FDN335N N-Channel 2.5V Specified PowerTrench TM MOSFET

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N-Channel.5V Specified PowerTrench TM MOSFET General Description This N-Channel.5V specified MOSFET is produced using ON Semiconductor's advanced PowerTrench process that has been especially tailored to minimize the on-state resistance and yet maintain low gate charge for superior switching performance. Applications DC/DC converter Load switch Features.7 A, V. R DS(ON) =.7 Ω @ V GS =.5 V R DS(ON) =. Ω @ V GS =.5 V. Low gate charge (3.5nC typical). High performance trench technology for extremely low R DS(ON). High power and current handling capability. D D S TM SuperSOT -3 G G S Absolute Maximum Ratings T A = 5 C unless otherwise noted Symbol Parameter Ratings Units V DSS Drain-Source Voltage V V GSS Gate-Source Voltage ± V I D Drain Current - Continuous (Note a).7 A - Pulsed P D Power Dissipation for Single Operation (Note a).5 W (Note b).6 T J, T stg Operating and Storage Junction Temperature Range -55 to +5 C Thermal Characteristics R θ JA Thermal Resistance, Junction-to-Ambient (Note a) 5 C/W R θ JC Thermal Resistance, Junction-to-Case (Note ) 75 C/W Package Outlines and Ordering Information Device Marking Device Reel Size Tape Width Quantity 335 7 mm 3 units 999 Semiconductor Components Industries, LLC. October-7, Rev. 3 Publication Order Number: /D

Electrical Characteristics T A = 5 C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BV DSS Drain-Source Breakdown Voltage V GS = V, I D = 5 µa V BVDSS T J Breakdown Voltage Temperature Coefficient I D = 5 µa,referenced to 5 C mv/ C I DSS Zero Gate Voltage Drain Current V DS = 6 V, V GS = V µa I GSSF Gate-Body Leakage Current, V GS = V, V DS = V na Forward I GSSR Gate-Body Leakage Current, Reverse V GS = - V, V DS = V - na On Characteristics (Note ) V GS(th) Gate Threshold Voltage V DS = V GS, I D = 5 µa..9.5 V VGS(th) Gate Threshold Voltage I D = 5 µa,referenced to 5 C -3 mv/ C T J Temperature Coefficient R DS(ON) Static Drain-Source V GS =.5 V, I D =.7 A.55.7 Ω On-Resistance V GS =.5 V, I D =.7 A,T J = 5 C V GS =.5 V, I D =.5 A.79.7.. I D(on) On-State Drain Current V GS =.5 V, V DS = 5 V A g FS Forward Transconductance V DS = 5 V, I D =.5 A 7 S Dynamic Characteristics C iss Input Capacitance V DS = V, V GS = V, 3 pf C oss Output Capacitance f =. MHz pf Reverse Transfer Capacitance pf C rss Switching Characteristics (Note ) t d(on) Turn-On Delay Time V DD = V, I D = A, 5 5 ns t r Turn-On Rise Time V GS =.5 V, R GEN = 6 Ω.5 7 ns t d(off) Turn-Off Delay Time ns t f Turn-Off Fall Time 3 ns Q g Total Gate Charge V DS = V, I D =.7 A, 3.5 5 nc Q gs Gate-Source Charge V GS =.5 V,.55 nc Gate-Drain Charge.95 nc Q gd Drain-Source Diode Characteristics and Maximum Ratings I S Maximum Continuous Drain-Source Diode Forward Current. A V SD Drain-Source Diode Forward Voltage V GS = V, I S =. A (Note ).7. V Notes: : R θja is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R θjc is guaranteed by design while R θca is determined by the user's board design. a) 5 C/W when mounted on a. in Pad of oz. Cu. Scale : on letter size paper : Pulse Test: Pulse Width 3 µs, Duty Cycle.% b) 7 C/W when mounted on a minimum pad.

Typical Characteristics V GS =.5V 3.V.5V 3.5V 6.V.5V R DS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE...6.. V GS =.V.5V 3.V 3.5V.V.5V.5.5.5 3 V DS, DRAIN TO SOURCE VOLTAGE (V). 6 Figure. On-Region Characteristics. Figure. On-Resistance Variation with Drain Current and Gate Voltage. R DS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE.6... I D =.7A V GS =.5V R DS(ON), ON-RESISTANCE (OHM)...6... T A = 5 o C T A = 5 o C I D =.5A.6-5 -5 5 5 75 5 5 T J, JUNCTION TEMPERATURE ( o C) 3 5 V GS, GATE TO SOURCE VOLTAGE (V) Figure 3. On-Resistance Variation with Temperature. Figure. On-Resistance Variation with Gate-to-Source Voltage. V DS = 5V T A = -55 o C 5 o C 5 o C V GS = V 6 I S, REVERSE DRAIN CURRENT (A)... T A = 5 o C 5 o C -55 o C 3 V GS, GATE TO SOURCE VOLTAGE (V)....6... V SD, BODY DIODE FORWARD VOLTAGE (V) Figure 5. Transfer Characteristics. Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature. 3

Typical Characteristics (continued) V GS, GATE-SOURCE VOLTAGE (V) 5 I D =.7A V DS = 5V V 5V 3.5.5.5 3 3.5 Q g, GATE CHARGE (nc) CAPACITANCE (pf) 5 3 C ISS C OSS C RSS 6 V DS, DRAIN TO SOURCE VOLTAGE (V) f = MHz V GS = V Figure 7. Gate Charge Characteristics. Figure. Capacitance Characteristics.. R DS(ON) LIMIT V GS =.5V SINGLE PULSE R θja = 7 o C/W T A = 5 o C ms ms s s DC ms POWER (W) 6 SINGLE PULSE R θja=7 o C/W TA=5 o C.. V DS, DRAIN-SOURCE VOLTAGE (V).... SINGLE PULSE TIME (SEC) Figure 9. Maximum Safe Operating Area. Figure. Single Pulse Maximum Power Dissipation. r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE.5...5...5. D =.5...5.. Single Pulse..... 3 t, TIME (sec) P(pk) R θja (t) = r(t) * R θja R θja = 7 C/W t t T J - T A = P * R θja (t) Duty Cycle, D = t /t Figure. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note b. Transient themal response will change depending on the circuit board design.

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