High Speed Infrared Emitting Diode, 87 nm, GaAlAs Double Hetero Description The series are high efficiency infrared emitting diodes in GaAlAs on GaAlAs technology, molded in a clear, untinted plastic package. In comparison with the standard GaAs on GaAs technology these high intensity emitters feature about 7 % radiant power improvement. Features Extra high radiant power and radiant intensity Suitable for high pulse current operation 94 839 Standard T-¾ ( 5 mm) package Angle of half intensity ϕ = ± 2 Peak wavelength λ p = 875 nm High reliability Good spectral matching to Si photodetectors Lead-free component Component in accordance to RoHS 22/95/EC and WEEE 22/96/EC Applications Infrared remote control and free air transmission systems with high power and long transmission distance requirements in combination with PIN photodiodes or phototransistors. Because of the reduced radiance absorption in glass at the wavelength of 875 nm, this emitter series is also suitable for systems with panes in the transmission range between emitter and detector. Absolute Maximum Ratings Parameter Test condition Symbol Value Unit Reverse Voltage V R 5 V Forward current I F ma Peak Forward Current t p /T =.5, t p = µs I FM 2 ma Surge Forward Current t p = µs I FSM 2.5 A Power Dissipation P V 2 mw Junction Temperature T j C Operating Temperature Range T amb - 55 to + C Storage Temperature Range T stg - 55 to + C Soldering Temperature t 5 sec, 2 mm from case T sd 26 C Thermal Resistance Junction/ Ambient R thja 35 K/W
Electrical Characteristics Parameter Test condition Symbol Min Typ. Max Unit Forward Voltage I F = ma, t p = 2 ms V F.5.8 V Temp. Coefficient of V F I F = ma TK VF -.6 mv/k Reverse Current V R = 5 V I R µa Junction capacitance V R = V, f = MHz, E = C j 2 pf Optical Characteristics Parameter Test condition Symbol Min Typ. Max Unit Temp. Coefficient of φ e I F = 2 ma TKφ e -.7 %/K Angle of Half Intensity ϕ ± 2 deg Peak Wavelength I F = ma λ p 875 nm Spectral Bandwidth I F = ma λ 8 nm Temp. Coefficient of λ p I F = ma TKλ p.2 nm/k Rise Time I F = ma t r 6 ns I F =.5 A t r 3 ns Fall Time I F = ma t f 6 ns I F =.5 A t f 3 ns Virtual Source Diameter 3.7 mm Type Dedicated Characteristics Parameter Test condition Part Symbol Min Typ. Max Unit Forward Voltage I F =.5 A, t p = µs TSHA52 V F 3.2 4.9 V TSHA52 V F 3.2 4.9 V TSHA522 V F 3.2 4.5 V TSHA523 V F 3.2 4.5 V Radiant Intensity I F = ma, t p = 2 ms TSHA52 I e 25 4 25 mw/sr TSHA52 I e 3 5 25 mw/sr TSHA522 I e 36 6 25 mw/sr TSHA523 I e 5 65 25 mw/sr I F =.5 A, t p = µs TSHA52 I e 3 5 mw/sr TSHA52 I e 4 6 mw/sr TSHA522 I e 5 7 mw/sr TSHA523 I e 6 8 mw/sr Radiant Power I F = ma, t p = 2 ms TSHA52 φ e 22 mw TSHA52 φ e 23 mw TSHA522 φ e 24 mw TSHA523 φ e 25 mw 2
Typical Characteristics (Tamb = 25 C unless otherwise specified) 25 4 P - Power Dissipation ( mw ) V 2 5 5 R thja I - Forward Current ( ma ) F 3 2 t p = µs t p /T =. 2 4 6 8 2 3 4 94 7957 T amb - Ambient Temperature ( C ) 94 85 V F - Forward Voltage (V) Figure. Power Dissipation vs. Ambient Temperature Figure 4. Forward Current vs. Forward Voltage 25.2 I Forward Current ( ma) F 75 5 25 V Frel - Relative Forward Voltage...9.8 I F =ma 94 82 e 2 4 6 8 T amb Ambient Temperature ( C ) 94 799.7 2 4 6 8 T amb - Ambient Temperature ( C ) Figure 2. Forward Current vs. Ambient Temperature Figure 5. Relative Forward Voltage vs. Ambient Temperature I F - Forward Current ( A) I FSM = 2.5 A ( Single Pulse ) t p /T=..5..2.5 - -2-2 94 83 t p - Pulse Duration ( ms ) I Radiant Intensity ( mw/sr ) e 94 86 e TSHA 523 TSHA 522 TSHA 52 TSHA 52 2 3 4 I F Forward Current ( ma ) Figure 3. Pulse Forward Current vs. Pulse Duration Figure 6. Radiant Intensity vs. Forward Current 3
- Radiant Power ( mw ) e Φ 94 87. 2 3 4 I F - Forward Current ( ma ) I e rel Relative Radiant Intensity..9.8.7 94 88 e.6.4.2.2.4 2 3 4 5 6 7 8.6 Figure 7. Radiant Power vs. Forward Current Figure. Relative Radiant Intensity vs. Angular Displacement.6.2 I F =2mA I e rel ; Φ e rel.8.4 94 82-5 T amb - Ambient Temperature ( C ) 4 Figure 8. Rel. Radiant Intensity/Power vs. Ambient Temperature.25 Φ e - Relative Radiant Power..75.5.25 I F = ma Φ e (λ ) rel = Φe ( λ )/ Φ e (λ p ) 78 88 94 8 λ - Wavelength ( nm ) 98 Figure 9. Relative Radiant Power vs. Wavelength 4
Package Dimensions in mm 9622 5
Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (987) and its London Amendments (99) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 99 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/54/EEC and 9/69/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use products for any unintended or unauthorized application, the buyer shall indemnify against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-7425 Heilbronn, Germany Telephone: 49 ()73 67 283, Fax number: 49 ()73 67 2423 6