Electrical Characteristics (T A =25 unless otherwise noted) Off Characteristics Parameter Symbol Condition Min Typ Max Unit Drain-Source Breakdown Vol

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N-Channel Enhancement Mode Power MOSFET Description The HM uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of applications. General Features V DS =20V,I D =15A R DS(ON) <10mΩ @ V GS =10V (Typ:8.0mΩ) Schematic diagram High density cell design for ultra low Rdson Fully characterized avalanche voltage and current Good stability and uniformity with high E AS Excellent package for good heat dissipation Special process technology for high ESD capability Application Power switching application Load switching Uninterruptible power supply Pin Assignment 100% UIS TESTED! 100% Vds TESTED! DFN 3.3x3.3 EP top view Package Marking and Ordering Information Device Marking Device Device Package Reel Size Tape width Quantity HM HM - - - Absolute Maximum Ratings (T A =25 unless otherwise noted) Parameter Symbol Limit Unit Drain-Source Voltage VDS 20 V Gate-Source Voltage VGS ±12 V Drain Current-Continuous I D 15 A Drain Current-Continuous(T C =100 ) I D (100 ) 10 A Pulsed Drain Current I DM 45 A Maximum Power Dissipation P D 40 W Single pulse avalanche energy (Note 5) E AS 150 mj Operating Junction and Storage Temperature Range T J,T STG -55 To 175 Thermal Characteristic Thermal Resistance,Junction-to-Case (Note 2) R θjc 3.8 /W

Electrical Characteristics (T A =25 unless otherwise noted) Off Characteristics Parameter Symbol Condition Min Typ Max Unit Drain-Source Breakdown Voltage BV DSS V GS =0V I D =250μA 20 - - V Zero Gate Voltage Drain Current I DSS V DS =20V,V GS =0V - - 1 μa Gate-Body Leakage Current I GSS V GS =±12V,V DS =0V - - ±100 na (Note 3) On Characteristics Gate Threshold Voltage V GS(th) V DS =V GS,I D =250μA 0.5 0.7 1.2 V Drain-Source On-State Resistance R DS(ON) V GS =10V, I D =20A - 8 10 mω Forward Transconductance g FS V DS =5V,I D =20A 10 - - S Dynamic Characteristics (Note4) Input Capacitance C lss 900 PF V DS =10V,V GS =0V, Output Capacitance C oss 162 PF F=1.0MHz Reverse Transfer Capacitance 105 PF (Note 4) Switching Characteristics C rss HM Turn-on Delay Time t d(on) - 4.5 - ns Turn-on Rise Time t r VGS=10V,VDS=10V - 9.2 - ns Turn-Off Delay Time t d(off) RL=0. 5Ω,RGEN=3Ω - 18.7 - ns Turn-Off Fall Time t f - 3.3 - ns Total Gate Charge Q g 15 nc Gate-Source Charge Q gs VGS=10V,VDS=10V,ID=20A 1.8 nc Gate-Drain Charge Q gd 2.8 nc Drain-Source Diode Characteristics Diode Forward Voltage (Note 3) V SD V GS =0V,I S =20A - - 1.2 V Diode Forward Current (Note 2) I S - - - 15 A Reverse Recovery Time t rr TJ = 25 C, IF = 20A - 18 - ns Reverse Recovery Charge Qrr di/dt = 100A/μs (Note3) - 9.5 - nc Forward Turn-On Time t on Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on FR4 Board, t 10 sec. 3. Pulse Test: Pulse Width 300μs, Duty Cycle 2%. 4. Guaranteed by design, not subject to production 5. EAS condition:tj=25,v DD =10V,V G =10V,L=0.5mH,Rg=25Ω

Test circuit 1)E AS test Circuits 2)Gate charge test Circuit: 3)Switch Time Test Circuit:

Typical Electrical and Thermal Characteristics (Curves) Rdson On-Resistance(mΩ) ID- Drain Current (A) ID- Drain Current (A) Vds Drain-Source Voltage (V) Figure 1 Output Characteristics Vgs Gate-Source Voltage (V) Figure 2 Transfer Characteristics Normalized On-Resistance Vgs Gate-Source Voltage (V) Is- Reverse Drain Current (A) T J -Junction Temperature( ) Figure 4 Rdson-Junction Temperature Qg Gate Charge (nc) Figure 5 Gate Charge I D - Drain Current (A) Figure 3 Rdson- Drain Current Vsd Source-Drain Voltage (V) Figure 6 Source- Drain Diode Forward

C Capacitance (pf) Power Dissipation (W) Vds Drain-Source Voltage (V) Figure 7 Capacitance vs Vds T J -Junction Temperature( ) Figure 9 Power De-rating ID- Drain Current (A) ID- Drain Current (A) Vds Drain-Source Voltage (V) Figure 8 Safe Operation Area T J -Junction Temperature( ) Figure 10 Current De-rating r(t),normalized Effective Transient Thermal Impedance Square Wave Pluse Duration(sec) Figure 11 Normalized Maximum Transient Thermal Impedance

DFN3.3X3.3 EP Package Information