Ultrafast Avalanche SMD Rectifier

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Transcription:

Ultrafast Avalanche SMD Rectifier FEATURES Low profile package Ideal for automated placement Glass passivated junction Low reverse current Low forward voltage DO-24AC (SMA) MAJOR RATINGS AND CHARACTERISTICS I F(AV) 2 A V RRM 5 V to 2 V I FSM 35 A I R. µa V F. V t rr 25 ns E R 2 mj T j max. 5 C Soft recovery characteristic Ultra fast reverse recovery time Meets MSL level, per J-STD-2C, LF max peak of 26 C Solder Dip 26 C, 4 seconds Component in accordance to RoHS 22/95/EC and WEEE 22/96/EC TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer, automotive and telecommunication. MECHANICAL DATA Case: DO-24AC (SMA) Epoxy meets UL 94V- flammability rating Terminals: Matte tin plated leads, solderable per J-STD-2B and JESD22-B2D E3 suffix for commercial grade, HE3 suffix for high reliability grade (AEC Q qualified) Polarity: Color band denotes the cathode end MAXIMUM RATINGS (T A = 25 C unless otherwise noted) PARAMETER SYMBOL BYG22A BYG22B BYG22D UNIT Device marking code BYG22A BYG22B BYG22D Maximum repetitive peak reverse voltage V RRM 5 2 V Average forward current I F(AV) 2. A Peak forward surge current ms single half sine-wave superimposed on rated load I FSM 35 A Pulse energy in avalanche mode, non repetitive (inductive load switch off) I (BR)R = A, T j = 25 C E R 2 mj Operating junction and storage temperature range T J, T STG - 55 to + 5 C Revision: 3-Jul-7

Average ELECTRICAL CHARACTERISTICS (T A = 25 C unless otherwise noted) PARAMETER TEST CONDITIONS SYMBOL BYG22A BYG22B BYG22D UNIT Maximum instantaneous forward voltage () Maximum reverse current Maximum reverse recovery time at I F = A I F = 2. A at V R = V RRM T j = 25 C T j = C I F =.5 A, I R =. A, I rr =.25 A () Pulse test: 3 µs pulse width, % duty cycle () Mounted on epoxy-glass hard tissue (2) Mounted on epoxy-glass hard tissue, 5 mm 2 35 µm Cu (3) Mounted on Al-oxide-ceramic (Al 2 O 3 ), 5 mm 2 35 µm Cu () Automotive grade AEC Q qualified T j = 25 C V F.. I R THERMAL CHARACTERISTICS (T A = 25 C unless otherwise noted) t rr 25 ns PARAMETER SYMBOL BYG22A BYG22B BYG22D UNIT Maximum thermal resistance - junction lead T L = const. R θjl 25 C/W Maximum thermal resistance - junction ambient ORDERING INFORMATION (Example) R θja V µa 5 () 25 (2) (3) C/W PREFERRED P/N UNIT WEIGHT (g) PACKAGE CODE BASE QUANTITY DELIVERY MODE BYG22A-E3/TR.64 TR 8 7" Diameter Plastic Tape & Reel BYG22A-E3/TR3.64 TR3 75 3" Diameter Plastic Tape & Reel BYG22AHE3/TR ().64 TR 8 7" Diameter Plastic Tape & Reel BYG22AHE3/TR3 ().64 TR3 75 3" Diameter Plastic Tape & Reel RATINGS AND CHARACTERISTICS CURVES (T A = 25 C unless otherwise noted). 2.5... Tj = 5 C Tj = 25 C 2..5..5 RthJA 25 K/W RthJA 25 K/W half sine-wave RthJA 5 K/W...2.4.6.8..2.4.6.8 Forward Voltage (V) Figure. Forward Current vs. Forward Voltage. 2 4 6 8 2 4 6 Ambient Temperature ( C) Figure 2. Max. Average Forward Current vs. Ambient Temperature 2 Revision: 3-Jul-7

Diode Capacitance (pf) 4 Reverse Current (µa) 25 5 75 25 5 Junction Temperature ( C) Reverse Recovery Time (ns) Tamb = 25 C 2 Tamb = C Tamb = 75 C 8 Tamb = 5 C 6 4 Tamb = 25 C 2 IR =.5 A, ir =.25 A.2.4.6.8. Figure 3. Reverse Current vs. Junction Temperature Figure 6. Max. Reverse Recovery Time vs. Forward Current 5 6 Reverse Power Dissipation (mw) 4 3 2 PR - Limit at 8 % VR PR - Limit at % VR 25 5 75 25 5 Junction Temperature ( C) Reverse Recovery Charge (nc) 5 4 3 2 Tamb = 25 C Tamb = C Tamb = 75 C Tamb = 5 C Tamb = 25 C IR =.5 A, ir =.25 A.2.4.6.8. Figure 4. Max. Reverse Power Dissipation vs. Junction Temperature Figure 7. Max. Reverse Recovery Charge vs. Forward Current 7 f = MHz 6 5 4 3 2.. Reverse Voltage (V) Thermal Resistance for Pulse Cond. (K/W) 25 K/W DC tp/t =.5 tp/t =.2 tp/t =. tp/t =.5 tp/t =.2 Single Pulse tp/t =. -5-4 -3-2 - 2 Pulse Length (s) Figure 5. Diode Capacitance vs. Reverse Voltage Figure 8. Thermal Response Revision: 3-Jul-7 3

PACKAGE OUTLINE DIMENSIONS in inches (millimeters) DO-24AC (SMA) Cathode Band Mounting Pad Layout.65 (.65).49 (.25). (2.79). (2.54).66 MIN. (.68 MIN.).74 MAX. (.88 MAX.).77 (4.5).57 (3.99).2 (.35).6 (.52).6 MIN. (.52 MIN.).9 (2.29).78 (.98).28 (5.28) REF.6 (.52).3 (.76).8 (.23) ().28 (5.28).94 (4.93) 4 Revision: 3-Jul-7

Notice Legal Disclaimer Notice Vishay Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale. Document Number: 9 Revision: 8-Apr-5