Description: SM-BGA socket for BGA223 19x15 array 0.5mm pitch 8mm x 10mm x 1.2mm DUT

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Silver Ball Matrix BG Socket Recommended Torque 1.5 in-lb. Features Wide temperature range (-55C to +150C). Current capability is 4 per pin. Over 40GHz bandwidth @-1dB for edge pins. Low and stable contact resistance for reliable production yield. Highly compliant to accommodate wide co-planarity variations. Capacitance under 0.15pF TOP VIEW 8.83 B 1.59 DETIL B SCLE 20 : 1 4.59 SECTION - Description: SM-BG socket for BG223 19x15 array 0.5mm pitch 8mm x 10mm x 1.2mm DUT SM-BG-9058 Drawing STTUS: Released FILE: SM-BG-9058 Dwg SHEET: 1 OF 5 DRWN BY: M. Raske DTE: 12/12/2014 REV. SCLE: 3.5:1

9.00 *Note: BG pattern is not symmetrical with respect to the mounting holes, it is offset 0.25mm 2.1125 * BG pin 1 orientation 1.70±0.10 (x4) NON-PLTED MOUNTING HOLE 0.85±0.025 (x2) NON-PLTED LIGNMENT HOLE 3.8225 1.2825 6.3625 (x4) 0.275 (x223 pad) 6.3625 (x4) Socket Base Outline Description: Recommended PCB Layout Socket Base Outline Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: same or higher than solder mask SM-BG-9058 Drawing STTUS: Released FILE: SM-BG-9058 Dwg SHEET: 2 OF 5 DRWN BY: M. Raske DTE: 12/12/2014 REV. SCLE: 6:1

Y D BG PIN 1 MRKING X ddd C b 0.15 X Y 0.05 e Z 0.08 Z E TOP VIEW 1 BOTTOM VIEW SIDE VIEW Ironwood Package Code: BG223 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per SME Y14.5M-1994. 3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. Description: Compatible BG SM-BG-9058 Drawing STTUS: Released FILE: SM-BG-9058 Dwg DIM MIN NOM MX 1.20 1 0.2 0.25 0.30 D 9.92 10.0 10.08 E 7.92 8.0 8.08 b 0.25 0.30 0.35 e 0.5 BSC RRY 19x15 PIN COUNT 223 SHEET: 3 OF 5 DRWN BY: M. Raske DTE: 12/12/2014 REV. SCLE: 8:1

ITEM NO. Description Material 4 1 SM Socket Base 10mm IC 3mm Thk 0.25mm shift 7075-T6 luminum lloy 2 Socket Lid 7075-T6 luminum lloy 3 Compression Plate for 8.9x9.2mm IC 7075-T6 luminum lloy 2 4 Compression Screw M6x1 Stainless Steel (18-8) 5 #0-80 X.313 LG, SOC HD CP SCREW, LLOY STL, BLK OXIDE lloy Steel 6 #0-80 Shoulder Screw, 0.062" thread length Stainless Steel (303) 3 8 6 7 Test board, daisy chain, for 8x10mm body, 0.5mm, 19x15 array 8 BG test chip, 8x10mm body, 0.5mm, 19x15 array FR4 5 1 9 Dowel Pin, 1/32" x 3/16", SS Chrome Stainless Steel 10 Ball guide BG223 19x15 array 0.5mm pitch 8mm x 10mm DUT Kapton Polyimide/Cirlex 11 IC Guide BG223 19x15 array 0.5mm pitch 8mm x 10mm 1.2mm thick Torlon 4203 12 SM elastomer; BG223 19x15 array 0.5mm pitch 8mm x 10mm DUT SM elastomer 11 9 13 Backing Plate 7075-T6 lumium lloy 14 Insulation Plate FR4 High temp 10 BG pin 1 Socket base pin 1 12.725 12 7 14 12.725 13 Description: SM-BG socket for BG223 19x15 array 0.5mm pitch 8mm x 10mm x 1.2mm DUT SM-BG-9058 Drawing STTUS: Released FILE: SM-BG-9058 Dwg 4X 1.1913 THRU LL 0-80 UNF THRU LL Insulation plate - Backing plate stack-up SHEET: 4 OF 5 DRWN BY: M. Raske DTE: 12/12/2014 REV. SCLE: 3.5:1 4.59

10.6125 9.00 0 10.6125 2.1125 BG PIN 1 ORIENTTION 2.1125 0.3225 0.3225 9.3225 4.7825 4.7825 SM elastomer layout (Top View) Target PCB layout (Top View) 12.725 SOCKET BSE OUTLINE BCKING PLTE OUTLINE Description: SM-BG socket for BG223 19x15 array 0.5mm pitch 8mm x 10mm x 1.2mm DUT Rev Date Initials Description 12/12/14 MR Original SM-BG-9058 Drawing STTUS: Released FILE: SM-BG-9058 Dwg SHEET: 5 OF 5 DRWN BY: M. Raske DTE: 12/12/2014 REV. SCLE: 6:1