Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 4: Pixel Cross-Sectional Analysis

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Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200 Module 4: Pixel Cross-Sectional Analysis

Nikon NC81369R (CMOS Image Sensor from the Nikon D3200) 2 Some of the information in this report may be covered by patents, mask and/or copyright protection. This report should not be taken as an inducement to infringe on these rights. Chipworks Inc. 2012 all rights reserved. Chipworks and the Chipworks logo are registered trademarks of Chipworks Inc. This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization s corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information. IPR-1205-806-04 23506CYRF Revision 1.0 Published: July 17, 2012

Nikon NC81369R (CMOS Image Sensor from the Nikon D3200) 3 Table of Contents (all Modules) Module 1: Overview Analysis Introduction, Device Summary, Product Teardown, Die Photograph, Die Features Module 2: Die Utilization, Basic Functionality Analysis Annotated Metal 1 Die Photograph, Die Utilization Analysis, Standard Logic Cell Size, SRAM Cell Size Module 3: Planar Pixel Analysis Pixel Design Summary, Pixel Schematic, Pixel Bevel SEM Analysis, Related Horizontal Pixel Dimensions Module 4: Pixel Cross-Sectional Analysis Pixel Process Summary, Pixel Horizontal and Vertical Cross-Sectional SEM Analyses, TEM Analysis of a Pixel Transistor and Gate Oxide, Related Pixel Dimensions Module 5: Substrate Dopant Analysis Pixel Bevel SCM Analysis, Pixel Cross-Sectional SCM Analysis, SRP of Pixel Substrate, SRP and SCM Analyses of Peripheral Substrate Module 6: Peripheral Cross-Sectional and Process Analysis SEM and TEM Analyses of General Structure, Dielectrics, Metals, Vias and Contacts, Column Capacitors, MOS Transistors, Isolation, Results of SEM and TEM-EDS Analyses (BSI Process Features, if present)

Nikon NC81369R (CMOS Image Sensor from the Nikon D3200) 4 Table of Contents Pixel Array Overview Device Identification Analysis Sites Pixel Cross Sections Parallel to Row Select Lines Pixel General Structure Blue and Green Pixels Pixel General Structure Red and Green Pixels Edge Pixels Green Color Filter and Microlens Coating Red Color Filter Blue Color Filter TEM of Green and Blue Filters TEM of Red and Green Filters Minimum Pixel Metal Pitch T3 Gate Length T4 and T5 Gate Lengths TEM Image of Transfer Gate TEM Images of Transfer Gate and Pixel AR Layers Blue and Red/Green Pixel AR Layers Transfer Transistor Gate Dielectric Thickness Pixel Cross Sections Parallel to Column Out Lines Edge Pixels T3 Gate Width T4 Gate Width T5 Gate Width Transfer Gate Width Minimum Width Polysilicon Pixel Transistor Dimensions Pixel Vertical Dimensions Pixel Horizontal Dimensions Statement of Measurement Uncertainty and Scope Variation About Chipworks

Nikon NC81369R (CMOS Image Sensor from the Nikon D3200) 35 About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at 1-613-829-0414. Chipworks 1891 Robertson Road, Suite 500 Ottawa, Ontario K2H 5B7 Canada T 1-613-829-0414 F 1-613-829-0515 Web site: www.chipworks.com Email: info@chipworks.com Please send any feedback to feedback@chipworks.com