Features TO-264 E. Symbol Description SGL40N150D Units V CES Collector-Emitter Voltage 1500 V V GES Gate-Emitter Voltage ± 25 V Collector T

Similar documents
Features. Symbol Description SGH23N60UFD Units V CES Collector-Emitter Voltage 600 V V GES Gate-Emitter Voltage ± 20 V Collector T

Features. Symbol Description SGH15N60RUFD Units V CES Collector-Emitter Voltage 600 V V GES Gate-Emitter Voltage ± 20 V Collector T

Features. Symbol Description FGA25N120AND Units V CES Collector-Emitter Voltage 1200 V V GES Gate-Emitter Voltage ± 20 V Collector T

Features. Symbol Description FGA25N120AN Units V CES Collector-Emitter Voltage 1200 V V GES Gate-Emitter Voltage ± 20 V Collector T

FFPF60B150DS. 120 A 60Hz Single Half-Sine Wave T J, T STG Operating Junction and Storage Temperature - 65 to +150 C

FGPF7N60RUFD 600V, 7A RUF IGBT CO-PAK

FJL6820. Symbol Parameter Typ Max Units R θjc Thermal Resistance, Junction to Case C/W

Features. TO-3P FQA Series

QFET TM FQP13N06. Features G D. TO-220 FQP Series

FJAF6810. h FE2 V CE =5V, I C =6A. Symbol Parameter Typ Max Units R θjc Thermal Resistance, Junction to Case 2.08 C/W

QFET TM FQL40N50. Features. TO-264 FQL Series

Features. (Note 1b) 1.2. (Note 1c) 1.0. (Note 1c) 125

Features. SC70-6 The pinouts are symmetrical; pin 1 and pin 4 are interchangeable. TA=25 o C unless otherwise noted. Symbol Parameter Ratings Units

FJA4310. Symbol Parameter Value Units

Features. TO-220 FQP Series

SOT-23 Mark: 6U / 6T. TA = 25 C unless otherwise noted. Symbol Parameter Value Units


ELECTRICAL CHARACTERISTICS (25 Degrees C Ambient Temperature unless otherwise stated)

FGH40N120AN 1200V NPT IGBT

FJN13003 FJN NPN Silicon Transistor Planar Silicon Transistor

Features. I 2 -PAK FQI Series

Features. TO-220 FQP Series

Data Sheet January Features. Packaging

Features. TO-220F SSS Series

QFET TM FQP20N06. Features G D. TO-220 FQP Series

MUR840, MUR860, RURP840, RURP860

QFET TM FQT4N20L. Features. SOT-223 FQT Series

RURD4120, RURD4120S. Features. 4A, 1200V Ultrafast Diodes. Applications. Ordering Information. Packaging. Symbol. Data Sheet January 2002

NDS0605 P-Channel Enhancement Mode Field Effect Transistor

BUZ71. 14A, 50V, Ohm, N-Channel Power MOSFET. Features. Ordering Information. Symbol. Packaging. Data Sheet December 2001

Features R DS(ON) = V GS = 4.5 V. TA=25 o C unless otherwise noted

Features. TA=25 o C unless otherwise noted. Symbol Parameter Ratings Units. Pulsed 10 Power Dissipation for Single Operation (Note 1a) 2

QFET TM FQA65N20. Features. TO-3P FQA Series

QFET TM FQP85N06. Features G D. TO-220 FQP Series

Features. TO-3P IRFP Series

Features. TA=25 o C unless otherwise noted. (Note 1b) 0.9. (Note 1c) 0.7

Features G D. TO-220 FQP Series

TA = 25 C unless otherwise noted. Symbol Parameter Value Units

ANODE 2 CATHODE ANODE 1

QFET TM FQP13N06L. Features G D. TO-220 FQP Series

SOT-23 Mark: 62V / 62W / 62X. TA = 25 C unless otherwise noted. Symbol Parameter Value Units

Features. TO-3PN IRFP Series

Features S 1. T A=25 o C unless otherwise noted. Symbol Parameter Ratings Units. Pulsed 6 Power Dissipation for Single Operation (Note 1a) 0.

Data Sheet January Features. Packaging. 30 A (T C = 145 o C) Repetitive Peak Surge Current... I FRM

Features. TO-220F IRFS Series

RFP2N20L. 2A, 200V, Ohm, Logic Level, N-Channel Power MOSFET. Features. Ordering Information. Symbol. Packaging. Data Sheet January 2002

Features. TA=25 o C unless otherwise noted

RURG Features. 80A, 1000V Ultrafast Diode. Applications. Ordering Information. Packaging. Symbol. Data Sheet January 2002

FQA11N90C FQA11N90C. 900V N-Channel MOSFET. Absolute Maximum Ratings T C = 25 C unless otherwise noted. Thermal Characteristics.

Features D D. I-PAK FQU Series

RFD4N06L, RFD4N06LSM. 4A, 60V, Ohm, Logic Level, N-Channel Power MOSFETs. Features. Ordering Information. Symbol. Packaging

IRF610. Features. 3.3A, 200V, Ohm, N-Channel Power MOSFET. Ordering Information. Symbol. Packaging. Data Sheet January 2002


Features. TA=25 o C unless otherwise noted

Features S 1. TA=25 o C unless otherwise noted

QFET TM FQP17P10. Features. TO-220 FQP Series

onlinecomponents.com

QFET FQA36P15. Features

FJN965 FJN965. NPN Epitaxial Silicon Transistor

QFET FQE10N20LC. Features. TO-126 FQE Series

FQP3N80C/FQPF3N80C 800V N-Channel MOSFET General Description These N-Channel enhancement mode power field effect transistors are

Features. TO-220F SSS Series

Features. 175 C maximum junction temperature rating. T A =25 o C unless otherwise noted

Features G D. TO-220 FQP Series

QFET TM FQP13N50C/FQPF13N50C

Description. TO-220 FCP Series. Symbol Parameter FDP61N20 Unit. Maximum Lead Temperature for Soldering Purpose, 300 C 1/8 from Case for 5 Seconds

Data Sheet December Features. Packaging

Features. TO-220F FQPF Series

N-Channel Logic Level Enhancement Mode Field Effect Transistor. Features. TA=25 o C unless otherwise noted

QFET TM FQP4N90C/FQPF4N90C

= 25 o C unless other wise noted Symbol Parameter NDS9945 Units V DSS. Drain-Source Voltage 60 V V GSS. Gate-Source Voltage ±20 V I D

Features. TO-220F FQPF Series

QFET TM FQD18N20V2 / FQU18N20V2

Features. TA=25 o C unless otherwise noted

Features. TO-3P FQA Series

IRF630, RF1S630SM. 9A, 200V, Ohm, N-Channel Power MOSFETs. Features. Ordering Information. Symbol. Packaging. Data Sheet January 2002

Features. TO-220F IRFS Series

Features. Reduced r DS(ON) DRAIN GATE

Description. TO-3P FDA Series. Symbol Parameter FDA70N20 Unit. Maximum Lead Temperature for Soldering Purpose, 300 C 1/8 from Case for 5 Seconds

Features S 1. TA=25 o C unless otherwise noted

IRFS650B IRFS650B. 200V N-Channel MOSFET. Absolute Maximum Ratings T C = 25 C unless otherwise noted. Thermal Characteristics. November 2001.

Description. Symbol Parameter FDAF69N25 Unit. (Note 2) Maximum Lead Temperature for Soldering Purpose, 300 C 1/8 from Case for 5 Seconds

FQA8N100C 1000V N-Channel MOSFET

Features G D. TO-220 FQP Series

ISL9R860P2, ISL9R860S2, ISL9R860S3ST

FDH15N50 / FDP15N50 / FDB15N50

Features. I-PAK FQU Series

Features. TO-220F IRFS Series

QFET FQP9N25C/FQPF9N25C

Features. Symbol Parameter Q2 Q1 Units

Features GATE SOURCE. Symbol Parameter Ratings Units V DSS Drain to Source Voltage 400 V V GS Gate to Source Voltage ±30 V Drain Current

Features. I-PAK FQU Series

BAV23S Small Signal Diode

FDN359BN N-Channel Logic Level PowerTrench TM MOSFET

FDMS8690 N-Channel PowerTrench MOSFET

Data Sheet December Features. Packaging. Symbol

Data Sheet August Features. Packaging

FDP75N08A 75V N-Channel MOSFET

Features I-PAK (TO-251AA) TA=25 o C unless otherwise noted

ISL9V2540S3S EcoSPARK TM N-Channel Ignition IGBT 250mJ, 400V Features

Transcription:

SGLN5D September 2 IGBT SGLN5D General Description Fairchild s Insulated Gate Bipolar Transistor (IGBT) provides low conduction and switching losses. SGLN5D is designed for the Induction Heating applications. Features High Speed Switching Low Saturation Voltage : V CE(sat) = 3.7 V @ = A High Input Impedance Built-in Fast Recovery Diode Application Home Appliance, Induction Heater, IH JAR, Micro Wave Oven C G G C E TO-26 E Absolute Maximum Ratings = 25 C unless otherwise noted Symbol Description SGLN5D Units V CES Collector-Emitter Voltage 5 V S Gate-Emitter Voltage ± 25 V Collector Current @ T = 25 C A C Collector Current @ = C 2 A M () Pulsed Collector Current 2 A I F Diode Continuous Forward Current @ = C A I FM Diode Maximum Forward Current A P D Maximum Power Dissipation @ = 25 C 2 W Maximum Power Dissipation @ = C 8 W T J Operating Junction Temperature -55 to +5 C T stg Storage Temperature Range -55 to +5 C T L Maximum Lead Temp. for Soldering Purposes, /8 from Case for 5 Seconds 3 C Notes : () Repetitive rating : Pulse width limited by max. junction temperature Thermal Characteristics Symbol Parameter Typ. Max. Units R θjc (IGBT) Thermal Resistance, Junction-to-Case --.625 C/W R θjc (DIODE) Thermal Resistance, Junction-to-Case --.83 C/W R θja Thermal Resistance, Junction-to-Ambient -- 25 C/W 2 Fairchild Semiconductor International SGLN5D Rev. A

Electrical Characteristics of IGBT = 25 C unless otherwise noted Symbol Parameter Test Conditions Min. Typ. Max. Units Off Characteristics BV CES Collector-Emitter Breakdown Voltage = V, = 25uA 5 -- -- V ES Collector Cut-Off Current V CE = V CES, = V -- -- 25 ua I GES G-E Leakage Current = S, V CE = V -- -- ± na SGLN5D On Characteristics (th) G-E Threshold Voltage = ma, V CE = 3.5 5. 7.5 V V CE(sat) Collector to Emitter Saturation Voltage = A, = 5V -- 3.7.7 V Dynamic Characteristics C ies Input Capacitance -- -- pf V CE = V, = V, C oes Output Capacitance -- 7 -- pf f = MHz C res Reverse Transfer Capacitance -- 3 -- pf Switching Characteristics t d(on) Turn-On Delay Time -- 9 2 ns V CC = 6V, = A, t r Rise Time -- 23 7 ns R G = 5Ω, = 5V, t d(off) Turn-Off Delay Time -- 25 ns Resistive Load, = 25 C t f Fall Time -- 23 ns Q g Total Gate Charge -- 7 nc V CE = 6V, = A, Q ge Gate-Emitter Charge -- 25 25 nc = 5V Q gc Gate-Collector Charge -- 5 6 nc Electrical Characteristics of DIODE = 25 C unless otherwise noted Symbol Parameter Test Conditions Min. Typ. Max. Units V FM Diode Forward Voltage I F = A --.3.8 V t rr Diode Reverse Recovery Time I F = A, di/dt = 2A/us -- 7 3 ns 2 Fairchild Semiconductor International SGLN5D Rev. A

Collector Current, 8 6 2 5V 2V V 2V = 8V Collector Current, 2 8 6 2 = 5V SGLN5D 2 6 8 2 6 8 Fig. Typical Output Characteristics Fig 2. Typical Output Characteristics 6 5 3 2 = 5V = 8A = A = 2A Capacitance [pf] 6 5 3 2 C ies C oes C res =V, f=mhz =25 o C 25 5 75 25 Case Temperature, [ o C] Fig 3. Collector to Emitter Saturation Voltage vs. Case Temperature Fig. Typical Capacitance vs. Collector to Emitter Voltage Collector - Emitter Voltage, V CE 2 6 2 8 2A A 8A 2 6 2 8 2A A 8A = 25 C 8 2 6 2 Gate - Emitter Voltage, 8 2 6 2 Gate - Emitter Voltage, Fig 5. Saturation Voltage vs. Fig 6. Saturation Voltage vs. 2 Fairchild Semiconductor International SGLN5D Rev. A

Switching Time [ns] = ± 5V, R G = 5Ω td(off) Switching Time [ns] = ± 5V, R G = 5Ω td(on) tr SGLN5D 2 3 5 6 7 8 Collector Current, 2 3 5 6 7 8 9 Collector Current, Fig 7. Turn-Off Characteristics vs. Collector Current Fig 8. Turn-On Characteristics vs. Collector Current Switching Loss [ µj] = ± 5V, R G = 5Ω Eon Switching Time [ns] V CC = 6V, = ± 5V = A td(off) 2 3 5 6 7 8 9 Collector Current, Gate Resistance, R G [Ω] Fig 9. Switching Loss vs. Collector Current Fig. Turn-Off Characteristics vs. Gate Resistance Switching Time [ns] V CC = 6V, = ± 5V = A tr td(on) Switching Loss [µj] V CC = 6V, = ± 5V = A Eon Eon Gate Resistance, R G [Ω] Gate Resistance, R G [Ω] Fig. Turn-On Characteristics vs. Gate Resistance Fig 2. Switching Loss vs. Gate Resistance 2 Fairchild Semiconductor International SGLN5D Rev. A

Gate - Emitter Voltage, V GE 2 8 6 2 R L = 5Ω, V CC = 6V Collector Current,. MAX (Pulsed) MAX (Continuous) Single Nonrepetitive Pulse Curves must be derated linearly with increase in temperature DC Operation ms µs 5µs SGLN5D 25 5 75 25 5.. Gate Charge, Qg [nc] Fig 3. Gate Charge Characteristics Fig. SOA Characteristics 5 3 5 27 Reverse Recovery Time, t rr [ns] 35 3 25 2 5 5 IF = A Reverse Recovery Time, t rr [ns] 2 2 8 5 2 9 6 di/dt = 5A/us A/us 2A/us 5 5 2 25 3 di/dt [A/us] 3 2 3 5 6 7 8 9 Forward Current, IF Fig 5. Typical T rr vs. di/dt Fig 6. Typical T rr vs. Forward Current Reverse Current, I R [ua].. = 25 25 Instantaneous Forward Current, I F =25 25 E-3 3. 6. 9..2k.5k Reverse Voltage, V R...6.8..2..6 Instantaneous Voltage, V F Fig 7. Reverse Current vs. Reverse Voltage Fig 8. Typical Forward Voltage Drop vs. Forward Current 2 Fairchild Semiconductor International SGLN5D Rev. A

TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx Bottomless CoolFET CROSSVOLT DOME E 2 CMOS TM EnSigna TM FACT FACT Quiet Series FAST DISCLAIMER LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms FASTr GlobalOptoisolator GTO HiSeC ISOPLANAR MICROWIRE OPTOLOGIC OPTOPLANAR PACMAN POP PowerTrench QFET QS QT Optoelectronics Quiet Series SILENT SWITCHER SMART START SuperSOT -3 SuperSOT -6 SuperSOT -8 SyncFET TinyLogic UHC VCX FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Datasheet Identification Product Status Definition Advance Information Preliminary No Identification Needed Formative or In Design First Production Full Production This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. G