2.5 Amp Output Current IGBT Gate Drive Optocoupler with Rail-to-Rail Output Voltage, High CMR. 1. DESCRIPTION The Photocoupler is ideally suited for driving power IGBTs and MOSFETs used in motor control inverter applications and inverters in power supply system. It contains an AlGaAs LED optically coupled to an integrated circuit with a power output stage. The 2.5A peak output current is capable of directly driving most IGBTs with ratings up to 1200 V/100 A. For IGBTs with higher ratings, the can be used to drive a discrete power stage which drives the IGBT gate. The Photocoupler operational parameters are guaranteed over the temperature range from -40 o C ~ +105 o C. 1.1 Features ±2.5 A maximum peak output current Functional Diagram Rail-to-rail output voltage Propagation delay time : T PHL = 500 ns (max), T PLH = 500 ns (max) NC 1 8 Vcc Under Voltage Lock-Out protection (UVLO) with hysteresis Anode 2 7 Vo 20 kv/us minimum Common Mode Rejection (CMR) at V CM = 1500 V I CC = 3.5 ma maximum supply current Cathode 3 6 Vo Wide operating range: 15to 30 Volts (V CC) Guaranteed performance over temperature -40 o C ~ +105 o C. NC 4 5 Shield GND MSL Level 1 Safety approval: UL/ cul Recognized 5000 V RMS/1 min IEC/EN/DIN EN 60747-5-5 V IORM = 630 Vpeak 1.2 Applications Plasma Display Panel. Truth Table LED High side Low side V O OFF OFF ON Low ON ON OFF High A 0.1µF bypass Capacitor must be connected between Pin 5 and 8. IGBT/MOSFET gate drive Industrial Inverter Induction heating Uninterruptible power supply (UPS) 1/14 Part No. :
2. PACKAGE DIMENSIONS 2.1 LTV-3120 2.2 LTV-3120M 2.3 LTV-3120S Notes : *1. Year date code. *2. 2-digit work week. *3. Factory identification mark (Y : Thailand). Dimensions are in Millimeters and (Inches). 2/14 Part No. :
3. TAPING DIMENSIONS 3.1 LTV-3120S-TA 3.2 LTV-3120S-TA1 Description Symbol Dimension in mm (inch) Tape wide W 16±0.3 (0.63) Pitch of sprocket holes P 0 4±0.1 (0.15) F 7.5±0.1 (0.295) Distance of compartment P 2 2±0.1 (0.079) Distance of compartment to compartment P 1 12±0.1 (0.47) 3.3 Quantities Per Reel Package Type Quantities (pcs) 1000 3/14 Part No. :
4. RATING AND CHARACTERISTICS 4.1 Absolute Maximum Ratings Parameter Symbol Min Max Unit Note Storage Temperature T stg -55 +125 Operating Temperature T opr -40 +105 Output IC Junction Temperature T J 125 o C o C o C Total Output Supply Voltage (V CC V EE) 0 35 V Average Forward Input Current I F 20 ma Reverse Input Voltage V R 5 V Peak Transient Input Current I F(TRAN) 1.0 A 1 High Peak Output Current I OH(PEAK) 2.5 A 2 Low Peak Output Current I OL(PEAK) 2.5 A 2 Input Current (Rise/Fall Time) t r(in)/t f(in) 500 ns 3 Output Voltage V O(PEAK) 35 V Power Dissipation P I 45 mw Output Power Dissipation P O 250 mw Total Power Dissipation P T 295 mw Lead Solder Temperature (10s) T sol 260 o C Note: Ambient temperature = 25 o C, unless otherwise specified. Stresses exceeding the absolute maximum ratings can cause permanent damage to the device. Exposure to absolute maximum ratings for long periods of time can adversely affect reliability. Note: Note: A ceramic capacitor (0.1 µf) should be connected between pin 8 and pin 5 to stabilize the operation of a high gain linear amplifier. Otherwise, this Photocoupler may not switch properly. The bypass capacitor should be placed within 1 cm of each pin. Note 1: Pulse width (PW) 1 µs, 300 pps Note 2: Exponential waveform. Pulse width 0.3 µs, f 15 khz Note 3: The rise and fall times of the input on-current should be less than 500 ns 4.2 Recommended Operating Conditions Parameter Symbol Min Max Unit Operating Temperature T A -40 105 o C Supply Voltage V CC 15 30 V Input Current (ON) I FL(ON) 7 16 ma Input Voltage (OFF) V F(OFF) 0 0.8 V 4/14 Part No. :
4.3 ELECTRICAL OPTICAL CHARACTERISTICS Parameter Symbol Min. Typ. Max. Unit Test Condition Figure Note Input Forward Voltage V F 1.2 1.37 1.8 V I F = 10mA 13 Input Forward Voltage Temperature Coefficient V F/ T -1.237 mv/ O C I F = 10mA Input Reverse Voltage BV R 5 V I R = 10µA Input Input Threshold Current (Low to High) I FLH 1.8 5 ma V CC = 30 V, V O > 5V 6, 7,18 - Input Threshold Voltage (High to Low) V FHL 0.8 V V CC = 30 V, V O < 5V Input Capacitance C IN 33 pf f = 1 MHz, V F = 0 V High Level Supply Current Low Level Supply Current I CCH 2.4 3.5 ma I CCL 2.5 3.5 ma I F = 10 ma, V CC = 30V, V O = Open I F = 0 ma, V CC = 30V, V O = Open 4, 5 High level output current I OH -1.0 V O = (V CC 1.5 V) 1 A 16-2.5 V O = (V CC 4 V) 2 Output Low level output current I OL 1.0 V O = (V EE + 1.5 V) 1 A 17 2.5 V O = (V EE + 4 V) 2 High level output voltage V OH V CC - 0.3 V CC - 0.1 V I F = 10mA, I O = -100mA 1, 2, 14 Low level output voltage V OL V EE + 0.1 V EE + 0.25 V I F = 0mA, I O = 100mA 3, 15 UVLO Threshold V UVLO+ 11.0 12.7 13.5 V V O > 5V, I F = 10 ma V UVLO- 9.5 11.2 12.0 V V O < 5V, I F = 10 ma 19 UVLO Hysteresis UVLO HYS 1.5 V All Typical values at T A = 25 C and V CC V EE = 30 V, unless otherwise specified; all minimum and maximum specifications are at recommended operating condition. (Refer to 4.2) Note 1: Maximum pulse width = 50 µs. Note 2: Maximum pulse width = 10 µs. 5/14 Part No. :
5. SWITCHING SPECIFICATION Parameter Symbol Min. Typ. Max. Unit Test Condition Figure Note Propagation Delay Time to High Output Level t PLH 50 130 500 Propagation Delay Time to t PHL 50 130 500 R g = 10Ω, Low Output Level 8, 9, 10, C g = 25nF, 11, 12, Pulse Width Distortion PWD 5 70 f = 10 khz, 20 ns Duty Cycle = 50% Propagation delay difference I F = 7 to 16 ma, between any two parts or PDD -100 100 3 V CC = 10 to 30V channels V EE = ground Output Rise Time (10 to 90%) Tr 35 20 Output Fall Time (90 to 10%) Tf 35 T A = 25 C, Common mode transient immunity at high level output CM H 20 25 kv/µs I F = 10 to 16 ma, V CM = 1500 V, 1 V CC = 30 V T A = 25 C, 21 Common mode transient immunity at low level output CM L 20 25 kv/µs V F = 0 V, V CM = 1500 V, 2 V CC = 30 V All Typical values at T A = 25 C and V CC V EE = 30 V, unless otherwise specified; all minimum and maximum specifications are at recommended operating condition. (Refer to 4.2) Note 1: CM H is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage in the logic high state (V O > 15 V). Note 2: CM L is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in the logic low state (V O < 1 V). Note 3: The difference between t PHL and t PLH between any two parts series parts under same test conditions. 6/14 Part No. :
6. ISOLATION CHARACTERISTIC Parameter Symbol Min. Typ. Max. Unit Test Condition Note Withstand Insulation Test Voltage V ISO 5000 V RH 40%-60%, t = 1min, T A = 25 o C 1, 2 Input-Output Resistance R I-O 10 12 Ω V I-O = 500V DC 1 Input-Output Capacitance C I-O 0.92 pf f = 1MHz, T A = 25 o C 1 All Typical values at T A = 25 C unless otherwise specified. All minimum and maximum specifications are at recommended operating condition. (Refer to 4.2) Note 1: Device is considered a two terminal device: pins 1, 2, 3 and 4 are shorted together and pins 5, 6, 7 and 8 are shorted together. Note 2: According to UL1577, each Photocoupler is tested by applying an insulation test voltage 6000V RMS for one second (leakage current less than 10uA). This test is performed before the 100% production test for partial discharge 7/14 Part No. :
7. TYPICAL PERFORMANCE CURVES & TEST CIRCUITS Photocoupler V OH -High Output Rail Voltage -V 29.93 29.92 29.91 29.90 29.89 29.88 29.87 29.86 29.85 29.84 I F = 10 ma I out = -100 ma V CC = 30 V V EE = 0 V 29.83-40 -30-20 -10 0 10 20 30 40 50 60 70 80 90 100 110 T A -Temperature - o C V OH -High Output Rail Voltage -V 0.00-0.02-0.04-0.06-0.08-0.10-0.12-0.14-0.16 I F = 10 ma I out = -100 ma V CC = 30 V V EE = 0 V -0.18-40 -30-20 -10 0 10 20 30 40 50 60 70 80 90 100 110 T A -Temperature - o C Figure 1: High output rail voltage vs. Temperature Figure 2: V OH vs. Temperature 0.12 4 V OL -Output Low Voltage -V 0.1 0.08 0.06 0.04 V F (OFF) = 0 V 0.02 I out = 100 ma V CC = 15 to 30 V V EE = 0 V 0-40 -30-20 -10 0 10 20 30 40 50 60 70 80 90 100 110 T A -Temperature - o C I CC -Supply Current -ma 3.5 3 2.5 2 1.5 1 I F = 10 ma for I CCH 0.5 V F = 0V for I CCL V CC = 30 V I CCH V EE = 0 V I CCL 0-40 -30-20 -10 0 10 20 30 40 50 60 70 80 90 100 110 T A -Tamperature - o C Figure 3: V OL vs. Temperature Figure 4: I CC vs. Temperature I CC -Supply Current -ma 3 2.5 2 1.5 1 I F = 10 ma for I CCH 0.5 V F = 0V for I CCL T A = 25 o C I CCH V EE = 0 V I CCL 0 15 20 25 30 V CC -Supply Voltage -V V O -Output Voltage -V 34 29 24 19 14 9 4-1 T A = 25 o C V CC = 30 V V EE = 0V I FLH ON I FLH OFF 0 0.5 1 1.5 2 2.5 3 3.5 IFLH -Low To High Current Threshold -ma Figure 5: I CC vs. V CC Figure 6: I FLH Hysteresis 8/14 Part No. :
V O -Output Voltage -V 4 3.5 3 2.5 2 1.5 1 0.5 T A = 25 o C V CC = 30 V V EE = 0V I FLH ON I FLH OFF 0-40 -30-20 -10 0 10 20 30 40 50 60 70 80 90 100 110 I FLH -Low To High Current Threshold -ma T P -Propagation Delay -ns 150 140 130 120 110 100 90 I 80 F = 10 ma T A = 25 o C 70 R g = 10 Ω, C g = 25 nf Duty Cycle = 50% T PLH 60 f = 20kHz T PHL 50 15 20 25 30 V CC -Supply Voltage -V Figure 7: I FLH vs. Temperature Figure 8: Propagation Delays vs. V CC T P -Propagation Delay -ns 160 150 140 130 120 110 100 90 80 V CC = 30V, V EE = 0V T A = 25 o C R g = 10 Ω, C g = 25 nf Duty Cycle = 50% f = 20kHz 7 8 9 10 11 12 13 14 15 16 I F -Forward LED Cureent -ma T PLH T PHL T P -Propagation Delay -ns 180 170 160 150 140 130 120 110 100 90 I F = 10mA V 80 CC = 30V, V EE = 0V R g = 10Ω, C g = 25nF 70 T Duty Cycle = 50% PLH 60 f = 20kHz T PHL 50-40 -30-20 -10 0 10 20 30 40 50 60 70 80 90 100 110 T A -Temperature- o C Figure 9: Propagation Delays vs. I F Figure 10: Propagation Delays vs. Temperature T P -Propagation Delay -ns 150 140 130 120 110 100 90 80 I F = 10 ma, T A = 25 o C V CC = 30 V, V EE = 0 V 70 C g = 25 nf Duty Cycle = 50% T PLH 60 f = 20kHz T PHL 50 10 15 20 25 30 35 40 45 50 R g -Series Load Resistance -Ω T P -Propagation Delay -ns 150 145 140 135 130 125 120 115 I F = 10 ma, T A = 25 o C V CC = 30 V, V EE = 0 V 110 R g = 10 Ω T Duty Cycle = 50% PLH 105 f = 20kHz T PHL 100 10 15 20 25 30 35 40 45 50 C g -Series Load Capacitance -nf Figure 11: Propagation Delays vs. R g Figure 12: Propagation Delays vs. C g 9/14 Part No. :
60 50 I F -Forward Current -ma 40 30 20 10 0 1.4 1.45 1.5 1.55 1.6 V F -Forward Voltage -V Figure 13: Input Current vs. Forward Voltage Figure 14 : VOH Test Circuit Figure 15 : VOL Test Circuit Figure 16 : IOH Test Circuit Figure 17 : IOL Test Circuit 10/14 Part No. :
0.1uF I F V O>5V + - VCC=10V = 15V to to 30V Figure 18 : IFLH Test Circuit Figure 19 : UVLO Test Circuit I F =7 to 16mA 0.1uF + - VCC 10 KHz 50% DUTY CYCLE + - 200Ω VO 10Ω 25nF SHIELD Figure 20 : tr, tf, tplh and tphl Test Circuit and Waveforms = Figure 21 : CMR Test Circuit and Waveforms 11/14 Part No. :
8. TEMPERATURE PROFILE OF SOLDERING 8.1 IR Reflow soldering (JEDEC-STD-020C compliant) One time soldering reflow is recommended within the condition of temperature and time profile shown below. Do not solder more than three times. Profile item Conditions Preheat - Temperature Min (T Smin) - Temperature Max (T Smax) - Time (min to max) (ts) 150 C 200 C 90±30 sec Soldering zone - Temperature (T L) - Time (t L) Peak Temperature (T P) Ramp-up rate Ramp-down rate 217 C 60 ~ 100 sec 260 C 3 C / sec max. 3~6 C / sec Ramp-up 20 sec TP 260 C Temperature ( C) Tsmin 150 C TL 217 C Tsmax 200 C 60-100 sec tl (Soldering) Ramp-down 25 C 60 ~ 120 sec ts (Preheat) Time (sec) 12/14 Part No. :
8.2 Wave soldering (JEDEC22A111 compliant) One time soldering is recommended within the condition of temperature. Photocoupler Temperature: 260+0/-5 C Time: 10 sec. Preheat temperature:25 to 140 C Preheat time: 30 to 80 sec. 8.3 Hand soldering by soldering iron Allow single lead soldering in every single process. One time soldering is recommended. Temperature: 380+0/-5 C Time: 3 sec max. 13/14 Part No. :
9. NAMING RULE Photocoupler Part Number Options LTV-3120 LTV-3120M LTV-3120S-TA LTV-3120S-TA1 LTV3120-V LTV3120M-V LTV3120STA-V LTV3120STA1-V Definition of Suffix Remark "3120 LiteOn model name "No Suffix" "M" "S" "TA" "TA1" "V" Dual-in-Line package clearance distance 7 mm typical Wide lead spacing package clearance distance 8 mm typical Surface mounting package clearance distance 8 mm typical Pin 1 location at lower right of the tape Pin 1 location at upper left of the tape VDE approved option 10. Notes: Specifications of the products displayed herein are subject to change without notice. The products shown in this publication are designed for the general use in electronic applications such as office automation equipment, communications devices, audio/visual equipment, electrical instrumentation and application. For equipment/devices where high reliability or safety is required, such as space applications, nuclear power control equipment, medical equipment, etc, please contact our sales representatives. 14/14 Part No. :