STD12N65M2. N-channel 650 V, 0.42 Ω typ., 8 A MDmesh M2 Power MOSFET in a DPAK package. Features. Applications. Description DPAK (TO-252)

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Transcription:

N-channel 650 V, 0.42 Ω typ., 8 A MDmesh M2 Power MOSFET in a DPAK package Datasheet - production data Features Order code V DS R DS(on)max. I D 650 V 0.5 Ω 8 A DPAK (TO-252) Extremely low gate charge Excellent output capacitance (C OSS ) profile 100% avalanche tested Zener-protected Figure 1: Internal schematic diagram Applications Switching applications Description This device is an N-channel Power MOSFET developed using MDmesh M2 technology. Thanks to its strip layout and an improved vertical structure, the device exhibits low on-resistance and optimized switching characteristics, rendering it suitable for the most demanding high efficiency converters. Table 1: Device summary Order code Marking Package Packing 12N65M2 DPAK Tape and reel February 2015 DocID027317 Rev 2 1/16 This is information on a product in full production. www.st.com

Contents Contents 1 Electrical ratings... 3 2 Electrical characteristics... 4 2.1 Electrical characteristics (curves)... 6 3 Test circuits... 8 4 Package information... 9 4.1 DPAK (TO-252) type A package information... 10 4.2 DPAK (TO-252) packing information... 13 5 Revision history... 15 2/16 DocID027317 Rev 2

Electrical ratings 1 Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit V GS Gate-source voltage ± 25 V I D Drain current (continuous) at T C = 25 C 8 A I D Drain current (continuous) at T C = 100 C 5 A I DM (1) Drain current (pulsed) 32 A P TOT Total dissipation at T C = 25 C 85 W dv/dt (2) Peak diode recovery voltage slope 15 V/ns dv/dt (3) MOSFET dv/dt ruggedness 50 V/ns T stg T j Storage temperature Operating junction temperature Notes: (1) Pulse width limited by safe operating area. (2) ISD 8 A, di/dt 400 A/µs; V DS peak < V (BR)DSS, V DD = 400 V. (3) VDS 520 V - 55 to 150 C Table 3: Thermal data Symbol Parameter Value Unit R thj-case Thermal resistance junction-case max 1.47 C/W R thj-pcb Thermal resistance junction-pcb max (1) 50 C/W Notes: (1) When mounted on 1 inch² FR-4, 2 Oz copper board. Table 4: Avalanche characteristics Symbol Parameter Value Unit I AR Avalanche current, repetetive or not repetetive (pulse width limited by T jmax) 1.6 A E AS Single pulse avalanche energy (starting T j = 25 C, I D = I AR; V DD = 50 V) 250 mj DocID027317 Rev 2 3/16

Electrical characteristics 2 Electrical characteristics T C = 25 C unless otherwise specified Table 5: On/off states Symbol Parameter Test conditions Min. Typ. Max. Unit V (BR)DSS I DSS Drain-source breakdown voltage Zero gate voltage drain current V GS = 0 V, I D = 1 ma 650 V V GS= 0 V, V DS = 650 V 1 µa V GS = 0 V, V GSDS = 650 V T C = 125 C 100 µa I GSS Gate-body leakage current V DS = 0 V, V GS = ±25 V ±10 µa V GS(th) Gate threshold voltage V DS = V GS, I D = 250 µa 2 3 4 V R DS(on) Static drain-source onresistance V GS = 10 V, I D = 4 A 0.42 0.5 Ω Table 6: Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit C iss Input capacitance - 535 - pf C oss Output capacitance V GS = 0 V, V DS= 100 V, - 25 - pf f = 1 MHz Reverse transfer C rss - 1.1 - pf capacitance C oss eq. (1) Equivalent output capacitance V GS = 0 V, V DS = 0 to 520 V - 144 - pf R G Intrinsic gate resistance f = 1 MHz, open drain - 7 - Ω Q g Total gate charge V DD = 520 V, I D = 8 A, - 16.5 - nc Q gs Gate-source charge V GS = 10 V (see Figure 15: - 2.6 - nc Q gd Gate-drain charge "Gate charge test circuit") - 8.5 - nc Notes: (1) Coss eq. is defined as a constant equivalent capacitance giving the same charging time as C oss when V DS increases from 0 to 80% V DSS 4/16 DocID027317 Rev 2

Table 7: Switching times Electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit Turn-on - 9 - ns delay time V DD = 325 V, I D = 4 A, R G = 4.7 Ω, V GS = 10 V t r Rise time (see Figure 14: "Switching times test circuit - 7 - ns Turn-offdelay time time waveform") - 34 - for resistive load" and Figure 19: "Switching ns t d(on) t d(off) t f Fall time - 13.5 - ns Table 8: Source drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit I SD I SDM (1) V SD (2) t rr Q rr I RRM t rr Q rr I RRM Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current Notes: (1) Pulse width is limited by safe operating area (2) Pulsed: pulse duration = 300 µs, duty cycle 1.5% - 8 A - 32 A V GS = 0 V, I SD = 8 A - 1.6 V I SD = 8 A, di/dt = 100 A/µs, V DD = 60 V (see Figure 16: " Test circuit for inductive load switching and diode recovery times") I SD = 8 A, di/dt = 100 A/µs, V DD = 60 V, T j = 150 C (see Figure 16: " Test circuit for inductive load switching and diode recovery times") - 313 ns - 2.7 µc - 17 A - 462 ns - 4.1 µc - 17.5 A DocID027317 Rev 2 5/16

Electrical characteristics 2.1 Electrical characteristics (curves) ID (A) Figure 2: Safe operating area GIPD161220141753M T Figure 3: Thermal impedance 10 1 Operation in this area is Limited by max RDS(on) 10µs 100µs 1ms 10ms 0.1 Tj=150 C Tc=25 C Single pulse 0.01 0.1 1 10 100 VDS(V) Figure 4: Output characteristics GIPD161220141803MT ID (A) VGS= 7, 8, 9, 10 V 6V 16 Figure 5: Transfer characteristics GIPD161220141809MT ID (A) 16 12 5V 12 VDS = 18 V 8 8 4 4V 4 0 0 5 10 15 20 25 VDS(V) 0 0 2 4 6 8 VGS(V) Figure 6: Normalized gate threshold voltage vs temperature Figure 7: Normalized V (BR)DSS vs. temperature 6/16 DocID027317 Rev 2

Figure 8: Static drain-source on-resistance GIPD161220141813MT RDS(on) (Ω) VGS= 10V Electrical characteristics Figure 9: Normalized on-resistance vs temperature 0.44 0.43 0.42 0.41 0.40 0 2 4 6 8 ID(A) Figure 10: Gate charge vs. gate-source voltage VGS (V) 12 10 8 6 4 2 VDS VDD = 520 V ID = 8 A GIPD161220141820MT VDS(V) 500 400 300 200 100 0 0 0 4 8 12 16 Qg(nC) Figure 11: Capacitance variations C GIPD161220141823MT (pf) 1000 Ciss 100 Coss 10 Crss 1 0.1 0.1 1 10 100 VDS(V) Figure 12: Turn-off switching loss vs drain current GIPD171220141020MT E (µj) 4 Figure 13: Source-drain diode forward characteristic GIPD161220141847MT VSD (V) 1.1 Tj= -50 C 1 3 0.9 Tj= 25 C 2 1 0.8 0.7 0.6 Tj= 150 C 0 0 100 200 300 400 500 600 VDS(V) 0.5 0 2 4 6 8 ISD(A) DocID027317 Rev 2 7/16

Test circuits 3 Test circuits Figure 14: Switching times test circuit for resistive load Figure 15: Gate charge test circuit VDD 12 V 47 k Ω 1 kω 100 nf Vi V GS I G = CONST 100 Ω D.U.T. 2200 μ F 2.7 k Ω VG 47 k Ω PW 1 kω AM01469v1 Figure 16: Test circuit for inductive load switching and diode recovery times Figure 17: Unclamped inductive load test circuit G A D D.U.T. A FAST DIODE A L=100 µh 25Ω S B B B D 3.3 1000 µf µf VDD G D.U.T. RG S AM01470v1 Figure 18: Unclamped inductive waveform V (BR)DSS Figure 19: Switching time waveform t on toff t d(on) t r t d(off) t f V D 90% 90% I DM 10% I D 0 10% V DS V DD V DD V GS 90% AM01472v1 0 10% AM01473v1 8/16 DocID027317 Rev 2

Package information 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. DocID027317 Rev 2 9/16

Package information 4.1 DPAK (TO-252) type A package information Figure 20: DPAK (TO-252) type A package outline 0068772_R 10/16 DocID027317 Rev 2

Package information Table 9: DPAK (TO-252) type A mechanical data mm Dim. Min. Typ. Max. A 2.20 2.40 A1 0.90 1.10 A2 0.03 0.23 b 0.64 0.90 b4 5.20 5.40 c 0.45 0.60 c2 0.48 0.60 D 6.00 6.20 D1 5.10 E 6.40 6.60 E1 4.70 e 2.28 e1 4.40 4.60 H 9.35 10.10 L 1.00 1.50 L1 2.80 L2 0.80 L4 0.60 1.00 R 0.20 V2 0 8 DocID027317 Rev 2 11/16

Package information Figure 21: DPAK (TO-252) type A recommended footprint FP0068772_R All dimensions are in mm 12/16 DocID027317 Rev 2

4.2 DPAK (TO-252) packing information Figure 22: Tape for DPAK (TO-252) Package information DocID027317 Rev 2 13/16

Package information Figure 23: Reel for DPAK (TO-252) Table 10: DPAK (TO-252) tape and reel mechanical data Tape Reel Dim. mm mm Dim. Min. Max. Min. Max. A0 6.8 7 A 330 B0 10.4 10.6 B 1.5 B1 12.1 C 12.8 13.2 D 1.5 1.6 D 20.2 D1 1.5 G 16.4 18.4 E 1.65 1.85 N 50 F 7.4 7.6 T 22.4 K0 2.55 2.75 P0 3.9 4.1 Base qty. 2500 P1 7.9 8.1 Bulk qty. 2500 P2 1.9 2.1 R 40 T 0.25 0.35 W 15.7 16.3 14/16 DocID027317 Rev 2

Revision history 5 Revision history Table 11: Document revision history Date Revision Changes 16-Dec-2014 1 First release. 12-Feb-2015 2 Updated features in cover page. Updated Table 4: "Avalanche characteristics", Table 7: "Switching times", Figure 2: "Safe operating area" and Section 5.1: "DPAK (TO- 252) type A package information". Minor text changes. DocID027317 Rev 2 15/16

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