chip with wraparound terminations. The VFCP is available in any value within the specified resistance range. Our application engineering department is available to advise and make recommendations. For non-standard technical requirements and special applications, please contact us. TABLE 1 - TOLERANCE AND TCR VS. VALUE VALUE ( ) TOLERANCE (%) TYPICAL TCR AND MAX. SPREAD (- 55 C to + 125 C, + 25 C Ref.) 250 to 125K ± 0.01 ± 0.2 ± 1.6 FEATURES Temperature coefficient of resistance (TCR): ± 0.05 ppm/ C typical (0 C to + 60 C) ± 0.2 ppm/ C typical (- 55 C to + 125 C, + 25 C ref.) Tolerance: to ± 0.01 % (100 ppm) Power coefficient R due to self heating 5 ppm at rated power Load life stability (70 C for 2000 h): ± 0.005 % (50 ppm) Power rating to: 600 mw at + 70 C Electrostatic discharge (ESD) up to 25 000 V Resistance range: 10 to 125 k (for lower and higher values, please contact us) Foil resistors are not restricted to standard values; specific as required values can be supplied at no extra cost or delivery (e.g. 1K2345 vs. 1K) Non-inductive, non-capacitive design Short time overload 0.005 % (50 ppm) Non hot spot design Rise time: 1 ns effectively no ringing Current noise: - 40 db Voltage coefficient < 0.1 ppm/v Non-inductive: < 0.08 µh Terminal finishes available: lead (Pb)-free, tin/lead alloy Compliant to RoHS directive 2002/95/EC Matched sets are available per request Prototype quantities available in just 5 working days or sooner. For more information, please contact foil@vishaypg.com For better performances please contact us APPLICATIONS Automatic test equipment (ATE) High precision instrumentation Laboratory, industrial and medical Audio EB applications (electron beam scanning and recording equipment, electron microscopes) Military and space Airborne Down hole instrumentation Communication 100 to < 250 ± 0.02 ± 0.2 ± 1.6 50 to < 100 ± 0.05 ± 0.2 ± 1.8 25 to < 50 ± 0.1 ± 0.2 ± 2.8 10 to < 25 ± 0.25 ± 0.2 ± 2.8 * Pb containing terminations are not RoHS compliant, exemptions may apply FIGURE 1 - POWER DERATING CURVE Document Number: 63106 For any questions, contact: foil@vishaypg.com www.foilresistors.com Revision: 25-Mar-10 1 Percent of Rated Power 100 75 50 25-55 C + 70 C 0-75 - 50-25 0 + 25 + 50 + 75 + 100 + 125 + 150 + 175 Ambient Temperature ( C)
FIGURE 2 - TRIMMING TO VALUES (Conceptual Illustration) TABLE 2 - SPECIFICATIONS CHIP SIZE RATED POWER (mw) at + 70 C VOLTAGE RATING ( P R ) Interloop Capacitance Reduction in Series Mutual Inductance Reduction due to Change in Current Direction RANGE ( ) (1) As shown + 0.01 W to allow for measurement errors at low values. Current Path Before Trimming Current Path After Trimming Trimming Process Removes this Material from Shorting Strip Area Changing Current Path and Increasing Resistance : Foil shown in black, etched spaces in white WEIGHT (mg) 0805 100 mw 28 V 10 to 8K 5.2 1206 250 mw 79 V 10 to 25K 10.3 1506 300 mw 95 V 10 to 30K 12 2010 400 mw 167 V 10 to 70K 25 2512 600 mw 220 V 10 to 125K 35 TABLE 4 - PERFORMANCES TEST OR CONDITION MIL-PRF-55342 CHARACTERISTIC E R LIMITS TABLE 3 - LOAD LIFE STABILITY (+ 70 C for 2000 h) CHIP SIZE 0805 1206 1506 2010 2512 TYPICAL R LIMITS R LIMITS ± 0.005 % at 50 mw ± 0.01 % at 100 mw ± 0.005 % at 150 mw ± 0.01 % at 250 mw ± 0.005 % at 150 mw ± 0.01 % at 300 mw ± 0.005 % at 200mW ± 0.01 % at 400 mw ± 0.005 % at 500 mw ± 0.01 % at 600 mw R LIMITS (1) Thermal Shock ± 0.1 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm) Low Temperature Operation ± 0.1 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm) Short Time Overload ± 0.1 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm) High Temperature Exposure ± 0.1 % ± 0.01 % (100 ppm) ± 0.02 % (200 ppm) Resistance to Soldering Heat ± 0.2 % ± 0.005 % (50 ppm) ± 0.015 % (150 ppm) Moisture Resistance ± 0.2 % ± 0.005 % (50 ppm) ± 0.02 % (200 ppm) Load Life Stability + 70 C for 2000 hours at Rated Power ± 0.5 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm) www.foilresistors.com For any questions, contact: foil@vishaypg.com Document Number: 63106 2 Revision: 25-Mar-10
TABLE 5 - DIMENSIONS AND LAND PATTERN in inches (millimeters) s CHIP SIZE BOTTOM VIEW (showing terminals for mounting) W D L Solder Terminals L - 0.005 (0.13) L W W1 [W - 0.003"] THICKNESS D LAND PATTERN Avoid the use of cleaning agents which could attack epoxy resins, which form part of the resistor construction Vacuum pick up is recommended for handling Soldering iron is not applicable Z G X 0805 0.079 (2.01) 0.049 (1.24) 0.025 (0.64) 0.010 (0.25) 0.078 (1.98) 0.053 (1.35) 0.049 (1.24) 1206 0.126 (3.20) 0.062 (1.57) 0.025 (0.64) 0.015 (0.38) 0.125 (3.18) 0.090 (2.29) 0.062 (1.57) 1506 0.150 (3.81) 0.062 (1.57) 0.025 (0.64) 0.012 (0.30) 0.150 (3.81) 0.120 (3.05) 0.062 (1.57) 2010 0.200 (5.08) 0.100 (2.54) 0.025 (0.64) 0.020 (0.51) 0.199 (5.05) 0.153 (3.89) 0.100 (2.54) 2512 0.250 (6.35) 0.126 (3.20) 0.025 (0.64) 0.024 (0.61) 0.250 (6.35) 0.196 (4.98) 0.126 (3.20) FIGURE 3 - CHIP CONFIGURATION High Purity Alumina Substrate Protective Coating Resistive Bulk Metal Foil Solder G Z FIGURE 4 - TYPICAL / TEMPERATURE CURVE (for more details, see table 1) + 500 + 400 + 300 + 200 + 100 ΔR R 0 (ppm) - 100-200 - 300-400 - 500 0.05 ppm/ C - 0.1 ppm/ C 0.1 ppm/ C - 0.16 ppm/ C - 55-25 0 + 25 + 60 + 75 + 100 + 125 The TCR values for < 100 are influenced by the termination composition and result in deviation from this curve X 0.14 ppm/ C 0.2 ppm/ C Ambient Temperature ( C) and TCR Chord Slopes for Differetn Termperature Ranges Document Number: 63106 For any questions, contact: foil@vishaypg.com www.foilresistors.com Revision: 25-Mar-10 3
TABLE 6 - GLOBAL PART NUMBER INFORMATION (1) NEW GLOBAL PART NUMBER: Y163010K0000T9W (preferred part number format) DENOTES PRECISION VALUE CHARACTERISTICS Y (1) For non-standard requests, please contact application engineering. R = K = k 0 = standard 9 = lead (Pb)-free 1 to 999 = custom Y 1 6 3 0 1 0 K 0 0 0 0 T 9 W PRODUCT CODE TOLERANCE PACKAGING 1629 = VFCP0805 1630 = VFCP1206 1631 = VFCP1506 1632 = VFCP2010 1633 = VFCP2512 FOR EXAMPLE: ABOVE GLOBAL ORDER Y1630 10K0000 T 9 W: TYPE: VFCP1206 VALUE: 10.0 k ABSOLUTE TOLERANCE: ± 0.01 % TERMINATION: lead (Pb)-free PACKAGING: waffle pack T = ± 0.01 % Q = ± 0.02 % A = ± 0.05 % B = ± 0.10 % C = ± 0.25 % D = ± 0.50 % F = ± 1.00 % HISTORICAL PART NUMBER: VFCP1206 10K000 TCR0.2 T S W (will continue to be used) R = tape and reel W = waffle pack VFCP1206 10K000 TCR0.2 T S W MODEL OHMIC VALUE TCR VFCP0805 VFCP1206 VFCP1506 VFCP2010 VFCP2512 TOLERANCE 10.0 k Characteristic T = ± 0.01 % Q = ± 0.02 % A = ± 0.05 % B = ± 0.10 % C = ± 0.25 % D = ± 0.50 % F = ± 1.00 % TERMINATION S = lead (Pb)-free B = tin/lead PACKAGING T = tape and reel W = waffle pack www.foilresistors.com For any questions, contact: foil@vishaypg.com Document Number: 63106 4 Revision: 25-Mar-10
Legal Disclaimer Notice Vishay Precision Group Disclaimer All product specifications and data are subject to change without notice. Vishay Precision Group, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay Precision Group ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay Precision Group disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay Precision Group s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay Precision Group. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay Precision Group products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay Precision Group for any damages arising or resulting from such use or sale. Please contact authorized Vishay Precision Group personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 63999 www.vishaypg.com Revision: 22-Feb-10 1