NGD8201AN - 20 A, 400 V, N-Channel Ignition IGBT, DPAK

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Transcription:

NGD8201AN - 20 A, 400 V, N-Channel, DPAK Pb Description This Logic Level Insulated Gate Bipolar Transistor (IGBT) features monolithic circuitry integrating ESD and Over Voltage clamped protection for use in inductive coil drivers applications. Primary uses include Ignition, Direct Fuel Injection, or wherever high voltage and high current switching is required. Features Rating Symbol Value Unit Collector Emitter Voltage S 440 V Gate Gate Voltage S 440 V Gate Emitter Voltage ± 15 V Collector Current Continuous @ T C Pulsed 20 Amps, 400 Volts (on) 1.3 V @ = 10 A, 4.5 V Maximum Ratings ( unless otherwise noted) 20 50 A DC A AC Ideal for Coil on Plug and Driver on Coil Applications DPAK Package Offers Smaller Footprint for Increased Board Space Gate Emitter ESD Protection Temperature Compensated Gate Collector Voltage Clamp Limits Stress Applied to Load Integrated ESD Diode Protection New Design Increases Unclamped Inductive Switching (UIS) Energy Per Area Low Threshold Voltage for Interfacing Power Loads to Logic or Microprocessor Devices Low Saturation Voltage High Pulsed Current Capability Emitter Ballasting for Short Circuit Capability These are Pb Free Devices Functional Diagram Continous Gate Current I G 1.0 ma Transient Gate Current (t 2 ms, f 100 Hz) I G 20 ma ESD (Charged Device Model) ESD 2.0 kv ESD (Human Body Model) R = 1500 Ω, C = 100 pf ESD (Machine Model) R = 0 Ω, C = 200 pf Total Power Dissipation @ T C Derate above 25 C ESD 2.0 kv ESD 500 V P D 0.83 W/ C 125 W Additional Information Operating and Storage Temperature Range, T stg 55 to +175 C Datasheet Resources Samples Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

Unclamped Collector To Emitter Avalanche Characteristics Symbol Value Unit Single Pulse Collector to Emitter Avalanche Energy = 50 V, = 5.0 V, P k I L = 16.7 A, R G = 1000 Ω, L = 1.8 mh, Starting 250 = 50 V, = 5.0 V, P k I L = 14.9 A, R G = 1000 Ω, L = 3.0 mh, Starting = 150 C 200 E AS mj = 50 V, = 5.0 V, P k I L = 14.1 A, R G = 1000 Ω, L = 1.8 mh, Starting = 175 C 180 Reverse Avalanche Energy = 100 V, = 20 V, P k I L = 25.8 A, L = 6.0 mh, Starting E AS (R) 2000 mj Thermal Characteristics Symbol Value Unit Thermal Resistance, Junction to Case R θjc 1.3 Thermal Resistance, Junction to Ambient DPAK (Note 1) R θja 95 C/W Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 5 seconds T L 275 C 1. When surface mounted to an FR4 board using the minimum recommended pad size.

Electrical Characteristics - OFF Characteristic Symbol Test Conditions Temperature Min Typ Max Unit Collector Emitter Clamp Voltage B VCES = 2.0 ma = 40 C to 175 C 370 395 420 = 10 ma = 40 C to 175 C 390 415 440 V = 15 V = 0 V 0.1 1.0 Zero Gate Voltage Collector Current ES = 200 V = 0 V 0.5 1.5 10 = 175 C 1.0 25 100* µa = 40 C 0.4 0.8 5.0 30 35 39 Reverse Collector Emitter Clamp Voltage B VCES(R) = -75 ma = 175 C 35 39 45* V = 40 C 30 33 37 0.05 0.2 1.0 Reverse Collector Emitter Leakage Current ES(R) = 24 V = 175 C 1.0 8.5 25 ma = 40 C 0.005 0.025 0.2 Gate Emitter Clamp Voltage BS I G = ± 5.0 ma = 40 C to 175 C 12 12.5 14 V Gate Emitter Leakage Current I GES = ± 5.0 V = 40 C to 175 C 200 300 350* µa Gate Resistor R G _ = 40 C to 175 C 70 Ω Gate Emitter Resistor R GE = 40 C to 175 C 14.25 16 25 kω Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. *Maximum Value of Characteristic across Temperature Range.

Electrical Characteristics - ON (Note 3) Characteristic Symbol Test Conditions Temperature Min Typ Max Unit Gate Threshold Voltage (th) = 1.0 ma, = 1.5 1.8 2.1 = 175 C 0.7 1.0 1.3 = 40 C 1.7 2.0 2.3* V Threshold Temperature Coefficient (Negative) 4.0 4.6 5.2 mv/ C 0.85 1.03 1.35 = 6.5 A, = 3.7 V = 175 C 0.7 0.9 1.15 = 40 C 0.09 1.11 1.4 0.9 1.11 1.45 =9.0 A, = 3.9 V = 175 C 0.8 1.01 1.25 = 40 C 1.0 1.18 1.5 0.85 1.15 1.4 = 7.5 A, = 4.5 V = 175 C 0.7 0.95 1.2 Collector to Emitter On Voltage (on) = 40 C 1.0 1.3 1.6* 1.0 1.3 1.6 V = 10 A, = 4.5 V = 175 C 0.8 1.05 1.4 = 40 C 1.1 1.4 1.7* 1.15 1.45 1.7 = 15 A, = 4.5 V = 175 C 1.0 1.3 1.55 = 40 C 1.25 1.55 1.8* 1.1 1.4 1.9 = 20 A, = 4.5 V = 175 C 1.2 1.5 1.8 = 40 C 1.3 1.42 2.0 Forward Transconductance gfs = 6.0 A, = 5.0 V 10 18 25 Mhos *Maximum Value of Characteristic across Temperature Range. 3. Pulse Test: Pulse Width 300 µs, Duty Cycle 2%.

Dynamic Characteristics Characteristic Symbol Test Conditions Temperature Min Typ Max Unit Input Capacitance C ISS 1100 1300 1500 Output Capacitance C OSS f = 10 khz = -40ºC to = 25 V 175 C 70 80 90 Transfer Capacitance C RSS 18 20 22 pf Switching Characteristics Characteristic Symbol Test Conditions Temperature Min Typ Max Unit 6.0 8.0 10 Turn Off Delay Time (Resistive) t d (off) = 300 V = 9.0 A R G = 1.0 kω R L = 33 Ω = 175 C 6.0 4.0 8.0 6.0 10 8.0 Fall Time (Resistive) t f = 5.0 V = 175 C 8.0 10.5 14 3.0 5.0 7.0 Turn Off Delay Time (Inductive) t d (off) = 300 V = 9.0 A R G = 1.0 kω L = 300 µh = 175 C 5.0 1.5 7.0 3.0 9.0 4.5 Fall Time (Inductive) t f = 5.0 V = 175 C 5.0 7.0 10 µsec 1.0 1.5 2.0 Turn On Delay Time t d (on) = 14 V = 9.0 A R G = 1.0 kω R L = 1.5 Ω = 175 C 1.0 4.0 1.5 6.0 2.0 8.0 Rise Time t r = 5.0 V = 175 C 3.0 5.0 7.0

Typical Electrical Characteristics Figure 1. Self Clamped Inductive Switching Figure 2. Open Secondary Avalanche Current vs. Temperature Figure 3. Collector to Emitter Voltage vs. Junction Temperature Figure 4. Collector Current vs. Collector to Emitter Voltage Figure 5. Collector Current vs. Collector to Emitter Voltage Figure 6. Collector Current vs. Collector to Emitter Voltage

Figure 7. Transfer Characteristics Figure 8. Collector to Emitter Leakage Current vs. Temp Figure 9. Gate Threshold Voltage vs. Temperature Figure 10. Capacitance vs. Collector to Emitter Voltage Figure 11. Resistive Switching Fall Time vs. Temperature Figure 12. Inductive Switching Fall Time vs. Temperature

Figure 13. Minimum Pad Transient Thermal Resistance (Non normalized Junction to Ambient) Figure 14. Best Case Transient Thermal Resistance (Non normalized Junction to Case Mounted on Cold Plate)

Dimensions Soldering Footrpint L3 L4 b2 e E b3 4 12 3 TOP VIEW A D B DETAIL A A NOTE 7 c SIDE VIEW b 0.005 (0.13 ) M C C c2 H L2 GAUGE PLANE BOTTOM VIEW Z H C SEATING PLANE Z BOTTOM VIEW ALTERNATE CONSTRUCTION 5.80 0.228 6.20 0.244 2.58 0.102 3.00 0.118 1.60 0.063 SCALE 3:1 6.17 0.243 mm inches Dim Inches L L1 DETAIL A ROTATED 90 CW Millimeters Min Max Min Max A 0.086 0.094 2.18 2.38 A1 0.000 0.005 0.00 0.13 b 0.025 0.035 0.63 0.89 b2 0.028 0.045 0.72 1.14 b3 0.180 0.215 4.57 5.46 c 0.018 0.024 0.46 0.61 c2 0.018 0.024 0.46 0.61 D 0.235 0.245 5.97 6.22 E 0.250 0.265 6.35 6.73 e 0.090 BSC 2.29 BSC H 0.370 0.410 9.40 10.41 L 0.055 0.070 1.40 1.78 L1 0.114 REF 2.90 REF L2 0.020 BSC 0.51 BSC L3 0.035 0.050 0.89 1.27 L4 0.040 1.01 Z 0.155 3.93 A1 Part Marking System ORDERING INFORMATION Device Package Shipping NGD8201ANT4G 1 Gate AYWW 2 Collector NGD L F 8201AG 8201AN 3 Emitter DPAK (Pb Free) 4 Collector NGD8201A = Device Code A= Assembly Location Y= Year WW = Work Week G e 2,500 / Tape & Reel NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics.