EE 330 Lecture 43. Digital Circuits. Other Logic Styles Dynamic Logic Circuits

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EE 330 Lecture 43 Digital Circuits Other Logic Styles Dynamic Logic Circuits

Review from Last Time Elmore Delay Calculations W M 5 V OUT x 20C RE V IN 0 L R L 1 L R R 6 W 1 C C 3 D R t 1 R R t 2 R R t 3 R t 4 t 5 5 V OUT 20C RE V IN C C C R L 5*(5/4)*C RE C RE (½)CRE 1 RE t R C C t2 3RC 25 t R R C 4 t3 5R C C 6 / / / 1 2 RE 4 L RE 5 t t RE 20 5 PROP 5 t = t i=1 i

Review from Last Time Power Dissipation in Logic Circuits Types of Power Dissipation Static Pipe Dynamic Leakage - Gate - Diffusion - Drain

Review from Last Time Dynamic Power Dissipation Energy from for one L-H: H-L output transition sequence is I DD 2 E=CL V DD If f is the average transition rate of the output, determine P VG E P VG= =Ef T R PU R PD V C C L P DYN 2 L DD =fc V If a gate has a transition duty cycle of 50% with a clock frequency of f CL f CL 2 P DYN= CLV 2 DD Note dependent on the square of!. Want to make VDD small!!! Major source of power dissipation in many static CMOS circuits for L min >0.1u

Power Dissipation I DD I DD PUN Conceptual R PU PDN C L R PD C L ll power is dissipated in pull-up and pull-down devices C L dissipates no power but PUN and PDN dissipate power when charging and discharging C L Dynamic power dissipation reduced by more (often much more) than a factor of 2 if minimum sizing strategy is used

Leakage Power Dissipation - Gate with very thin gate oxides, some gate leakage current flows major concern in 60nm and smaller processes actually a type of static power dissipation -Diffusion Leakage across a reverse-biased pn junction Dependent upon total diffusion area May actually be dominant power loss on longerchannel devices ctually a type of static power dissipation -Drain channel current due to small V GS -V T of significant concern only with low processes actually a type of static power dissipation IDIUSION IDIUSION Gate Gate IGLEK IDLEK Long Channel Device Short Channel Device

Example: Determine the dynamic power dissipation in the last stage of a 6-stage CMOS pad driver if used to drive a 10p capacitive load if clocked at 500MHz. ssume pad driver with OD of θ=2.5 and =3.5V In 0.5u proc t RE =20ps, C RE =4f,R PDRE =2.5K 10p Solution: (assume output changes with 50% of clock transitions) f P CL DYN= C V 2 2 L DD 2 =5E8 10p 3.5 61mW Note this solution is independent of the OD and the process

Example: Will the CMOS pad driver actually be able to drive the 10p load at 500MHz in the previous example in the 0.5u process? In 0.5u proc t RE =20ps, C RE =4f,R PDRE =2.5K 10p Solution: 1 t CLK = =2nsec 500MHz t = nθ t = 6 2.5 20psec=0.3nsec PROP RE since t CLK >t PROP, this pad driver can drive the 10p load at 500MHz

Example: Determine the dynamic power dissipation in the next to the last stage of a 6-stage CMOS pad driver if used to drive a 10p capacitive load if clocked at 500MHz. ssume pad driver with OD of θ=2.5 and =3.5V In 0.5u proc t RE =20ps, C RE =4f,R PDRE =2.5K 10p Solution: 5 5 C IN=θCRE=2.5 4f=390f C IN 2 DYN CL L DD P =f C V =5E8 390f 3.5 2.4mW 2

Example: Is the 6-stage CMOS pad driver adequate to drive the 10p capacitive load as fast as possible? ssume pad driver with OD of θ=2.5 and =3.5V In 0.5u proc t RE =20ps, C RE =4f,R PDRE =2.5K 10p Solution: CL 10p nopt ln ln 7.8 CRE 4f No an 8-stage pad driver would drive the load much faster (but is not neede If clocked at only 500MHz)

Example: Determine the power that would be required in the last stage of a CMOS pad driver to drive a 32-bit data bus off-chip if the capacitive load on each line is 2p. ssume the clock speed is 500MHz and that each bit has an average 50% toggle rate. ssume =3.5V In 0.5u proc t RE =20ps, C RE =4f,R PDRE =2.5K Solution: f P CL DYN=32 C V 2 2 L DD 5E8 2 =32 2p 3.5 196mW 2 Note: very large amount of power is required to take a large bus off-chip if bus has a high rate of activity.

Digital Circuit Design Hierarchical Design Basic Logic Gates Properties of Logic amilies Characterization of CMOS Inverter Static CMOS Logic Gates Ratio Logic Propagation Delay Simple analytical models I/OD Logical Effort Elmore Delay Sizing of Gates Propagation Delay with Multiple Levels of Logic Optimal driving of Large Capacitive Loads Power Dissipation in Logic Circuits Other Logic Styles rray Logic Ring Oscillators done partial

Logic Styles Static CMOS Complex Logic Gates Pass Transistor Logic (PTL) Pseudo NMOS Dynamic Logic Domino Zipper

Complex Logic Gates PUN n B PDN p-channel Implement B in PDN Implement B in PUN with complimented input variables Zero static power dissipation V H =, V L =0V (or V SS ) Complimented input variables often required Have implemented the logical function twice (once in PU, again in PD) and this is a major contributor to increased area and dynamic power dissipation n-channel

Pass Transistor Logic B R LG = B Observations about PTL Low device count implementation of non inverting function (can be dramatic) Logic Swing not rail to rail Static power dissipation not 0 when high R LG may be unacceptably large Slow t LH Signal degradation can occur when multiple levels of logic are used Widely used in some applications Implements basic logic function only once!

Pseudo NMOS Logic 1 2 n n could be several hundred or even several thousand

Dynamic Logic PTL reduced complexity of either PUN or PDN to single resistor PTL relaxed requirement of all n-channel or all p-channel devices in PUN/PDN PUN n B PDN What is the biggest contributor to area? PUN (3X active area for inverter, more for NOR gates, and Well) What is biggest contributor to dynamic power dissipation? PUN and is responsible for approximately 75% of the dynamic power dissipation in inverter, more in NOR gates! Can the PUN be eliminated W/O compromising signal levels and power dissipation?

Dynamic Logic PUN n B PDN Can the PUN be eliminated W/O compromising signal levels and power dissipation? Benefits could be most significant!

Dynamic Logic Consider: C D = T CLK Precharges to 1 when is low either stays high if output is to be high or changes to low on evaluatio

Dynamic Logic Consider: C D = B C D = B B = C D B T CLK Termed Dynamic Logic Gates Parasitic capacitors actually replace C D If Logic Block is n-channel, will have rail to rail swings Logic Block is simply a PDN that implements

Dynamic Logic Basic Dynamic Logic Gate n PDN ny of the PDNs used in complex logic gates would work here! Have eliminate the PUN! Ideally will have a factor of 4 or more reduction in C IN Ideally will have a factor of 4 or more reduction in dynamic power dissipation relative to that of equal rise/fall! Ideally will have a factor of 2 reduction in dynamic power dissipation relative to that of minimum size!

rom Wikipedia: Dec 7 2016 In integrated circuit design, dynamic logic (or sometimes clocked logic) is a design methodology in combinatory logic circuits, particularly those implemented in MOS technology. It is distinguished from the so-called static logic by exploiting temporary storage of information in stray and gate capacitances. [1] It was popular in the 1970s and has seen a recent resurgence in the design of high speed digital electronics, particularly computercpus. Dynamic logic circuits are usually faster than static counterparts, and require less surface area, but are more difficult to design. Dynamic logic has a higher toggle rate than static logic [2] but the capacitative loads being toggled are smaller [3] so the overall power consumption of dynamic logic may be higher or lower depending on various tradeoffs. When referring to a particular logic family, the dynamic adjective usually suffices to distinguish the design methodology, e.g. dynamic CMOS [4] or dynamic SOI design. [2] Dynamic logic is distinguished from so-called static logic in that dynamic logic uses a clock signal in its implementation of combinational logic circuits. The usual use of a clock signal is to synchronize transitions in sequential logic circuits. or most implementations of combinational logic, a clock signal is not even needed.

Dynamic Logic Basic Dynamic Logic Gate n PDN dvantages: Lower dynamic power dissipation (Ideally 4X) Improved speed (ideally 4X) Limitations: Output only valid during evaluate state Need to route a clock (and this dissipates some power) Premature Discharge! More complicated Charge storage on internal nodes of PDN No Static hold if output H

Dynamic Logic Premature Discharge Problem If is high, then may go low at the start of the evaluate cycle and there is no way to recover a high output later in the evaluate phase - i.e. there may be a boolean error!. Can not reliably cascade dynamic logic gates!

Dynamic Logic n PDN n PDN Premature Discharge Problem This problem occurs when any inputs to an arbitrary dynamic logic gate create an R PD path in the PDN during at the start of the evaluate phase that is not to pull do How can this problem be fixed? wn later in that evaluate phase Precharging to the low level all inputs to a PDN that may change to the high state later in the evaluate cycle (called domino) lternating gates with n-channel and p-channel pull networks (Zipper Logic)

Dynamic Logic n PDN n PDN Premature Discharge Problem dding an inverter at the output will cause to precharge low so it can serve as input to subsequent gate w/o causing premature discharge Implement instead of Termed Domino Logic in the PDN Some additional dynamic power dissipation in the inverter Some additional delay during the evaluate state in inverter

Domino Logic n PDN

Dynamic Logic n PDN n PUN p-channel logic gate will pre-charge low Phasing of PUN and PDN networks is reversed Some performance loss with p-channel logic devices Direct coupling between alternate type dynamic gates is possible without causing a premature discharge problem

Dynamic Logic n PDN PUN Direct coupling between alternate type dynamic gates

Zipper Logic Map gates to appropriate precharge type

Zipper Logic cceptable Implementation in Zipper

Zipper Logic Unacceptable Implementation in Zipper - Premature discharge at output of 2-input NND

Static Hold Option n PDN n PDN If not clocked, charge on upper node of PDN will drain off causing H output to degrade

Static Hold Option weak p weak p n PDN n PDN weak p will hold charge size may be big (long L) some static power dissipation can use small current source weak p will hold charge size may be big (long L) can eliminate static power with domino sometimes termed keeper

Charge stored on internal nodes of PDN C D 1 2 C P1 3 C P2 If voltage on C P1 and C P2 was 0V on last evaluation, these may drain charge (charge redistribution) on C P if output is to evaluate high (e.g. On last evaluation 1 = 2 = 3 =H, on next evaluation 3 =L, 1 = 2 =H.)

Charge stored on internal nodes of PDN C D 1 1 C D 2 C P1 2 C P1 3 C P2 3 C P2 Can precahrge internal nodes to eliminate undesired charge redistribution

Dynamic Logic Many variants of dynamic logic are around Domino Zipper Ratio-less 2-phase Ratio-less 4-phase Output Prediction Logic ully differential. Benefits disappear, however, when interconnect (and diffusion) capacitances dominate gate capacitances

uture of Dynamic Logic n PDN Domino Zipper Dynamic logic will likely disappear in deep sub-micron processes because interconnect parasitics will dominate gate parasitics

Other types of Logic (list is not complete and some have many sub-types) rom Wikipedia: B BiCMOS C CMOS Cascode Voltage Switch Logic Clocked logic Complementary Pass-transistor Logic Current mode logic Current steering logic D Differential TTL Diode logic Diode transistor logic Domino logic Dynamic logic (digital logic) E Emitter-coupled logic our-phase logic G Gunning Transceiver Logic H HMOS HVDS High-voltage differential signaling I Integrated injection logic L LVDS Low-voltage differential signaling Low-voltage positive emitter-coupled logic M Multi-threshold CMOS N NMOS logic P PMOS logic Philips NORbits Positive emitter-coupled logic R Resistor-transistor logic S Static logic (digital logic) T Transistor transistor logic

End of Lecture 43