Automotive N-Channel 6 V (D-S) 75 C MOSFET TO-263 7-Lead D S FEATURES TrenchFET power MOSFET Package with low thermal resistance % R g and UIS tested AEC-Q qualified Material categorization: for definitions of compliance please see /doc?9992 Top View G D PRODUCT SUMMARY V DS (V) 6 R DS(on) (Ω) at V GS = V.2 I D (A) 2 Configuration Single Package TO-263-7L G N-Channel MOSFET S ABSOLUTE MAXIMUM RATINGS (T C = 25 C, unless otherwise noted) PARAMETER SYMBOL LIMIT UNIT Drain-source voltage V DS 6 Gate-source voltage V GS ± 2 V Continuous drain current a T C = 25 C 2 I D T C = 25 C 2 Continuous source current (diode conduction) a I S 2 A Pulsed drain current b I DM 24 Single pulse avalanche current I AS 75 L =. mh Single pulse avalanche energy E AS 28 mj Maximum power dissipation b T C = 25 C 375 P D T C = 25 C 25 W Operating junction and storage temperature range T J, T stg -55 to +75 C THERMAL RESISTANCE RATINGS PARAMETER SYMBOL LIMIT UNIT Junction-to-ambient PCB mount c R thja 4 Junction-to-case (drain) R thjc.4 C/W Notes a. Package limited b. Pulse test; pulse width 3 μs, duty cycle 2 % c. When mounted on " square PCB (FR4 material) S7-937-Rev. B, 9-Jun-7 Document Number: 74738 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9
SPECIFICATIONS (T C = 25 C, unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Static Drain-source breakdown voltage V DS V GS = V, I D = 25 μa 6 - - Gate-source threshold voltage V GS(th) V DS = V GS, I D = 25 μa 2.5 3. 3.5 V Gate-source leakage I GSS V DS = V, V GS = ± 2 V - - ± na Zero gate voltage drain current I DSS V GS = V V DS = 6 V, T J = 25 C - - 5 V GS = V V DS = 6 V - - μa V GS = V V DS = 6 V, T J = 75 C - - 25 μa On-state drain current a I D(on) V GS = V V DS 5 V - - A V GS = V I D = 3 A -.63.2 Drain-source on-state resistance a R DS(on) V GS = V I D = 3 A, T J = 25 C - -.3 Ω V GS = V I D = 3 A, T J = 75 C - -.36 Forward transconductance b g fs V DS = 5 V, I D = 3 A - 42 - S Dynamic b Input capacitance C iss - 9 9 Output capacitance C oss V GS = V V DS = 25 V, f = MHz - 355 47 pf Reverse transfer capacitance C rss - 6 22 Total gate charge c Q g - 23 85 Gate-source charge c Q gs V GS = V V DS = 3 V, I D = 5 A - 4 - nc Gate-drain charge c Q gd - 9 - Gate resistance R g f = MHz 4 8.6 3 Ω Turn-on delay time c t d(on) - 48 75 Rise time c t r V DD = 3 V, R L =.6 Ω - 26 4 Turn-off delay time c t d(off) I D 5 A, V GEN = V, R g = Ω - 5 6 ns Fall time c t f - 25 4 Source-Drain Diode Ratings and Characteristics b Pulsed current a I SM - - 24 A Forward voltage V SD I F = 5 A, V GS = V -.84.5 V Body diode reverse recovery time t rr - 2 ns Body diode reverse recovery charge Q rr - 243 5 nc I F = 25 A, di/dt = A/μs Reverse recovery fall time t a - 48 - ns Reverse recovery rise time t b - 53 - Body diode peak reverse recovery current I RM(REC) - -4.6 - A Notes a. Pulse test; pulse width 3 μs, duty cycle 2 % b. Guaranteed by design, not subject to production testing c. Independent of operating temperature Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. S7-937-Rev. B, 9-Jun-7 2 Document Number: 74738 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9
TYPICAL CHARACTERISTICS (T A = 25 C, unless otherwise noted) 5 V GS = V thru 5 V 2 8 9 6 3 6 4 2 T C = 25 C V GS = 4 V 2 4 6 8 V DS - Drain-to-Source Voltage (V) T C = 25 C T C =-55 C 2 4 6 8 V GS - Gate-to-Source Voltage (V) Output Characteristics Transfer Characteristics 2.5 g fs - Transconductance (S) 6 2 8 4 T C = 25 C T C =-55 C T C = 25 C R DS(on) - On-Resistance (Ω).4.3.2. V GS = V 6 2 8 24 3 Transconductance. 2 4 6 8 2 On-Resistance vs. Drain Current C - Capacitance (pf) 8 6 4 2 C rss C oss C iss V GS - Gate-to-Source Voltage (V) 8 6 4 2 I D = 5 A V DS = 3 V 2 24 36 48 6 V DS - Drain-to-Source Voltage (V) 3 6 9 2 5 Q g - Total Gate Charge (nc) Capacitance Gate Charge S7-937-Rev. B, 9-Jun-7 3 Document Number: 74738 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9
TYPICAL CHARACTERISTICS (T A = 25 C, unless otherwise noted) 2. R DS(on) - On-Resistance (Normalized).7.4..8 I D = 3 A V GS = V.5-5 -25 25 5 75 25 5 75 T J - Junction Temperature ( C) I S - Source Current (A)... T J = 5 C T J = 25 C.2.4.6.8..2 V SD - Source-to-Drain Voltage (V) On-Resistance vs. Junction Temperature Source Drain Diode Forward Voltage..65 R DS(on) - On-Resistance (Ω).8.6.4.2 T J = 25 C T J = 5 C V GS(th) Variance (V).2 -.25 -.7 -.5 I D = 5 ma I D = 25 μa. 2 4 6 8 V GS - Gate-to-Source Voltage (V) -.6-5 -25 25 5 75 25 5 75 T J - Temperature ( C) On-Resistance vs. Gate-to-Source Voltage Threshold Voltage 75 V DS - Drain-to-Source Voltage (V) 73 7 69 67 I D = ma 65-5 -25 25 5 75 25 5 75 T J - Junction Temperature ( C) Drain Source Breakdown vs. Junction Temperature S7-937-Rev. B, 9-Jun-7 4 Document Number: 74738 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9
THERMAL RATINGS (T A = 25 C, unless otherwise noted) I DM Limited μs I D Limited Limited by R DS(on) * ms ms ms, s, s, DC. T C = 25 C Single Pulse BVDSS Limited... V DS -Drain-to-Source Voltage (V) * V GS > minimum V GS at which R DS(on) is specified Safe Operating Area Normalized Effective Transient Thermal Impedance.... -4-3 -2 - Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Ambient S7-937-Rev. B, 9-Jun-7 5 Document Number: 74738 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9
THERMAL RATINGS (T A = 25 C, unless otherwise noted) 2 Normalized Effective Transient Thermal Impedance. Duty Cycle =.5.2..5.2 Single Pulse. -4-3 -2 - Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Case Note The characteristics shown in the two graphs - Normalized Transient Thermal Impedance Junction-to-Ambient (25 C) - Normalized Transient Thermal Impedance Junction-to-Case (25 C) are given for general guidelines only to enable the user to get a ball park indication of part capabilities. The data are extracted from single pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part mounted on printed circuit board - FR4, size " x " x.62", double sided with 2 oz. copper, % on both sides. The part capabilities can widely vary depending on actual application parameters and operating conditions maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package / tape drawings, part marking, and reliability data, see /ppg?74738. S7-937-Rev. B, 9-Jun-7 6 Document Number: 74738 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9
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