INSULATED GATE BIPOLAR TRANSISTOR. E n-channel

Similar documents
IRGPC40S PD TO-247AC. Features V CES = 600V. V CE(sat) 1.8V. Description. Absolute Maximum Ratings. Thermal Resistance

E n-channel. Parameter Min. Typ. Max. Units

IRGBC30M Short Circuit Rated Fast IGBT

IRGBC20KD2-S PD Short Circuit Rated UltraFast CoPack IGBT INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE

C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm from case )

C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm from case )

PD A IRG4PC60F. Fast Speed IGBT INSULATED GATE BIPOLAR TRANSISTOR. Features. n-channel TO-247AC. 1

IRGPH50FD2 Fast CoPack IGBT

PD IRG4PC30UPbF. UltraFast Speed IGBT INSULATED GATE BIPOLAR TRANSISTOR. Features. n-channel TO-247AC. 1

Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm from case )

C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm from case )

PD IRG4PC40KPbF INSULATED GATE BIPOLAR TRANSISTOR. Features. n-channel TO-247AC

INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE

PD IRG4PC50WPbF. INSULATED GATE BIPOLAR TRANSISTOR Features. n-channel TO-247AC. 1

PD IRG4PC30WPbF. INSULATED GATE BIPOLAR TRANSISTOR Features. n-channel TO-247AC. 1

IRGPC20MD2 Short Circuit Rated Fast CoPack IGBT

Features. n-channel TO-220AB. 1

C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm) from case )

T J Operating Junction and -55 to +150 T STG Storage Temperature Range C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.

Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm) from case )

Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm from case )

Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm from case )

PRELIMINARY. C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm from case )

P C = 100 C Power Dissipation Linear Derating Factor

W T J Operating Junction and -55 to +150 T STG Storage Temperature Range C

IRGMC50F. Fast Speed IGBT INSULATED GATE BIPOLAR TRANSISTOR. n-channel. Features V CES = 600V. V CE(on) max = 1.7V

Absolute Maximum Ratings Parameter Max. Units

33 A I CM. 114 Gate-to-Emitter Voltage. mj P T C =25 Maximum Power Dissipation. Operating Junction and -55 to T STG

IRG4PC40K Short Circuit Rated UltraFast IGBT

IRG4PH30K PD A. Short Circuit Rated UltraFast IGBT INSULATED GATE BIPOLAR TRANSISTOR. n-channel. Features V CES = 1200V. V CE(on) typ. = 3.

C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm) from case )

Features. n-channel TO-247AC. 1

Features. n-channel TO-220AB. 1

n-channel TO-220AB 1

TO-247AC Absolute Maximum Ratings

C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm from case )

n-channel D 2 Pak 1

Maximum Power Dissipation W C

IRG4BH20K-S PD Short Circuit Rated UltraFast IGBT INSULATED GATE BIPOLAR TRANSISTOR. Features V CES = 1200V. V CE(on) typ. = 3.17V.

Features. n-channel TO-247AC. 1

Insulated Gate Bipolar Transistor (Ultrafast Speed IGBT), 100 A

n-channel Features 1 TO-247AD Pulse Collector CurrentÃc 82 I LM

Features. n-channel TO-247AC. 1

C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm) from case )

Features. n-channel TO-247AC. 1

IRG4BC10SD-SPbF IRG4BC10SD-LPbF

IRG4PC50KD PD B INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE. Short Circuit Rated UltraFast IGBT.

IGBT SIP Module (Short Circuit Rated Ultrafast IGBT)

IRG4PC50FD. Fast CoPack IGBT. INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE Features. n-channel V CES = 600V

IRG4IBC10UD INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE. UltraFast Co-Pack IGBT V CES = 600V. Features. V CE(on) typ. = 2.

C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm) from case )

Features TO-264 E. Symbol Description SGL50N60RUFD Units V CES Collector-Emitter Voltage 600 V V GES Gate-Emitter Voltage ± 20 V Collector T

IRG4BC30FD-SPbF. Fast CoPack IGBT. n-channel. Absolute Maximum Ratings Parameter Max. Units INSULATED GATE BIPOLAR TRANSISTOR WITH HYPERFAST DIODE

IRG4BC20SD. Standard Speed IGBT

PRELIMINARY Features Benefits SUPER Absolute Maximum Ratings Parameter Max. Units

GA200TD120U PD D. Ultra-Fast TM Speed IGBT "HALF-BRIDGE" IGBT DUAL INT-A-PAK. Features V CES = 1200V. V CE(on) typ. = 2.3V.

TO-247AC Absolute Maximum Ratings

Insulated Gate Bipolar Transistor Ultralow V CE(on), 250 A

IRG4BC20FPbF Fast Speed IGBT

IRG4BC20KD. Short Circuit Rated UltraFast IGBT V CES = 600V. V CE(on) typ. = 2.27V. Thermal Resistance. GE = 15V, I C = 9.

N Channel Enhancement Mode Silicon Gate

Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm) from case )

C Soldering Temperature, for 10 seconds 300 (1.6mm from case )

IRG7PH28UD1PbF IRG7PH28UD1MPbF

SMPS MOSFET HEXFET Power MOSFET. V DSS R DS(on) max I D. 320 P C = 25 C Power Dissipation 260 Linear Derating Factor.

Watts T J,T STG. CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.

Insulated Gate Bipolar Transistor (Ultrafast IGBT), 90 A

IRGB4086PbF IRGS4086PbF

SMPS MOSFET. V DSS R DS(on) max I D

IRG7R313UPbF. Key Parameters V CE min 330 V V CE(ON) I C = 20A 1.35 V I RP T C = 25 C 160 A T J max 150 C

APT50GT120B2R(G) APT50GT120LR(G)

CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.

TO-220AB low package cost of the TO-220 contribute to its wide acceptance throughout the industry.

Insulated Gate Bipolar Transistor (Ultrafast IGBT), 100 A

SMPS MOSFET. V DSS Rds(on) max I D

Insulated Gate Bipolar Transistor (Trench IGBT), 80 A

IRGB6B60KD IRGS6B60KD IRGSL6B60KD

Insulated Gate Bipolar Transistor (Ultrafast IGBT), 90 A

Description Absolute Maximum Ratings Parameter Max. Units Thermal Resistance Parameter Typ. Max. Units

IRFB260NPbF HEXFET Power MOSFET

Insulated Gate Bipolar Transistor (Trench IGBT), 180 A

IRG4BC20KD-S. Short Circuit Rated UltraFast IGBT INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE. n-channel.

Ultra Fast NPT - IGBT

Insulated Gate Bipolar Transistor (Trench IGBT), 140 A

AUTOMOTIVE MOSFET. I D = 140A Fast Switching

AUTOMOTIVE MOSFET. C Soldering Temperature, for 10 seconds 300 (1.6mm from case )

Insulated Gate Bipolar Transistor Trench PT IGBT, 600 V, 250 A

provide excellent noise immunity, short delay times and simple gate drive. The intrinsic chip gate resistance and capacitance of the APT80GA60LD40

APT50GS60BRDQ2(G) APT50GS60SRDQ2(G)

TYPICAL PERFORMANCE CURVES = 25 C = 110 C = 175 C. Watts T J. = 4mA) = 0V, I C. = 3.2mA, T j = 25 C) = 25 C) = 200A, T j = 15V, I C = 125 C) = 25 C)

Ultra Fast NPT - IGBT

T C =25 unless otherwise specified. Symbol Parameter Value Units V DSS Drain-Source Voltage 40 V

HFP4N65F / HFS4N65F 650V N-Channel MOSFET

"High Side Chopper" IGBT SOT-227 (Trench IGBT), 100 A

SMPS MOSFET. V DSS R DS(on) typ. Trr typ. I D. 500V 0.125Ω 170ns 34A

SMPS MOSFET. V DSS R DS(on) typ. Trr typ. I D. 600V 385mΩ 130ns 15A

l Advanced Process Technology TO-220AB IRF630N

C Soldering Temperature, for 10 seconds 300 (1.6mm from case )

V DSS R DS(on) max I D

V DSS R DS(on) max I D

Transcription:

INSULATED GATE BIPOLAR TRANSISTOR PD - 9.780 UltraFast IGBT Features Switching-loss rating includes all "tail" losses Optimized for high operating frequency (over 5kHz) See Fig. for urrent vs. Frequency curve G V ES = 500V V E(sat) 3.0V E n-channel @V GE = 5V, I = 5A Description Insulated Gate Bipolar Transistors (IGBTs) from International Rectifier have higher usable current densities than comparable bipolar transistors, while at the same time having simpler gate-drive requirements of the familiar power MOSFET. They provide substantial benefits to a host of high-voltage, high-current applications. Absolute Maximum Ratings TO-247A Parameter Max. Units V ES ollector-to-emitter Voltage 500 V I @ T = 25 ontinuous ollector urrent 25 I @ T = 0 ontinuous ollector urrent 5 A I M Pulsed ollector urrent 50 I LM lamped Inductive Load urrent 50 V GE Gate-to-Emitter Voltage ±20 V E ARV Reverse Voltage Avalanche Energy ƒ mj P D @ T = 25 Maximum Power Dissipation 0 W P D @ T = 0 Maximum Power Dissipation 42 T J Operating Junction and -55 to +50 T STG Storage Temperature Range Soldering Temperature, for sec. 300 (0.063 in. (.6mm) from case) Mounting torque, 6-32 or M3 screw. lbf in (.N m) Thermal Resistance Parameter Min. Typ. Max. Units R θj Junction-to-ase ------ ------.2 R θs ase-to-sink, flat, greased surface ------ 0.24 ------ /W R θja Junction-to-Ambient, typical socket mount ------ ------ 40 Wt Weight ------ 6 (0.2) ------ g (oz)

Electrical haracteristics @ T J = 25 (unless otherwise specified) Parameter Min. Typ. Max. Units onditions V (BR)ES ollector-to-emitter Breakdown Voltage 500 ---- ---- V V GE = 0V, I = 250µA V (BR)ES Emitter-to-ollector Breakdown Voltage 20 ---- ---- V V GE = 0V, I =.0A V (BR)ES / T J Temperature oeff. of Breakdown Voltage---- 0.46 ---- V/ V GE = 0V, I =.0mA V E(on) ollector-to-emitter Saturation Voltage ---- 2.3 3.0 I = 5A V GE = 5V ---- 2.8 ---- V I = 25A See Fig. 2, 5 ---- 2.6 ---- I = 5A, T J = 50 V GE(th) Gate Threshold Voltage 3.0 ---- 5.5 V E = V GE, I = 250µA V GE(th) / T J Temperature oeff. of Threshold Voltage ---- - ---- mv/ V E = V GE, I = 250µA g fe Forward Transconductance 2.3 8. ---- S V E = 0V, I = 5A I ES Zero Gate Voltage ollector urrent ---- ---- 250 µa V GE = 0V, V E = 500V ---- ---- 00 V GE = 0V, V E = 500V, T J = 50 I GES Gate-to-Emitter Leakage urrent ---- ---- ±0 na V GE = ±20V Switching haracteristics @ T J = 25 (unless otherwise specified) Parameter Min. Typ. Max. Units onditions Q g Total Gate harge (turn-on) ---- 3 47 I = 5A Q ge Gate - Emitter harge (turn-on) ---- 6.2 9.3 n V = 400V See Fig. 8 Q gc Gate - ollector harge (turn-on) ---- 2 9 V GE = 5V t d(on) Turn-On Delay Time ---- 29 ---- T J = 25 t r Rise Time ---- ---- ns I = 5A, V = 400V t d(off) Turn-Off Delay Time ---- 9 60 V GE = 5V, R G = 23Ω t f Fall Time ---- 66 20 Energy losses include "tail" E on Turn-On Switching Loss ---- 0.24 ---- E off Turn-Off Switching Loss ---- 0.7 ---- mj See Fig. 9,,, 4 E ts Total Switching Loss ---- 0.4 0.6 t d(on) Turn-On Delay Time ---- 3 ---- T J = 50, t r Rise Time ---- 27 ---- ns I = 5A, V = 400V t d(off) Turn-Off Delay Time ---- 30 ---- V GE = 5V, R G = 23Ω t f Fall Time ---- 30 ---- Energy losses include "tail" E ts Total Switching Loss ---- 0.76 ---- mj See Fig., 4 L E Internal Emitter Inductance ---- 3 ---- nh Measured 5mm from package ies Input apacitance ---- 660 ---- V GE = 0V oes Output apacitance ---- ---- pf V = 30V See Fig. 7 res Reverse Transfer apacitance ---- 2 ---- ƒ =.0MHz Notes: Repetitive rating; V GE =20V, pulse width limited by max. junction temperature. ( See fig. 3b ) V =80%(V ES ), V GE =20V, L=µH, R G = 23Ω, ( See fig. 3a ) ƒ Repetitive rating; pulse width limited by maximum junction temperature. Pulse width 80µs; duty factor 0.%. Pulse width 5.0µs, single shot.

LOAD URRENT (A) 40 30 20 Square wave: 60% of rated voltage For both: Duty cycle: 50% T J = 25 T sink = 90 Gate drive as specified Power Dissipation = 24W Triangular wave: lamp voltage: 80% of rated Ideal diodes 0 0. 0 f, Frequency (khz) Fig. - Typical Load urrent vs. Frequency (For square wave, I=I RMS of fundamental; for triangular wave, I=I PK ) 0 00 I, ollector-to-emitter urrent (A) T J = 25 T J = 50 V GE= 5V 20µs PULSE WIDTH V E, ollector-to-emitter Voltage (V) I, ollector-to-emitter urrent (A) 0 T J = 50 T J = 25 V = 0V 5µs PULSE WIDTH 0. 5 5 20 V GE, Gate-to-Emitter Voltage (V) Fig. 2 - Typical Output haracteristics Fig. 3 - Typical Transfer haracteristics

Maximum D ollector urrent (A) 25 20 5 5 V GE = 5V V E, ollector-to-emitter Voltage (V) 4.5 4.0 3.5 3.0 2.5 2.0.5 V GE = 5V 80µs PULSE WIDTH I = 30A I = 5A I = 7.5A 0 25 50 75 0 25 50 T, ase Temperature ( ) Fig. 4 - Maximum ollector urrent vs. ase Temperature.0-60 -40-20 0 20 40 60 80 0 20 40 60 T, ase Temperature ( ) Fig. 5 - ollector-to-emitter Voltage vs. ase Temperature Thermal Response (Z thj ) 0. D = 0.50 0.20 0. 0.05 0.02 0.0 SINGLE PULSE (THERMAL RESPONSE) 2. Peak T J= P DMx Z thj + T 0.0 0.0000 0.000 0.00 0.0 0. t, Rectangular Pulse Duration (sec) Notes:. Duty factor D = t / t 2 P DM t t 2 Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-ase

, apacitance (pf) 400 200 00 800 600 400 200 V GE = 0V, f = MHz ies = ge + gc, ce SHORTED res = gc oes = ce + gc ies oes res V, Gate-to-Emitter Voltage (V) GE 20 6 2 8 4 V E = 400V I = 5A 0 0 V E, ollector-to-emitter Voltage (V) Fig. 7 - Typical apacitance vs. ollector-to-emitter Voltage 0 0 20 30 40 Q, Total Gate harge (n) G Fig. 8 - Typical Gate harge vs. Gate-to-Emitter Voltage Total Switching Losses (mj) 0.48 0.46 0.44 0.42 0.40 V = 400V V GE = 5V T = 25 I = 5A Total Switching Losses (mj) R G = 50 Ω V GE = 5V V = 400V I = 30A I = 5A I = 7.5A 0.38 0 20 30 40 50 60 R G, Gate Resistance ( Ω) W 0. -60-40 -20 0 20 40 60 80 0 20 40 60 T, ase Temperature ( ) Fig. 9 - Typical Switching Losses vs. Gate Resistance Fig. - Typical Switching Losses vs. ase Temperature

Total Switching Losses (mj) 2.0.6.2 0.8 0.4 R G = 23 Ω T = 50 V = 400V V GE = 5V I, ollector-to-emitter urrent (A) 0 V GE = 20V T J = 25 SAFE OPERATING AREA 0.0 0 20 30 40 I, ollector-to-emitter urrent (A) Fig. - Typical Switching Losses vs. ollector-to-emitter urrent A 0 00 V E, ollector-to-emitter Voltage (V) Fig. 2 - Turn-Off SOA * 20.30 (.800) 9.70 (.775) 4.80 (.583) 4.20 (.559) 2.40 (.094) 2.00 (.079) 2X 5.45 (.25) 2X 5.90 (.626) 5.30 (.602) - B - 2 3 3.40 (.33) 3.00 (.8) - A - 3.65 (.43) 3.55 (.40) 0.25 (.0) M 5.50 (.27) 2X - - 4.30 (.70) 3.70 (.45) 5.50 (.27) 4.50 (.77).40 (.056) 3X.00 (.039) 0.25 (.0) M A S D B M - D - 5.30 (.209) 4.70 (.85) 2.50 (.089).50 (.059) 4 0.80 (.03) 3X 0.40 (.06) 2.60 (.2) 2.20 (.087) NOTES: DIMENSIONS & TOLERANING PER ANSI Y4.5M, 982. 2 ONTROLLING DIMENSION : INH. 3 DIMENSIO NS ARE SHOW N MILLIMETERS (INHES). 4 ONFORM S TO JEDE OUTLINE TO-247A. LEAD ASSIGNMENTS - GATE 2 - O LLETO R 3 - EMITTER 4 - O LLETO R * LONGER LEADED (20mm) VERSION AVAILABLE (TO-247AD) TO ORDE R ADD "-E " SUFFIX TO PART NUMBER ONFORMS TO JEDE OUTLINE TO-247A (TO-3P) Dimensions in Millimeters and (Inches)

50V 00V L V * D.U.T. 0-400V 480µF 960V R L = 400V 4 X I @25 * Driver same type as D.U.T.; Vc = 80% of Vce(max) * Note: Due to the 50V power supply, pulse width and inductor will increase to obtain rated Id. Fig. 3a - lamped Inductive Load Test ircuit Fig. 3b - Pulsed ollector urrent Test ircuit I 50V 00V L Driver* D.U.T. V ƒ Fig. 4a - Switching Loss Test ircuit * Driver same type as D.U.T., V = 400V 90% ƒ V 90% % t d(off) Fig. 4b - Switching Loss Waveforms I 5% % t d(on) tr E on t f E off t=5µs E ts = (E on +E off )

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/