Typical Applications The is Ideal for: Microwave Radio & VSAT Military Radios, Radar & ECM Features Output Power: dbm Typical Spurious Suppression: > dbc SSB Phase Noise: -148 dbc/hz @ 1 khz Offset Test Instrumentation Single Supply: V@ 91 ma 16 Lead 3x3 mm SMT Package: 9mm² Functional Diagram General Description Electrical Specifications, T A = + C, Vcc = V [1] [1] operation Single-ended The is an active x4 frequency multiplier housed in a 3x3 mm leadless QFN surface mount package. Power output is dbm typical from a single +V supply and varies little vs. input power, temperature and supply voltage. Suppression of undesired fundamental and spurious is dbc typical with respect to output signal level. The low additive SSB phase noise of -148 dbc/hz at 1 khz offset helps the user maintain good system noise performance. The is ideal for use in LO multiplier chains allowing reduced parts count versus traditional approaches. Parameter Min. Typ. Max. Units Frequency Range, Input 1. -. GHz Frequency Range, Output 6-1 GHz Input Power Range 1 dbm Output Power Range dbm Spurious - dbc Input Return Loss 7 db Output Return Loss 1 db SSB Phase Noise (1 khz Offset) Pin = + dbm -148 dbc/hz Supply Current (Icc) 91 ma - 1 Phone: 978--3343 Fax: 978--3373 Phone: Order 781-39-47 On-line at www.hittite.com Application Support: Phone: 978--3343 Application or apps@hittite.com
Output Power vs. Temperature @ dbm Drive Level [1] 4 Output Power vs. Drive Level, T = C [1] 4 OUTPUT POWER (dbm) 3 1-1 +C +8C -4C - 6 7 8 9 1 11 OUTPUT FREQUENCY (GHz) Output Power vs. Supply Voltage @ dbm Drive Level, T = C [1] OUTPUT POWER (dbm) 4 3 1-1 4.7V.V.V - 6 7 8 9 1 11 OUTPUT FREQUENCY (GHz) Input Return Loss vs. Temperature [1] RETURN LOSS (db) - -1 +C +8C -4C OUTPUT POWER (dbm) 3 1-1 dbm dbm 1 dbm - 6 7 8 9 1 11 OUTPUT FREQUENCY (GHz) Spurious Output vs. Fin Pin = + dbm, T = C [1] OUTPUT LEVEL (dbm) 1-1 - -3-4 - -6-7 -8-9 1rst Harmonic nd Harmonic 3rd Harmonic 4th Harmonic th Harmonic 6th Harmonic -1 1.3 1.4 1. 1.6 1.7 1.8 1.9..1..3.4..6.7.8 INPUT FREQUENCY (GHz) Output Return Loss vs. Temperature [1] RETURN LOSS (db) - -1-1 - - +C +8C -4C -1 1. 1.3 1. 1.8....7 3. FREQUENCY (GHz) -3 6 7 8 9 1 11 FREQUENCY (GHz) [1] All data shown is single-ended operation Phone: 978--3343 Fax: 978--3373 Phone: Order 781-39-47 On-line at www.hittite.com Application Support: Phone: 978--3343 Application or apps@hittite.com -
SSB Phase Noise vs. Pin Fout = 8 GHz, T = C [1] Icc vs. Temperature [1] -1 1 SSB PHASE NOISE (dbc/hz) -13 dbm dbm 1 dbm -14-1 -16 1.e+ 1.e+3 1.e+4 1.e+ 1.e+6 1.e+7 OFFSET FREQUENCY (Hz) Absolute Maximum Ratings Reliability Information RF Input (Vcc = +V) + dbm Junction Temperature To Maintain Vcc +6V 1 Million Hour MTTF Storage Temperature -6 to +1 C Nominal Junction Temperature (T = 8 C) ESD Sensitivity (HBM) 1V Thermal Resistance (Junction to GND paddle, V supply) ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS OPERATING CURRENT (ma) +C 9 +8C -4C 9 8 8 4.7 4.8 4.9.1..3 Vcc (V) 1 C 11.4 C 3.4 C/W Operating Temperature -4 C to + 8 C [1] All data shown is single-ended operation - 3 Phone: 978--3343 Fax: 978--3373 Phone: Order 781-39-47 On-line at www.hittite.com Application Support: Phone: 978--3343 Application or apps@hittite.com
Outline Drawing Package Information NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 4. PAD BURR LENGTH SHALL BE.1mm MAXIMUM. PAD BURR HEIGHT SHALL BE.mm MAXIMUM.. PACKAGE WARP SHALL NOT EXCEED.mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN. Part Number Package Body Material Lead Finish MSL Rating Package Marking [1] [] 917 RoHS-compliant Low Stress Injection Molded Plastic 1% matte Sn MSL1 XXXX [1] 4-Digit lot number XXXX [] Max peak reflow temperature of 6 C Phone: 978--3343 Fax: 978--3373 Phone: Order 781-39-47 On-line at www.hittite.com Application Support: Phone: 978--3343 Application or apps@hittite.com - 4
Pin Description Pin Number Function Description Interface Schematic 1, 4-9, 1, 13, 1, 16 GND RFNIN (or GND) These pins and exposed paddle must be connected to RF/DC ground. This pin is AC coupled and matched to ohms, and is 18 out of phase with pin 3 for differential operation. RF/DC ground for single ended operation. 3 RFIN This pin is AC coupled and matched to ohms 1 RFOUT This pin is AC coupled and matched to ohms 11 RFNOUT This pin is AC coupled and matched to ohms, and is 18 out of phase with pin 1 for differential operation. Terminate in ohms for single ended operation. 14 Vcc Supply voltage +V - Phone: 978--3343 Fax: 978--3373 Phone: Order 781-39-47 On-line at www.hittite.com Application Support: Phone: 978--3343 Application or apps@hittite.com
Evaluation PCB List of Materials for Evaluation PCB 18383 [1] Item J1 - J3 Description J4, J DC Pin C1 C C3 U1 PCB [] PCB Mount SMA Connector 1 pf Capacitor, 4 Pkg. 1 pf Capacitor, 4 Pkg. 4.7 µf Capacitor, 4 Pkg. x4 Active Multiplier 187 Eval Board The circuit board used in the application should be generated with proper RF circuit design techniques. Signal lines should have Ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. The evaluation circuit board shown is available from Hittite upon request. [1] Reference this number when ordering complete evaluation PCB [] Circuit Board Material: Rogers 43 Phone: 978--3343 Fax: 978--3373 Phone: Order 781-39-47 On-line at www.hittite.com Application Support: Phone: 978--3343 Application or apps@hittite.com - 6